in a rotary movement only, about an axis being stationary during lapping

Industry

CPC
B24B37/107

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/107in a rotary movement only, about an axis being stationary during lapping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 12,122,012
- Issue date Oct 22, 2024
- II-VI DELAWARE, INC.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 12,103,133
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Elastic membrane, substrate holding device, and polishing apparatus
- Patent number 12,068,189
- Issue date Aug 20, 2024
- Ebara Corporation
- Satoru Yamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing system with a potentiostat and pulsed...
- Patent number 12,011,800
- Issue date Jun 18, 2024
- BRUKER NANO INC.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for chemical mechanical polishing and forming interconnect...
- Patent number 12,002,684
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 11,964,358
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for polishing and method of polishing
- Patent number 11,926,018
- Issue date Mar 12, 2024
- Ebara Corporation
- Masayoshi Ito
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for CMP temperature control
- Patent number 11,919,123
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,887,869
- Issue date Jan 30, 2024
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Polishing apparatus
- Patent number 11,858,088
- Issue date Jan 2, 2024
- Disco Corporation
- Toshiyuki Moriya
- B24 - GRINDING POLISHING
Information Patent Grant
Asymmetry correction via variable relative velocity of a wafer
- Patent number 11,764,069
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Polyurethane polishing pad and composition for manufacturing the same
- Patent number 11,717,932
- Issue date Aug 8, 2023
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Kwang-Bok Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Fabrication of a polishing pad for chemical mechanical polishing
- Patent number 11,697,183
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Hsuan Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical-mechanical polishing apparatus
- Patent number 11,679,467
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing and method for polishing
- Patent number 11,642,755
- Issue date May 9, 2023
- Ebara Corporation
- Pohan Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Silicon wafer single-side polishing method
- Patent number 11,628,534
- Issue date Apr 18, 2023
- Sumco Corporation
- Toshiharu Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machine for finishing a work piece, and having a highly controllabl...
- Patent number 11,623,319
- Issue date Apr 11, 2023
- II-VI DELAWARE, INC.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device, method, and tool of manufacture
- Patent number 11,621,342
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Hung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,612,983
- Issue date Mar 28, 2023
- Ebara Corporation
- Hiroshi Sotozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, wafer polishing apparatus using the same, and wafer...
- Patent number 11,554,458
- Issue date Jan 17, 2023
- Sumco Corporation
- Yuki Nakano
- B24 - GRINDING POLISHING
Information Patent Grant
Methods for chemical mechanical polishing and forming interconnect...
- Patent number 11,508,585
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing and method for polishing
- Patent number 11,413,723
- Issue date Aug 16, 2022
- Ebara Corporation
- Pohan Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,413,720
- Issue date Aug 16, 2022
- Ebara Corporation
- Nobuyuki Takahashi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate holding device and substrate processing apparatus includi...
- Patent number 11,396,082
- Issue date Jul 26, 2022
- Ebara Corporation
- Hiroaki Nishida
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus having scraping fixture
- Patent number 11,396,080
- Issue date Jul 26, 2022
- Yangtze Memory Technologies Co., Ltd.
- Lin Gao
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical-mechanical polishing system with a potentiostat and pulsed...
- Patent number 11,389,923
- Issue date Jul 19, 2022
- BRUKER NANO, INC.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,279,000
- Issue date Mar 22, 2022
- Disco Corporation
- Mamoru Kawana
- B24 - GRINDING POLISHING
Information Patent Grant
Non-transitory computer-readable storage medium storing a program o...
- Patent number 11,267,097
- Issue date Mar 8, 2022
- Ebara Corporation
- Kazuya Otsu
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,139,182
- Issue date Oct 5, 2021
- Tokyo Electron Limited
- Nobuhiko Mouri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical planarization system
- Patent number 11,103,970
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Co, , Ltd.
- Chun-Hsi Huang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...
- Publication number 20250018521
- Publication date Jan 16, 2025
- II-VI Delaware, Inc.
- Edward J. GRATRIX
