in combination with jet impingement

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H01L23/4336

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4336in combination with jet impingement

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Technologies for liquid cooling systems
- Patent number 12,191,230
- Issue date Jan 7, 2025
- Intel Corporation
- Ralph W. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of electronics using co-located microjet nozzles...
- Patent number 12,100,643
- Issue date Sep 24, 2024
- JetCool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling solution including microchannel arrays and methods of formi...
- Patent number 11,901,262
- Issue date Feb 13, 2024
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Mobile phone and other compute device cooling architecture
- Patent number 11,830,789
- Issue date Nov 28, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Direct liquid micro jet (DLMJ) structures for addressing thermal pe...
- Patent number 11,804,418
- Issue date Oct 31, 2023
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and system for driving piezoelectric MEMS-based active cooli...
- Patent number 11,784,109
- Issue date Oct 10, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric MEMS-based active cooling for heat dissipation in com...
- Patent number 11,735,496
- Issue date Aug 22, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined architecture for cooling devices
- Patent number 11,710,678
- Issue date Jul 25, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Two-dimensional addessable array of piezoelectric MEMS-based active...
- Patent number 11,705,382
- Issue date Jul 18, 2023
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Mobile phone and other compute device cooling architecture
- Patent number 11,532,536
- Issue date Dec 20, 2022
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Cooling apparatus with expanding fluid jets
- Patent number 11,483,947
- Issue date Oct 25, 2022
- Motivair Corporation
- Rich S Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamber architecture for cooling devices
- Patent number 11,456,234
- Issue date Sep 27, 2022
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Mobile phone and other compute device cooling architecture
- Patent number 11,393,740
- Issue date Jul 19, 2022
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Two-dimensional addessable array of piezoelectric MEMS-based active...
- Patent number 11,043,444
- Issue date Jun 22, 2021
- Frore Systems Inc.
- Suryaprakash Ganti
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Two-dimensional addessable array of piezoelectric MEMS-based active...
- Patent number 10,998,254
- Issue date May 4, 2021
- Frore Systems Inc.
- Suryaprakash Ganti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink cooling with preferred synthetic jet cooling devices
- Patent number 10,629,514
- Issue date Apr 21, 2020
- OZYEGIN UNIVERSITESI
- Mehmet Arik
- F21 - LIGHTING
Information Patent Grant
Three-dimensional integrated circuit cooling system
- Patent number 10,424,560
- Issue date Sep 24, 2019
- Microjet Technology Co., Ltd.
- Li-Pang Mo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Air-cooling heat dissipation device
- Patent number 10,285,307
- Issue date May 7, 2019
- Microjet Technology Co., Ltd.
- Shih-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale cooling device having through-silicon vias and flow dire...
- Patent number 10,157,817
- Issue date Dec 18, 2018
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooler
- Patent number 10,147,669
- Issue date Dec 4, 2018
- Toyota Jidosha Kabushiki Kaisha
- Yuya Takano
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Low resonance acoustic synthetic jet structure
- Patent number 10,130,968
- Issue date Nov 20, 2018
- General Electric Company
- Hendrik Pieter Jacobus de Bock
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for enhanced convection cooling of temperature-de...
- Patent number 9,570,643
- Issue date Feb 14, 2017
- General Electric Company
- Kevin Sean Myers
- G05 - CONTROLLING REGULATING
Information Patent Grant
Thermal management solution for circuit products
- Patent number 9,477,275
- Issue date Oct 25, 2016
- Intel Corporation
- Arnab Choudhury
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Architecture for gas cooled parallel microchannel array cooler
- Patent number 9,455,213
- Issue date Sep 27, 2016
- Raytheon Company
- Scott T. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling assemblies and power electronics modules having multiple-po...
- Patent number 9,257,365
- Issue date Feb 9, 2016
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling facility for cooling a component
- Patent number 7,859,842
- Issue date Dec 28, 2010
- Siemens Aktiengesellschaft
- Klaus Busch
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermal management system for evaporative spray cooling
- Patent number 7,836,706
- Issue date Nov 23, 2010
- Parker Intangibles LLC
- Charles L. Tilton
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Impingement cooled heat sink with low pressure drop
- Patent number 7,597,135
- Issue date Oct 6, 2009
- Coolit Systems Inc.
- Debashis Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impingement cooled heat sink with uniformly spaced curved channels
- Patent number 7,269,011
- Issue date Sep 11, 2007
- Delphi Technologies, Inc.
- Mohinder Singh Bhatti
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device cooling assembly and method employing elastic sup...
- Patent number 7,206,203
- Issue date Apr 17, 2007
- International Business Machines Corporation
- Levi A. Campbell
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250105094
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...
- Publication number 20250079262
- Publication date Mar 6, 2025
- Intel Corporation
- Sami Mohammed Alelyani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240234247
- Publication date Jul 11, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240136252
- Publication date Apr 25, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
COOLING APPARATUS
- Publication number 20230180437
- Publication date Jun 8, 2023
- Motivair Corporation
- Rich S. Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Liquid Flow-Over Segmented Inset Lid
- Publication number 20230015149
- Publication date Jan 19, 2023
- Lockheed Martin Corporation
- Alexander John Silverman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS-BASED ACTIVE COOLING SYSTEMS
- Publication number 20220189852
- Publication date Jun 16, 2022
- Frore Systems Inc.
- Prabhu Sathyamurthy
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
MOBILE PHONE AND OTHER COMPUTE DEVICE COOLING ARCHITECTURE
- Publication number 20220139804
- Publication date May 5, 2022
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
COOLING APPARATUS WITH EXPANDING FLUID JETS
- Publication number 20220087061
- Publication date Mar 17, 2022
- Motivair Corporation
- Rich S. Whitmore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR LIQUID COOLING SYSTEMS
- Publication number 20210242108
- Publication date Aug 5, 2021
- Intel Corporation
- Ralph W. Jensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-DIMENSIONAL ADDESSABLE ARRAY OF PIEZOELECTRIC MEMS-BASED ACTIVE...
- Publication number 20210183743
- Publication date Jun 17, 2021
- Frore Systems Inc.
- Suryaprakash Ganti
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20210143084
- Publication date May 13, 2021
- Frore Systems Inc.
- Suryaprakash Ganti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...
- Publication number 20200243418
- Publication date Jul 30, 2020
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DIRECT LIQUID MICRO JET (DLMJ) STRUCTURES FOR ADDRESSING THERMAL PE...
- Publication number 20200227341
- Publication date Jul 16, 2020
- Intel Corporation
- Nicholas Neal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT SINK COOLING WITH PREFERRED SYNTHETIC JET COOLING DEVICES
- Publication number 20180061737
- Publication date Mar 1, 2018
- OZYEGIN UNIVERSITESI
- Mehmet ARIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Assemblies and Power Electronics Modules Having Multiple-Po...
- Publication number 20150009631
- Publication date Jan 8, 2015
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTION FOR CIRCUIT PRODUCTS
- Publication number 20140204534
- Publication date Jul 24, 2014
- Arnab Choudhury
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat dissipation system with a spray cooling device
- Publication number 20110277491
- Publication date Nov 17, 2011
- MicroBase Technology Group
- Ching-Ping Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING ARRANGEMENT
- Publication number 20110240260
- Publication date Oct 6, 2011
- Koninklijke Philips Electronics N.V.
- Leendert Van Der Tempel
- F21 - LIGHTING
Information Patent Application
ARCHITECTURE FOR GAS COOLED PARALLEL MICROCHANNEL ARRAY COOLER
- Publication number 20110048689
- Publication date Mar 3, 2011
- Scott T. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Module
- Publication number 20090321924
- Publication date Dec 31, 2009
- Hitachi, Ltd
- Sunao Funakoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling facility for cooling a component
- Publication number 20090231813
- Publication date Sep 17, 2009
- Siemens Aktiengesellschaft
- Klaus Busch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Impingement cooled heat sink with low pressure drop
- Publication number 20070272392
- Publication date Nov 29, 2007
- Debashis Ghosh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Active cooling device
- Publication number 20070028960
- Publication date Feb 8, 2007
- The University of Sydney
- Anja Royne
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Impingement cooled heat sink with uniformly spaced curved channels
- Publication number 20070030655
- Publication date Feb 8, 2007
- Mohinder Singh Bhatti
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electronic device cooling assembly and method employing elastic sup...
- Publication number 20050280993
- Publication date Dec 22, 2005
- International Business Machines Corporation
- Levi A. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cold plate
- Publication number 20050225938
- Publication date Oct 13, 2005
- Richard Montgomery
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hotspot coldplate spray cooling system
- Publication number 20040194492
- Publication date Oct 7, 2004
- Isothermal Systems Research
- Charles L. Tilton
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Spray cooling system
- Publication number 20040089008
- Publication date May 13, 2004
- Charles L. Tilton
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated circuit heat dissipation system
- Publication number 20040061218
- Publication date Apr 1, 2004
- Charles L. Tilton
- F28 - HEAT EXCHANGE IN GENERAL

