in a mirrored arrangement on two different side of a common die mounting substrate

Industry

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H01L2924/19106

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19106in a mirrored arrangement on two different side of a common die mounting substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
- Patent number 11,961,805
- Issue date Apr 16, 2024
- Skyworks Solutions, Inc.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,439
- Issue date Mar 26, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,433
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,932,933
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package with an antenna substrate
- Patent number 11,935,849
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a trench in a passivation layer
- Patent number 11,923,314
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Ik Kyu Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures for semiconductor packages and methods of...
- Patent number 11,923,207
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacture
- Patent number 11,894,312
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,469
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
- Patent number 11,837,552
- Issue date Dec 5, 2023
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with flexibility in capacitor design for powe...
- Patent number 11,804,826
- Issue date Oct 31, 2023
- MediaTek Singapore Pte Ltd.
- Zhigang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and packaging method of digital circuit
- Patent number 11,791,232
- Issue date Oct 17, 2023
- THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Bo Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a substrate, a semiconductor device...
- Patent number 11,728,319
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Sang-Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having discrete antenna device
- Patent number 11,721,882
- Issue date Aug 8, 2023
- Mediatek Inc.
- Fu-Yi Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 11,716,813
- Issue date Aug 1, 2023
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and method of manufacture
- Patent number 11,688,693
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures for semiconductor packages and methods of...
- Patent number 11,670,519
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,652,088
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna module
- Patent number 11,581,275
- Issue date Feb 14, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,569,209
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Sangsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 11,532,569
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Pin Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with an antenna substrate
- Patent number 11,527,495
- Issue date Dec 13, 2022
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,508,671
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package (SiP) semiconductor package
- Patent number 11,508,639
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module installation on printed circuit boards with embedded trace t...
- Patent number 11,502,010
- Issue date Nov 15, 2022
- Intel Corporation
- Quan Qi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,488,909
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,488,934
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a package substrate
- Patent number 11,443,970
- Issue date Sep 13, 2022
- Intel Corporation
- Manohar S. Konchady
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE
- Publication number 20240136299
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120280
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240087903
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING DEVICE USING BRIDGE AND METHOD OF MANUFACTURING F...
- Publication number 20240014111
- Publication date Jan 11, 2024
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...
- Publication number 20240006391
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Sangho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOS...
- Publication number 20230387078
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fong-yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
- Publication number 20230268196
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230115957
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- KIJU LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...
- Publication number 20230075019
- Publication date Mar 9, 2023
- SMOLTEK AB
- M Shafiqul Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230043512
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415815
- Publication date Dec 29, 2022
- Intel Corporation
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES
- Publication number 20220415814
- Publication date Dec 29, 2022
- Bernd Waidhas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVATION OF DYNAMIC FILTER GENERATION FOR MESSAGE MANAGEMENT SYST...
- Publication number 20220392775
- Publication date Dec 8, 2022
- DROPBOX, INC.
- Adam Cue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20220364222
- Publication date Nov 17, 2022
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Packages and Method of Manufacture
- Publication number 20220359406
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20220346235
- Publication date Oct 27, 2022
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH FAN-OUT FEATURE
- Publication number 20220310468
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220278055
- Publication date Sep 1, 2022
- MEDIATEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220223424
- Publication date Jul 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...
- Publication number 20220181289
- Publication date Jun 9, 2022
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220139839
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068895
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- SANGSOO KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A TRENCH IN A PASSIVATION LAYER
- Publication number 20210398908
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Ik Kyu JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210398923
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...
- Publication number 20210366883
- Publication date Nov 25, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES
- Publication number 20210335718
- Publication date Oct 28, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
- Publication number 20210327726
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20210301390
- Publication date Sep 30, 2021
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210280524
- Publication date Sep 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210193582
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

in a mirrored arrangement on two different side of a common die mounting substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices and methods related to dual-sided radio-frequency package w...

Semiconductor package structure

Integrated circuit package and method

Cooling device and process for cooling double-sided SiP devices dur...

Semiconductor package with an antenna substrate

Semiconductor package including a trench in a passivation layer

Redistribution structures for semiconductor packages and methods of...

Semiconductor packages and method of manufacture

Package structure and method of manufacturing the same

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor package with layer structures, antenna layer and elec...

Semiconductor devices with flexibility in capacitor design for powe...

Packaging structure and packaging method of digital circuit

Semiconductor package including a substrate, a semiconductor device...

Semiconductor package having discrete antenna device

Module

Semiconductor packages and method of manufacture

System-in-package with double-sided molding

Redistribution structures for semiconductor packages and methods of...

Semiconductor device and method of forming embedded die substrate,...

Antenna module

Semiconductor package

Method for manufacturing semiconductor package structure

Semiconductor package with an antenna substrate

Semiconductor package and manufacturing method thereof

System in package (SiP) semiconductor package

Module installation on printed circuit boards with embedded trace t...

Package structure

Semiconductor package and manufacturing method thereof

Methods of forming a package substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

FAN-OUT PACKAGING DEVICE USING BRIDGE AND METHOD OF MANUFACTURING F...

PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...

SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE DEVICE HAVING OPPOS...

Redistribution Structures for Semiconductor Packages and Methods of...

SEMICONDUCTOR PACKAGES

ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACIT...

PACKAGE STRUCTURE

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

MICROELECTRONIC ASSEMBLIES HAVING TOPSIDE POWER DELIVERY STRUCTURES

ACTIVATION OF DYNAMIC FILTER GENERATION FOR MESSAGE MANAGEMENT SYST...

Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...

Semiconductor Packages and Method of Manufacture

MODULE

PACKAGE STRUCTURE WITH FAN-OUT FEATURE

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

THROUGH-SUBSTRATE UNDERFILL FORMATION FOR AN INTEGRATED CIRCUIT ASS...

Integrated Circuit Package and Method

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A TRENCH IN A PASSIVATION LAYER

SEMICONDUCTOR PACKAGE

INTEGRATING SYSTEM IN PACKAGE (SIP) WITH INPUT/OUTPUT (IO) BOARD FO...

OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES

Redistribution Structures for Semiconductor Packages and Methods of...

Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...

PACKAGE STRUCTURE

Integrated Circuit Package and Method