Impedance

Industry

CPC
H01L2924/3011

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/3011Impedance

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Coaxial probe
- Patent number 12,111,343
- Issue date Oct 8, 2024
- Xcerra Corporation
- Yukang Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Device packages with uniform components and methods of forming the...
- Patent number 12,074,149
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrical, mechanical, computing, and/or other devices formed of e...
- Patent number 12,063,874
- Issue date Aug 13, 2024
- Ambature, Inc.
- Douglas J. Gilbert
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Package design scheme for enabling high-speed low-loss signaling an...
- Patent number 12,057,413
- Issue date Aug 6, 2024
- Intel Corporation
- Lijiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,027,518
- Issue date Jul 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number RE49986
- Issue date May 28, 2024
- Sony Group Corporation
- Hiromi Ogata
Information Patent Grant
Multi-die memory device
- Patent number 11,990,177
- Issue date May 21, 2024
- RAMBUS INC.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Grant
High-frequency power transistor and high-frequency power amplifier
- Patent number 11,984,413
- Issue date May 14, 2024
- FERDINAND-BRAUN-INSTITUT GGMBH, LEIBNIZ-INSTITUT FÜR HÖCHSTFREQUENZTECHNIK
- Olof Bengtsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 11,984,445
- Issue date May 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 11,967,548
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Launch structures for radio frequency integrated device packages
- Patent number 11,894,322
- Issue date Feb 6, 2024
- Analog Devices, Inc.
- Bruce E. Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Group III nitride-based radio frequency amplifiers having back side...
- Patent number 11,837,559
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 11,830,787
- Issue date Nov 28, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,830,757
- Issue date Nov 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,804,396
- Issue date Oct 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Information handling system with split trace for high speed routing
- Patent number 11,805,594
- Issue date Oct 31, 2023
- Dell Products L.P.
- Sandor Farkas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240304617
- Publication date Sep 12, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240222368
- Publication date Jul 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
- Publication number 20240213073
- Publication date Jun 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240178040
- Publication date May 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240170319
- Publication date May 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240120332
- Publication date Apr 11, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...
- Publication number 20240096802
- Publication date Mar 21, 2024
- NVIDIA Corporation
- Shawn Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES
- Publication number 20240079318
- Publication date Mar 7, 2024
- Western Digital Technologies, Inc.
- Md. Sayed Mobin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030089
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS
- Publication number 20230402515
- Publication date Dec 14, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230282624
- Publication date Sep 7, 2023
- Samsung Electronics Co., Ltd.
- BONG WEE YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20230275061
- Publication date Aug 31, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY CIRCUIT
- Publication number 20230223363
- Publication date Jul 13, 2023
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20230187424
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230107764
- Publication date Apr 6, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Akira SAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...
- Publication number 20230091513
- Publication date Mar 23, 2023
- SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...
- Publication number 20230082556
- Publication date Mar 16, 2023
- Canon Kabushiki Kaisha
- Masayoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME
- Publication number 20220415867
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING SEMICONDUCTOR RESISTOR AND TANTAL...
- Publication number 20220393653
- Publication date Dec 8, 2022
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20220328474
- Publication date Oct 13, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DEVICE PACKAGES WITH UNIFORM COMPONENTS AND METHODS OF FORMING THE...
- Publication number 20220254762
- Publication date Aug 11, 2022
- Cree, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE MEMORY DEVICE
- Publication number 20220139446
- Publication date May 5, 2022
- Rambus Inc.
- Scott C. Best
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE ROUTING FOR CROSSTALK REDUCTION IN HIGH FREQUENCY COMMUNICA...
- Publication number 20220122929
- Publication date Apr 21, 2022
- Intel Corporation
- Xiang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM
- Publication number 20220115268
- Publication date Apr 14, 2022
- Gula Consulting Limited Liability Company
- Ernest E. Hollis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220108935
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

3D semiconductor device and structure with single-crystal layers

3D semiconductor device and structure with metal layers and memory...

Coaxial probe

Methods for producing a 3D semiconductor device and structure with...

Device packages with uniform components and methods of forming the...

3D semiconductor device and structure with bonding and DRAM memory...

Electrical, mechanical, computing, and/or other devices formed of e...

Package design scheme for enabling high-speed low-loss signaling an...

Shielded electronic component package

Methods for producing a 3D semiconductor device and structure with...

3D semiconductor devices and structures with metal layers

Impedance controlled electrical interconnection employing meta-mate...

Semiconductor integrated circuit

Multi-die memory device

High-frequency power transistor and high-frequency power amplifier

Radio frequency transmission line with finish plating on conductive...

3D semiconductor devices and structures with metal layers

Assembly including plural through wafer vias, method of cooling the...

3D semiconductor device and structure with bonding

3D semiconductor device and structure with memory

Launch structures for radio frequency integrated device packages

3D semiconductor device and structure with single-crystal layers

Method for producing a 3D semiconductor device and structure with m...

Methods for producing a 3D semiconductor device and structure with...

Group III nitride-based radio frequency amplifiers having back side...

Thermal management in integrated circuit packages

3D semiconductor device and structure with bonding

Methods for producing a 3D semiconductor device and structure with...

Information handling system with split trace for high speed routing

Patents Applicationslast 30 patents

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

REVERSE EMBEDDED POWER STRUCTURE FOR GRAPHICAL PROCESSING UNIT CHIP...

NAND DIE WITH RDL FOR ALTERED BOND WIRE BANDWIDTH IN MEMORY DEVICES

DOHERTY AMPLIFIERS

SEMICONDUCTOR PACKAGE

METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

INTEGRATED CIRCUIT CHIP AND SEMICONDUCTOR PACKAGE

SHIELDED ELECTRONIC COMPONENT PACKAGE

HIGH FREQUENCY CIRCUIT

FAN-OUT SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WAFER-LEVEL CHIP STRUCTURE, MULTIPLE-CHIP STACKED AND INTERCONNECTE...

DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME

POWER AMPLIFIER MODULES INCLUDING SEMICONDUCTOR RESISTOR AND TANTAL...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

DEVICE PACKAGES WITH UNIFORM COMPONENTS AND METHODS OF FORMING THE...

MULTI-DIE MEMORY DEVICE

PACKAGE ROUTING FOR CROSSTALK REDUCTION IN HIGH FREQUENCY COMMUNICA...

HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM

SEMICONDUCTOR PACKAGE