in combination with jet impingement

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Technologies for liquid cooling systems

Thermal management of electronics using co-located microjet nozzles...

Cooling solution including microchannel arrays and methods of formi...

Mobile phone and other compute device cooling architecture

Direct liquid micro jet (DLMJ) structures for addressing thermal pe...

Method and system for driving piezoelectric MEMS-based active cooli...

Piezoelectric MEMS-based active cooling for heat dissipation in com...

Combined architecture for cooling devices

Two-dimensional addessable array of piezoelectric MEMS-based active...

Mobile phone and other compute device cooling architecture

Cooling apparatus with expanding fluid jets

Chamber architecture for cooling devices

Mobile phone and other compute device cooling architecture

Two-dimensional addessable array of piezoelectric MEMS-based active...

Two-dimensional addessable array of piezoelectric MEMS-based active...

Heat sink cooling with preferred synthetic jet cooling devices

Three-dimensional integrated circuit cooling system

Air-cooling heat dissipation device

Chip-scale cooling device having through-silicon vias and flow dire...

Cooler

Low resonance acoustic synthetic jet structure

System and method for enhanced convection cooling of temperature-de...

Thermal management solution for circuit products

Architecture for gas cooled parallel microchannel array cooler

Cooling assemblies and power electronics modules having multiple-po...

Cooling facility for cooling a component

Thermal management system for evaporative spray cooling

Impingement cooled heat sink with low pressure drop

Impingement cooled heat sink with uniformly spaced curved channels

Electronic device cooling assembly and method employing elastic sup...

Patents Applicationslast 30 patents

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMP...

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

COOLING APPARATUS

Semiconductor Package with Liquid Flow-Over Segmented Inset Lid

MEMS-BASED ACTIVE COOLING SYSTEMS

MOBILE PHONE AND OTHER COMPUTE DEVICE COOLING ARCHITECTURE

COOLING APPARATUS WITH EXPANDING FLUID JETS

TECHNOLOGIES FOR LIQUID COOLING SYSTEMS

TWO-DIMENSIONAL ADDESSABLE ARRAY OF PIEZOELECTRIC MEMS-BASED ACTIVE...

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

COOLING SOLUTION INCLUDING MICROCHANNEL ARRAYS AND METHODS OF FORMI...

DIRECT LIQUID MICRO JET (DLMJ) STRUCTURES FOR ADDRESSING THERMAL PE...

HEAT SINK COOLING WITH PREFERRED SYNTHETIC JET COOLING DEVICES

Cooling Assemblies and Power Electronics Modules Having Multiple-Po...

THERMAL MANAGEMENT SOLUTION FOR CIRCUIT PRODUCTS

Heat dissipation system with a spray cooling device

COOLING ARRANGEMENT

ARCHITECTURE FOR GAS COOLED PARALLEL MICROCHANNEL ARRAY COOLER

Power Semiconductor Module

Cooling facility for cooling a component

Impingement cooled heat sink with low pressure drop

Active cooling device

Impingement cooled heat sink with uniformly spaced curved channels

Electronic device cooling assembly and method employing elastic sup...

Cold plate

Hotspot coldplate spray cooling system

Spray cooling system

Integrated circuit heat dissipation system