in a single layer of the multilayer substrate

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H01L2924/15173

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/15173in a single layer of the multilayer substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Connecting electronic components to substrates
- Patent number 12,094,811
- Issue date Sep 17, 2024
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,955,459
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flexible semiconductor device with graphene tape
- Patent number 11,456,188
- Issue date Sep 27, 2022
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having thermal through vias (TTV)
- Patent number 11,373,922
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,270,976
- Issue date Mar 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film and display including the same
- Patent number 11,189,207
- Issue date Nov 30, 2021
- LG Display Co., Ltd.
- Jaesung Jeon
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package
- Patent number 10,985,091
- Issue date Apr 20, 2021
- Samsung Electronics Co., Ltd.
- Daeyeun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency component
- Patent number 10,912,188
- Issue date Feb 2, 2021
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for a package substrate
- Patent number 10,903,127
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- So Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip-on-film and display including the same
- Patent number 10,789,869
- Issue date Sep 29, 2020
- LG Display Co., Ltd.
- Jaesung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable phased array package
- Patent number 10,784,563
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Xiaoxiong Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package for improving freedom of arrangement of...
- Patent number 10,714,402
- Issue date Jul 14, 2020
- Sony Corporation
- Hiroyuki Shigeta
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Film for package substrate, semiconductor package, display device,...
- Patent number 10,699,974
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- So Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor device with graphene tape
- Patent number 10,692,802
- Issue date Jun 23, 2020
- NXP USA, INC.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,658,304
- Issue date May 19, 2020
- Rohm Co., Ltd.
- Hideaki Yanagida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth memory package for high performance processors
- Patent number 10,658,322
- Issue date May 19, 2020
- Google LLC
- Woon Seong Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having an electro-magnetic interference shie...
- Patent number 10,615,129
- Issue date Apr 7, 2020
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,340,253
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave integrated circuit with ball grid array package inc...
- Patent number 10,262,957
- Issue date Apr 16, 2019
- Texas Instruments Incorporated
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 10,157,870
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation through seal rings in 3DIC structure
- Patent number 10,115,653
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out structure with openings in buffer layer
- Patent number 9,799,581
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wu Sen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting member, electronic component, and method for manufacturing...
- Patent number 9,673,141
- Issue date Jun 6, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,613,922
- Issue date Apr 4, 2017
- Renesas Electronics Corporation
- Yoshiyuki Kado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with bonding wires of reduced loop inductance
- Patent number 9,595,489
- Issue date Mar 14, 2017
- Longitude Semiconductor S.a.r.l.
- Mitsuaki Katagiri
- G11 - INFORMATION STORAGE
Information Patent Grant
Package-in-package using through-hole via die on saw streets
- Patent number 9,524,938
- Issue date Dec 20, 2016
- STATS ChipPAC Pte. Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended redistribution layers bumped wafer
- Patent number 9,406,647
- Issue date Aug 2, 2016
- STATS ChipPAC Pte. Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 9,406,637
- Issue date Aug 2, 2016
- Aoi Electronics Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing multilayer circuit board
- Patent number 9,332,650
- Issue date May 3, 2016
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device grid array package
- Patent number 9,252,114
- Issue date Feb 2, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234372
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...
- Publication number 20220285241
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220189920
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-on-Film and Display Including the Same
- Publication number 20200394946
- Publication date Dec 17, 2020
- LG Display Co., Ltd.
- Jaesung JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ELECTRONIC COMPONENTS TO SUBSTRATES
- Publication number 20200328143
- Publication date Oct 15, 2020
- UNIQARTA, INC.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE
- Publication number 20200312751
- Publication date Oct 1, 2020
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200194348
- Publication date Jun 18, 2020
- Samsung Electronics Co., Ltd.
- Daeyeun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Bandwidth Memory Package For High Performance Processors
- Publication number 20200098715
- Publication date Mar 26, 2020
- Google LLC
- Woon Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190319008
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190096851
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Hang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...
- Publication number 20180301428
- Publication date Oct 18, 2018
- Rajen Manicon Murugan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Fan-Out Structure with Openings in Buffer Layer
- Publication number 20170012024
- Publication date Jan 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wu Sen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Optimizing Routing Layers and Board Space Req...
- Publication number 20140301056
- Publication date Oct 9, 2014
- BROADCOM CORPORATION
- Kevin L. SEAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20140239511
- Publication date Aug 28, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended Redistribution Layers Bumped Wafer
- Publication number 20140197540
- Publication date Jul 17, 2014
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140117541
- Publication date May 1, 2014
- RENESAS ELECTRONICS CORPORATION
- Yoshiyuki Kado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE
- Publication number 20140103542
- Publication date Apr 17, 2014
- ELPIDA MEMORY, INC.
- Mitsuaki KATAGIRI
- G11 - INFORMATION STORAGE
Information Patent Application
Thermal Dissipation Through Seal Rings in 3DIC Structure
- Publication number 20140084445
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130320571
- Publication date Dec 5, 2013
- Renesas Electronics Corporation
- Yoshiyuki Kado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20130320526
- Publication date Dec 5, 2013
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-in-Package Using Through-Hole Via Die on Saw Streets
- Publication number 20130214385
- Publication date Aug 22, 2013
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacturing the Same
- Publication number 20130161823
- Publication date Jun 27, 2013
- Panasonic Corporation
- Yoshiaki Shimizu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130147042
- Publication date Jun 13, 2013
- Elpida Memory, Inc.
- Yukitoshi HIROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20120292083
- Publication date Nov 22, 2012
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20120285736
- Publication date Nov 15, 2012
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120273946
- Publication date Nov 1, 2012
- Amkor Technology, Inc.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120264240
- Publication date Oct 18, 2012
- Renesas Electronics Corporation
- Yoshiyuki KADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE
- Publication number 20120119387
- Publication date May 17, 2012
- ELPIDA MEMORY, INC.
- Mitsuaki KATAGIRI
- G11 - INFORMATION STORAGE
Information Patent Application
Flexible Packaging for Chip-on-Chip and Package-on-Package Technolo...
- Publication number 20120083052
- Publication date Apr 5, 2012
- Vincent R. von Kaenel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND DEVICE PROVIDED WITH HEAT DISSIPATION M...
- Publication number 20120061849
- Publication date Mar 15, 2012
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS

in a single layer of the multilayer substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connecting electronic components to substrates

Package structure

Method of making flexible semiconductor device with graphene tape

Semiconductor packages having thermal through vias (TTV)

Package structure and method of manufacturing the same

Chip-on-film and display including the same

Semiconductor package

High-frequency component

Film for a package substrate

Chip-on-film and display including the same

Scalable phased array package

Semiconductor chip package for improving freedom of arrangement of...

Film for package substrate, semiconductor package, display device,...

Flexible semiconductor device with graphene tape

Semiconductor device and method for manufacturing the same

High bandwidth memory package for high performance processors

Semiconductor package having an electro-magnetic interference shie...

Package structure and method of manufacturing the same

Millimeter wave integrated circuit with ball grid array package inc...

Integrated fan-out package and method of fabricating the same

Thermal dissipation through seal rings in 3DIC structure

Integrated fan-out structure with openings in buffer layer

Mounting member, electronic component, and method for manufacturing...

Semiconductor device and manufacturing method thereof

Semiconductor package with bonding wires of reduced loop inductance

Package-in-package using through-hole via die on saw streets

Extended redistribution layers bumped wafer

Semiconductor construct and manufacturing method thereof as well as...

Method of producing multilayer circuit board

Semiconductor device grid array package

Patents Applicationslast 30 patents

METHOD OF FORMING PACKAGE STRUCTURE

METHOD OF FORMING SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIA...

PACKAGE STRUCTURE

Chip-on-Film and Display Including the Same

CONNECTING ELECTRONIC COMPONENTS TO SUBSTRATES

FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE

SEMICONDUCTOR PACKAGE

High Bandwidth Memory Package For High Performance Processors

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INC...

Integrated Fan-Out Structure with Openings in Buffer Layer

Method and System for Optimizing Routing Layers and Board Space Req...

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

Extended Redistribution Layers Bumped Wafer

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE

Thermal Dissipation Through Seal Rings in 3DIC Structure

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

Package-in-Package Using Through-Hole Via Die on Saw Streets

Semiconductor Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH BONDING WIRES OF REDUCED LOOP INDUCTANCE

Flexible Packaging for Chip-on-Chip and Package-on-Package Technolo...

SEMICONDUCTOR COMPONENT AND DEVICE PROVIDED WITH HEAT DISSIPATION M...