in a side-by-side arrangement on a common die mounting substrate

Industry

CPC
H01L2924/19105

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/19105in a side-by-side arrangement on a common die mounting substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,742
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Regulator circuit package techniques
- Patent number 11,955,437
- Issue date Apr 9, 2024
- Analog Devices International Unlimited Company
- Leonard Shtargot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked semiconductors die assemblies
- Patent number 11,948,921
- Issue date Apr 2, 2024
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,439
- Issue date Mar 26, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-package wireless communication device
- Patent number 11,942,676
- Issue date Mar 26, 2024
- Tahoe Research, LTD.
- Mohamed A. Megahed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,932,933
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for physically detecting counterfeit electronics
- Patent number 11,908,811
- Issue date Feb 20, 2024
- NOKOMIS, INC.
- Walter J. Keller
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer power, converter with devices having reduced lateral cur...
- Patent number 11,908,844
- Issue date Feb 20, 2024
- pSemi Corporation
- David Giuliano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to radio-frequency switching devices having improve...
- Patent number 11,901,243
- Issue date Feb 13, 2024
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head and printer
- Patent number 11,897,261
- Issue date Feb 13, 2024
- Brother Kogyo Kabushiki Kaisha
- Toru Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,894,308
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with conductive element having cavities...
- Patent number 11,887,940
- Issue date Jan 30, 2024
- Intel Corporation
- Seok Ling Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging chip and chip package structure
- Patent number 11,881,415
- Issue date Jan 23, 2024
- Pep Innovation PTE Ltd.
- Hwee Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal transfer structures for semiconductor die assemblies
- Patent number 11,862,611
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Ed A. Schrock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having EMI shielding structure and related met...
- Patent number 11,855,000
- Issue date Dec 26, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Young Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
- Patent number 11,854,937
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging for RF transistor amplifiers
- Patent number 11,837,457
- Issue date Dec 5, 2023
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices with wireless charging means
- Patent number 11,837,517
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 11,837,556
- Issue date Dec 5, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
- Publication number 20240128254
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR AND METHOD FOR FORMING THE SAME
- Publication number 20240128196
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
- Publication number 20240112941
- Publication date Apr 4, 2024
- Masaaki TAKEKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20240113080
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
- Publication number 20240114794
- Publication date Apr 4, 2024
- Skyworks Solutions, Inc.
- Hardik Bhupendra MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240088114
- Publication date Mar 14, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyun Goo Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240072008
- Publication date Feb 29, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...
- Publication number 20240072022
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN
- Publication number 20240038635
- Publication date Feb 1, 2024
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030089
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT UNIT, AND METHOD...
- Publication number 20240021503
- Publication date Jan 18, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES
- Publication number 20230420435
- Publication date Dec 28, 2023
- Nichia Corporation.
- Kenji OZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230420428
- Publication date Dec 28, 2023
- ROHM CO., LTD.
- Yuji ISHIMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CIRCUIT FOR TRANSMITTING A SIGNAL
- Publication number 20230411368
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Toshihiko AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION
- Publication number 20230369272
- Publication date Nov 16, 2023
- NXP USA, Inc.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package Thermally Coupled to Passive Element
- Publication number 20230369160
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Warpage High Density Trench Capacitor
- Publication number 20230361166
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230360981
- Publication date Nov 9, 2023
- Murata Manufacturing Co., Ltd.
- Shota HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230352419
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method Forming Same
- Publication number 20230352463
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230343603
- Publication date Oct 26, 2023
- Siliconware Precision Industries CO, Ltd
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230335533
- Publication date Oct 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR MEASURE OF QUANTITY AND ASSOCIATED METHOD OF MANUFACT...
- Publication number 20230333145
- Publication date Oct 19, 2023
- HALL ELEMENT DEVICES (IP HOLDINGS) LIMITED
- Tomaz SLIVNIK
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR FORMING RESIN LAYER ON ELECTRON...
- Publication number 20230317538
- Publication date Oct 5, 2023
- MURATA MANUFACTURING CO., LTD.
- Naganori HIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20230317693
- Publication date Oct 5, 2023
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE
- Publication number 20230290750
- Publication date Sep 14, 2023
- Sumitomo Electric Industries, Ltd.
- Tatsuya HASHINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
- Publication date Sep 7, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS

in a side-by-side arrangement on a common die mounting substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power module semiconductor device and inverter equipment, and fabri...

Power module semiconductor device and inverter equipment, and fabri...

3DIC packaging with hot spot thermal management features

Semiconductor device and manufacturing method thereof

Microelectronic device assemblies and packages including multiple d...

Regulator circuit package techniques

Methods of forming stacked semiconductors die assemblies

Semiconductor package structure

Single-package wireless communication device

Cooling device and process for cooling double-sided SiP devices dur...

Semiconductor package with plurality of leads and sealing resin

System and method for physically detecting counterfeit electronics

Multilayer power, converter with devices having reduced lateral cur...

Methods related to radio-frequency switching devices having improve...

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device with integrated heat distribution and manufact...

Head and printer

Semiconductor package and method of manufacturing the same

Semiconductor device encapsulated by molding material attached to r...

Integrated circuit packages with conductive element having cavities...

Method of packaging chip and chip package structure

Thermal transfer structures for semiconductor die assemblies

Semiconductor device with discrete blocks

Stacked semiconductor die assemblies with support members and assoc...

Semiconductor device having EMI shielding structure and related met...

Power module apparatus, cooling structure, and electric vehicle or...

Semiconductor device and method of forming a 3D interposer system-i...

Packaging for RF transistor amplifiers

Packaged semiconductor devices with wireless charging means

Wire bonding method and apparatus for electromagnetic interference...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...

SEMICONDUCTOR AND METHOD FOR FORMING THE SAME

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...

Semiconductor Device with Discrete Blocks

DEVICES AND METHODS RELATED TO STACK ASSEMBLY

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

STACKED CAPACITORS FOR SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS...

DOHERTY AMPLIFIERS

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

SEMICONDUCTOR PACKAGE WITH PLURALITY OF LEADS AND SEALING RESIN

SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT UNIT, AND METHOD...

METHOD FOR MANUFACTURING LIGHT EMITTING DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING A CIRCUIT FOR TRANSMITTING A SIGNAL

HYBRID DEVICE ASSEMBLIES AND METHOD OF FABRICATION

Semiconductor Device Package Thermally Coupled to Passive Element

Low Warpage High Density Trench Capacitor

MODULE

SEMICONDUCTOR PACKAGES

Integrated Circuit Package and Method Forming Same

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

APPARATUS FOR MEASURE OF QUANTITY AND ASSOCIATED METHOD OF MANUFACT...

ELECTRONIC COMPONENT AND METHOD FOR FORMING RESIN LAYER ON ELECTRON...

DIE PACKAGE, IC PACKAGE AND MANUFACTURING PROCESS THEREOF

METHOD OF MANUFACTURING HIGH-FREQUENCY DEVICE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF