in a fluid

Industry

CPC
H01L2224/75655

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75655in a fluid

Industries

Patents Grantslast 30 patents

Information Patent Grant
Device and method of fluidic assembly of microchips on a substrate
- Patent number 11,942,450
- Issue date Mar 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method for aligning dipoles and method of fabrica...
- Patent number 11,728,196
- Issue date Aug 15, 2023
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly apparatus for assembling semiconductor light emitting diod...
- Patent number 11,502,055
- Issue date Nov 15, 2022
- LG Electronics Inc.
- Hyunwoo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid-suspended microcomponent harvest, distribution, and reclamation
- Patent number 10,242,977
- Issue date Mar 26, 2019
- eLux, Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED chip mounting apparatus and method of manufacturing display app...
- Patent number 10,109,658
- Issue date Oct 23, 2018
- Samsung Display Co., Ltd.
- Changyong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for disposing fine objects, apparatus for arranging fine obj...
- Patent number 9,181,630
- Issue date Nov 10, 2015
- Sharp Kabushiki Kaisha
- Akihide Shibata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...
- Publication number 20240258270
- Publication date Aug 1, 2024
- LG Display Co., Ltd.
- Sunghwan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE
- Publication number 20220165702
- Publication date May 26, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20220005719
- Publication date Jan 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY APPARATUS FOR ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIOD...
- Publication number 20200279826
- Publication date Sep 3, 2020
- LG ELECTRONICS INC.
- Hyunwoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation
- Publication number 20180102352
- Publication date Apr 12, 2018
- eLux Inc.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluidic Self Assembly of Contact Materials
- Publication number 20180076168
- Publication date Mar 15, 2018
- Sharp Laboratories of America, Inc.
- LISA H. STECKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CHIP MOUNTING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APP...
- Publication number 20170278835
- Publication date Sep 28, 2017
- SAMSUNG DISPLAY CO., LTD.
- Changyong JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DISPOSING FINE OBJECTS, APPARATUS FOR ARRANGING FINE OBJ...
- Publication number 20130168708
- Publication date Jul 4, 2013
- Sharp Kabushiki Kaisha
- Akihide Shibata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method of fluidic assembly of microchips on a substrate

Apparatus for and method for aligning dipoles and method of fabrica...

Assembly apparatus for assembling semiconductor light emitting diod...

Fluid-suspended microcomponent harvest, distribution, and reclamation

LED chip mounting apparatus and method of manufacturing display app...

Light emitting diodes and a method of packaging the same

Light emitting diodes and a method of packaging the same

Method for disposing fine objects, apparatus for arranging fine obj...

Patents Applicationslast 30 patents

SELF-ASSEMBLY DONOR AND METHOD FOR MANUFACTURING DISPLAY DEVICE USI...

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

ASSEMBLY APPARATUS FOR ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIOD...

Fluid-Suspended Microcomponent Harvest, Distribution, and Reclamation

Fluidic Self Assembly of Contact Materials

LED CHIP MOUNTING APPARATUS AND METHOD OF MANUFACTURING DISPLAY APP...

METHOD FOR DISPOSING FINE OBJECTS, APPARATUS FOR ARRANGING FINE OBJ...