in different layers of the multilayer substrate

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H01L2924/15174

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/15174in different layers of the multilayer substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,106
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,252
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Yoonyoung Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,154,878
- Issue date Nov 26, 2024
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 12,148,865
- Issue date Nov 19, 2024
- Nichia Corporation
- Kazuma Kozuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded resistor-capacitor film for fan out wafer level packaging
- Patent number 12,100,674
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Ernesto Gutierrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die fine grain integrated voltage regulation
- Patent number 12,068,324
- Issue date Aug 20, 2024
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-based items with electrical component arrays
- Patent number 11,967,561
- Issue date Apr 23, 2024
- Apple Inc.
- Daniel D. Sunshine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of substrate having electrical interconnection s...
- Patent number 11,913,121
- Issue date Feb 27, 2024
- Siliconware Precision Industries Co., Ltd.
- Po-Yi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,277
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,901,279
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 11,862,574
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
- Patent number 11,855,065
- Issue date Dec 26, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,294
- Issue date Dec 19, 2023
- Intel Corporation
- Christoph Kutter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor die assemblies with die support members and a...
- Patent number 11,824,044
- Issue date Nov 21, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packaging structure and method
- Patent number 11,756,871
- Issue date Sep 12, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,735,561
- Issue date Aug 22, 2023
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabric-based items with electrical component arrays
- Patent number 11,710,703
- Issue date Jul 25, 2023
- Apple Inc.
- Daniel D. Sunshine
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Semiconductor device and method of forming interposer with opening...
- Patent number 11,688,612
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing interposer method and apparatus
- Patent number 11,644,482
- Issue date May 9, 2023
- Texas Instruments Incorporated
- Lee D. Whetsel
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,616,037
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Base member for light emitting device
- Patent number 11,581,458
- Issue date Feb 14, 2023
- Nichia Corporation
- Kazuma Kozuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out type semiconductor packages and methods of manufacturing th...
- Patent number 11,462,466
- Issue date Oct 4, 2022
- Samsung Electronics Co., Ltd.
- Changbo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,367,704
- Issue date Jun 21, 2022
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,355,461
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,348,876
- Issue date May 31, 2022
- Samsung Electronics Co., Ltd.
- Kyoung Lim Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe substrate having modulator and crack inhibiting structure...
- Patent number 11,291,146
- Issue date Mar 29, 2022
- BRIDGE SEMICONDUCTOR CORP.
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...
- Publication number 20250218910
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...
- Publication number 20250218911
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250219019
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192016
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250176111
- Publication date May 29, 2025
- Samsung Electronics Co., LTD
- Kyoungok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...
- Publication number 20250149421
- Publication date May 8, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250149489
- Publication date May 8, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132296
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BACK-TO-BACK DIE STACKING
- Publication number 20250132240
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Faxing CHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250079319
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeongseok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062252
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046728
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Dongwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046769
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Jooyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE MEMBER FOR LIGHT EMITTING DEVICE
- Publication number 20250048800
- Publication date Feb 6, 2025
- Nichia Corporation.
- Kazuma KOZURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038094
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Joongsun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR INTEGRATING THROUGH METAL CONTACTS AND FLU...
- Publication number 20250029890
- Publication date Jan 23, 2025
- Avago Technologies International Sales Pte. Limited
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015064
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Yoon Young JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Fine Grain Integrated Voltage Regulation
- Publication number 20250015033
- Publication date Jan 9, 2025
- Apple Inc.
- Jared L. Zerbe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240429153
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...
- Publication number 20240421062
- Publication date Dec 19, 2024
- Intel Corporation
- Tolga Acikalin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE
- Publication number 20240321752
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20240312889
- Publication date Sep 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...
- Publication number 20240274583
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234279
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS
- Publication number 20240194548
- Publication date Jun 13, 2024
- Intel Corporation
- Kristof Darmawikarta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...
- Publication number 20240186227
- Publication date Jun 6, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240178116
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ting Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20240170385
- Publication date May 23, 2024
- InnoLux Corporation
- Te-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS

in different layers of the multilayer substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor package

Semiconductor package

Semiconductor device

Light emitting device

Embedded resistor-capacitor film for fan out wafer level packaging

Multi-die fine grain integrated voltage regulation

Fabric-based items with electrical component arrays

Semiconductor device and method of making a wafer-level chip-scale...

Fabrication method of substrate having electrical interconnection s...

Thermal interface material having different thicknesses in packages

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Fan-out semiconductor package

Stacked semiconductor die assemblies with support members and assoc...

Semiconductor device

Stacked semiconductor die assemblies with die support members and a...

Fan-out packaging structure and method

Semiconductor device and method for manufacturing semiconductor device

Fabric-based items with electrical component arrays

Semiconductor device and method of forming interposer with opening...

Testing interposer method and apparatus

Integrated fan-out package and manufacturing method thereof

Base member for light emitting device

Fan-out type semiconductor packages and methods of manufacturing th...

Semiconductor device and method for manufacturing semiconductor device

Integrated fan-out package and manufacturing method thereof

Semiconductor package and method of fabricating the same

Leadframe substrate having modulator and crack inhibiting structure...

Patents Applicationslast 30 patents

IMMERSION GOLD-ELECTROLESS PALLADIUM-IMMERSION GOLD (IGEPIG) AS A S...

ELECTROLYTIC COBALT-IRON-PALLADIUM-GOLD AS A SURFACE FINISH FOR EMB...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGES INCLUDING GLASS-CORED SUBSTRATES WITH S...

Multi-Die Fine Grain Integrated Voltage Regulation

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE WITH BACK-TO-BACK DIE STACKING

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

BASE MEMBER FOR LIGHT EMITTING DEVICE

SEMICONDUCTOR PACKAGE

STRUCTURE AND METHOD FOR INTEGRATING THROUGH METAL CONTACTS AND FLU...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Multi-Die Fine Grain Integrated Voltage Regulation

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PLUGGABLE INTERCONNECTS USING GLASS CORES OF INTEGRATED CIRCUIT PAC...

CIRCUIT BOARD

METHOD OF FORMING PACKAGE STRUCTURE

PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND A...

SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD FOR ELECTROLESS SURFACE FINISHING ON GLASS

INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE