in combination with bipolar transistors

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CPC
H01L27/0623

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/0623in combination with bipolar transistors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Seal method to integrate non-volatile memory (NVM) into logic or bi...
- Patent number 12,144,173
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Bo Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual crystal orientation for semiconductor devices
- Patent number 12,094,786
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device integration schemes leveraging a bulk semiconductor substrat...
- Patent number 12,087,764
- Issue date Sep 10, 2024
- GLOBALFOUNDRIES U.S. INC.
- Mark Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 12,080,630
- Issue date Sep 3, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal field plates
- Patent number 12,068,376
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chien-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased isolation breakdown voltage
- Patent number 12,046,629
- Issue date Jul 23, 2024
- SK keyfoundry Inc.
- Yon Sup Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiled lateral thyristor
- Patent number 12,040,389
- Issue date Jul 16, 2024
- Silanna Asia Pte Ltd
- Vadim Kushner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 12,033,868
- Issue date Jul 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement with an integrated temperature sensor
- Patent number 12,021,139
- Issue date Jun 25, 2024
- Infineon Technologies AG
- Adrian Finney
- G01 - MEASURING TESTING
Information Patent Grant
Bipolar transistors with multilayer collectors
- Patent number 11,990,536
- Issue date May 21, 2024
- NXP B.V.
- Johannes Josephus Theodorus Marinus Donkers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin-based lateral bipolar junction transistor with reduced base res...
- Patent number 11,967,637
- Issue date Apr 23, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ali Razavieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a crystalline protective polysilicon layer
- Patent number 11,935,795
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar transistor with segmented emitter contacts
- Patent number 11,923,442
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Hiroshi Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,881,443
- Issue date Jan 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polysilicon structure including protective layer
- Patent number 11,855,086
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Shao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BCD device layout area defined by a deep trench isolation structure...
- Patent number 11,855,071
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an integrated circuit comprising a junctio...
- Patent number 11,830,776
- Issue date Nov 28, 2023
- STMicroelectronics (Crolles 2) SAS
- Jean Jimenez Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a microelectronic device
- Patent number 11,830,777
- Issue date Nov 28, 2023
- STMicroelectronics (Rousset) SAS
- Romeric Gay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an integrated circuit comprising an N-type...
- Patent number 11,823,947
- Issue date Nov 21, 2023
- STMicroelectronics (Crolles 2) SAS
- Jean Jimenez Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BiMOS semiconductor device
- Patent number 11,776,953
- Issue date Oct 3, 2023
- Honda Motor Co., Ltd.
- Yasuhiro Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with forced carrier extraction and metho...
- Patent number 11,764,209
- Issue date Sep 19, 2023
- MW RF Semiconductors, LLC
- Dumitru G. Sdrulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased isolation breakdown voltage
- Patent number 11,756,992
- Issue date Sep 12, 2023
- KEY FOUNDRY CO., LTD.
- Yon Sup Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable multi-turn magnetic coupling device
- Patent number 11,749,710
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao Chieh Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,735,501
- Issue date Aug 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices with well regions and methods for formin...
- Patent number 11,735,485
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,728,178
- Issue date Aug 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal method to integrate non-volatile memory (NVM) into logic or bi...
- Patent number 11,711,917
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Bo Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,694,944
- Issue date Jul 4, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical bipolar junction transistor and vertical field effect tran...
- Patent number 11,695,004
- Issue date Jul 4, 2023
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240405016
- Publication date Dec 5, 2024
- ROHM CO., LTD.
- Shinya UMEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240395802
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dai-Yan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SE...
- Publication number 20240379651
- Publication date Nov 14, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Peng GOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CRYSTAL ORIENTATION FOR SEMICONDUCTOR DEVICES
- Publication number 20240363444
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR TRANSISTOR
- Publication number 20240355913
- Publication date Oct 24, 2024
- STMicroelectronics International N.V.
- Pascal CHEVALIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332201
- Publication date Oct 3, 2024
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20240321591
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICE WITH DATA TRANSMISSION FROM A HIG...
- Publication number 20240304627
- Publication date Sep 12, 2024
- Infineon Technologies Austria AG
- Ralf RUDOLF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240274598
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED MATERIAL POWER DEVICES AND DRIVER CIRCUITS
- Publication number 20240223182
- Publication date Jul 4, 2024
- Cambridge GaN Devices Limited
- Florin Udrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INTEGRATION SCHEMES LEVERAGING A BULK SEMICONDUCTOR SUBSTRAT...
- Publication number 20240222366
- Publication date Jul 4, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mark Levy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A CRYSTALLINE PROTECTIVE POLYSILICON LAYER
- Publication number 20240222197
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng-Hung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROJUNCTION BIPOLAR TRANSISTOR, SEMICONDUCTOR DEVICE, AND COMMUN...
- Publication number 20240194770
- Publication date Jun 13, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki TSUTSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE OF SCHOTTKY DEVICES
- Publication number 20240178221
- Publication date May 30, 2024
- MEDIATEK INC.
- Shih-Chuan CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240170480
- Publication date May 23, 2024
- RENESAS ELECTRONICS CORPORATION
- Taishu OYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR JUNCTION TRANSISTOR ARRAYS
- Publication number 20240170560
- Publication date May 23, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Alexander Derrickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20240128165
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOLTAGE TRIGGERING SILICON CONTROLLED RECTIFIER
- Publication number 20240113209
- Publication date Apr 4, 2024
- Shanghai Huali Integrated Circuit Corporation
- Zhi Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, MEASUREMENT SYSTEM AND METHOD FOR DETER...
- Publication number 20240105837
- Publication date Mar 28, 2024
- INFINEON TECHNOLOGIES AG
- Ingo Dirnstorfer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER
- Publication number 20240096884
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Shao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BCD DEVICE LAYOUT AREA DEFINED BY A DEEP TRENCH ISOLATION STRUCTURE...
- Publication number 20240088125
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BCD DEVICE LAYOUT AREA DEFINED BY A DEEP TRENCH ISOLATION STRUCTURE...
- Publication number 20240021601
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yu YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH FORCED CARRIER EXTRACTION AND METHO...
- Publication number 20230420449
- Publication date Dec 28, 2023
- MW RF Semiconductors, LLC
- Dumitru G. Sdrulla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FIELD PLATES AND METHODS OF MAKING THE SAME
- Publication number 20230411463
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chien-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR-CMOS-DMOS SEMICONDUCTOR DEVICE HAVING A DEEP TRENCH ISOLATI...
- Publication number 20230387104
- Publication date Nov 30, 2023
- KEY FOUNDRY CO., LTD.
- Yon Sup PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INCREASED ISOLATION BREAKDOWN VOLTAGE
- Publication number 20230369391
- Publication date Nov 16, 2023
- KEY FOUNDRY CO., LTD.
- Yon Sup PANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230343603
- Publication date Oct 26, 2023
- Siliconware Precision Industries CO, Ltd
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230343679
- Publication date Oct 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20230335625
- Publication date Oct 19, 2023
- DYNEX SEMICONDUCTOR LIMITED
- Chunlin Zhu
- H01 - BASIC ELECTRIC ELEMENTS

in combination with bipolar transistors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Seal method to integrate non-volatile memory (NVM) into logic or bi...

Power amplifier modules including semiconductor resistor and tantal...

Dual crystal orientation for semiconductor devices

Device integration schemes leveraging a bulk semiconductor substrat...

3D semiconductor device and structure with metal layers and a conne...

Metal field plates

Semiconductor device with increased isolation breakdown voltage

Tiled lateral thyristor

Electronic package and method for fabricating the same

Semiconductor arrangement with an integrated temperature sensor

Bipolar transistors with multilayer collectors

Fin-based lateral bipolar junction transistor with reduced base res...

Method for forming a crystalline protective polysilicon layer

Bipolar transistor with segmented emitter contacts

3D semiconductor device and structure with metal layers and a conne...

Polysilicon structure including protective layer

BCD device layout area defined by a deep trench isolation structure...

Method for manufacturing an integrated circuit comprising a junctio...

Method for manufacturing a microelectronic device

Method for manufacturing an integrated circuit comprising an N-type...

BiMOS semiconductor device

Power semiconductor device with forced carrier extraction and metho...

Semiconductor device with increased isolation breakdown voltage

Adjustable multi-turn magnetic coupling device

3D semiconductor device and structure with metal layers and a conne...

Integrated circuit devices with well regions and methods for formin...

Method for fabricating electronic package

Seal method to integrate non-volatile memory (NVM) into logic or bi...

3D semiconductor device and structure with metal layers and a conne...

Vertical bipolar junction transistor and vertical field effect tran...

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE

DIODE-CONTAINING COMPONENT AND METHOD FOR MANUFACTURING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

DEVICE ISOLATION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SE...

DUAL CRYSTAL ORIENTATION FOR SEMICONDUCTOR DEVICES

BIPOLAR TRANSISTOR

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING ELECTRONIC PACKAGE

HIGH VOLTAGE SEMICONDUCTOR DEVICE WITH DATA TRANSMISSION FROM A HIG...

INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME

MIXED MATERIAL POWER DEVICES AND DRIVER CIRCUITS

DEVICE INTEGRATION SCHEMES LEVERAGING A BULK SEMICONDUCTOR SUBSTRAT...

METHOD FOR FORMING A CRYSTALLINE PROTECTIVE POLYSILICON LAYER

HETEROJUNCTION BIPOLAR TRANSISTOR, SEMICONDUCTOR DEVICE, AND COMMUN...

SEMICONDUCTOR STRUCTURE OF SCHOTTKY DEVICES

SEMICONDUCTOR DEVICE

BIPOLAR JUNCTION TRANSISTOR ARRAYS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

LOW VOLTAGE TRIGGERING SILICON CONTROLLED RECTIFIER

POWER SEMICONDUCTOR DEVICE, MEASUREMENT SYSTEM AND METHOD FOR DETER...

METHOD OF MAKING POLYSILICON STRUCTURE INCLUDING PROTECTIVE LAYER

BCD DEVICE LAYOUT AREA DEFINED BY A DEEP TRENCH ISOLATION STRUCTURE...

BCD DEVICE LAYOUT AREA DEFINED BY A DEEP TRENCH ISOLATION STRUCTURE...

POWER SEMICONDUCTOR DEVICE WITH FORCED CARRIER EXTRACTION AND METHO...

METAL FIELD PLATES AND METHODS OF MAKING THE SAME

BIPOLAR-CMOS-DMOS SEMICONDUCTOR DEVICE HAVING A DEEP TRENCH ISOLATI...

SEMICONDUCTOR DEVICE WITH INCREASED ISOLATION BREAKDOWN VOLTAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

POWER SEMICONDUCTOR DEVICE