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND A METHOD OF POLISHING A...
- Publication number 20240359286
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Donghoon KWON
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...
- Publication number 20240290629
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...
- Publication number 20240286242
- Publication date Aug 29, 2024
- Bruker Nano Inc.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROL...
- Publication number 20240238936
- Publication date Jul 18, 2024
- SMSUNG ELECTRONICS CO., LTD.
- Wonkeun CHO
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20240217054
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yu Wang
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240213046
- Publication date Jun 27, 2024
- TOKYO ELECTRON LIMITED
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Application
POLISHING HEAD, POLISHING APPARATUS, AND ELASTIC BODY
- Publication number 20240181595
- Publication date Jun 6, 2024
- KIOXIA Corporation
- Tomonori KAWASAKI
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20240157504
- Publication date May 16, 2024
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20240051080
- Publication date Feb 15, 2024
- EBARA CORPORATION
- Kohei OTA
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR SUBSTRATE GRINDING APPARATUS AND SEMICONDUCTOR SUBSTR...
- Publication number 20230373058
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- Donghoon KWON
- B08 - CLEANING
Information Patent Application
Fabrication of a Polishing Pad for Chemical Mechanical Polishing
- Publication number 20230347471
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Hsuan Lee
- B24 - GRINDING POLISHING
Information Patent Application
PLANE POLISHING MACHINE
- Publication number 20230321787
- Publication date Oct 12, 2023
- NORITAKE CO., LIMITED
- Makoto Sato
- B24 - GRINDING POLISHING
Information Patent Application
NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS
- Publication number 20230286106
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsi Huang
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS FOR SUBSTRATE AND POLISHING METHOD FOR SUBSTRAT...
- Publication number 20230286108
- Publication date Sep 14, 2023
- SAMSUNG ELECTRONICS CO., LTD.
- Donghoon Kwon
- B24 - GRINDING POLISHING
Information Patent Application
MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...
- Publication number 20230211453
- Publication date Jul 6, 2023
- II-VI Delaware, Inc.
- Edward J. GRATRIX
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...
- Publication number 20230082084
- Publication date Mar 16, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JI CUI
- B24 - GRINDING POLISHING
Information Patent Application
ASYMMETRY CORRECTION VIA VARIABLE RELATIVE VELOCITY OF A WAFER
- Publication number 20220379428
- Publication date Dec 1, 2022
- Applied Materials, Inc.
- Jimin ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURI...
- Publication number 20220371155
- Publication date Nov 24, 2022
- SKC solmics Co., Ltd.
- Sung Hoon YUN
- B24 - GRINDING POLISHING
Information Patent Application
MULTIPLE POLISHING HEADS WITH CROSS-ZONE PRESSURE ELEMENT DISTRIBUT...
- Publication number 20220362903
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Lung Lin
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...
- Publication number 20220324080
- Publication date Oct 13, 2022
- Bruker Nano Inc.
- Vladimir Gulkov
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20220305612
- Publication date Sep 29, 2022
- Disco Corporation
- Toshiyuki MORIYA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING SOLUTION, POLISHING APPARATUS, AND POLISHING METHOD
- Publication number 20220290009
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Mikiya SAKASHITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEXTURED GLASS-BASED ARTICLES WITH MULTIPLE HAZE LEVELS AND PROCESS...
- Publication number 20220169563
- Publication date Jun 2, 2022
- Corning Incorporated
- Shunda Denise Cannon Wilson
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
CMP MACHINE WITH IMPROVED THROUGHPUT AND PROCESS FLEXIBILITY
- Publication number 20220088744
- Publication date Mar 24, 2022
- AXUS TECHNOLOGY, LLC
- Daniel Ray Trojan
- B24 - GRINDING POLISHING
Information Patent Application
NOVEL AUTOMATED POLISHING SYSTEMS AND METHODS RELATING THERETO
- Publication number 20220055178
- Publication date Feb 24, 2022
- PHOENIX TECHNOLOGY SERVICES LLC
- Myung Ki KIM
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20210402555
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Surajit Kumar
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210398827
- Publication date Dec 23, 2021
- TOKYO ELECTRON LIMITED
- Nobuhiko Mouri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...
- Publication number 20210391186
- Publication date Dec 16, 2021
- Ji Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel chemical-mechanical polishing apparatus
- Publication number 20210370462
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Hsi Huang
- B24 - GRINDING POLISHING

in a rotary movement only, about an axis being stationary during lapping

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Machine for finishing a work piece, and having a highly controllabl...

Chemical-mechanical polishing apparatus

Elastic membrane, substrate holding device, and polishing apparatus

Chemical-mechanical polishing system with a potentiostat and pulsed...

Methods for chemical mechanical polishing and forming interconnect...

Chemical mechanical polishing apparatus and method

Apparatus for polishing and method of polishing

Apparatus and method for CMP temperature control

Substrate processing apparatus and substrate processing method

Polishing apparatus

Asymmetry correction via variable relative velocity of a wafer

Polyurethane polishing pad and composition for manufacturing the same

Fabrication of a polishing pad for chemical mechanical polishing

Chemical-mechanical polishing apparatus

Apparatus for polishing and method for polishing

Silicon wafer single-side polishing method

Machine for finishing a work piece, and having a highly controllabl...

Semiconductor device, method, and tool of manufacture

Polishing apparatus and polishing method

Polishing head, wafer polishing apparatus using the same, and wafer...

Methods for chemical mechanical polishing and forming interconnect...

Apparatus for polishing and method for polishing

Polishing apparatus

Substrate holding device and substrate processing apparatus includi...

Chemical mechanical polishing apparatus having scraping fixture

Chemical-mechanical polishing system with a potentiostat and pulsed...

Polishing apparatus

Non-transitory computer-readable storage medium storing a program o...

Substrate processing apparatus and substrate processing method

Chemical-mechanical planarization system

Patents Applicationslast 30 patents

MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...

CHEMICAL MECHANICAL POLISHING APPARATUS AND A METHOD OF POLISHING A...

METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...

CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...

CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD OF CONTROL...

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

POLISHING HEAD, POLISHING APPARATUS, AND ELASTIC BODY

APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SEMICONDUCTOR SUBSTRATE GRINDING APPARATUS AND SEMICONDUCTOR SUBSTR...

Fabrication of a Polishing Pad for Chemical Mechanical Polishing

PLANE POLISHING MACHINE

NOVEL CHEMICAL-MECHANICAL POLISHING APPARATUS

POLISHING APPARATUS FOR SUBSTRATE AND POLISHING METHOD FOR SUBSTRAT...

MACHINE FOR FINISHING A WORK PIECE, AND HAVING A HIGHLY CONTROLLABL...

METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...

ASYMMETRY CORRECTION VIA VARIABLE RELATIVE VELOCITY OF A WAFER

POLISHING PAD, MANUFACTURING METHOD THEREOF, METHOD FOR MANUFACTURI...

MULTIPLE POLISHING HEADS WITH CROSS-ZONE PRESSURE ELEMENT DISTRIBUT...

CHEMICAL-MECHANICAL POLISHING SYSTEM WITH A POTENTIOSTAT AND PULSED...

POLISHING APPARATUS

POLISHING SOLUTION, POLISHING APPARATUS, AND POLISHING METHOD

TEXTURED GLASS-BASED ARTICLES WITH MULTIPLE HAZE LEVELS AND PROCESS...

CMP MACHINE WITH IMPROVED THROUGHPUT AND PROCESS FLEXIBILITY

NOVEL AUTOMATED POLISHING SYSTEMS AND METHODS RELATING THERETO

APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHODS FOR CHEMICAL MECHANICAL POLISHING AND FORMING INTERCONNECT...

Novel chemical-mechanical polishing apparatus