in gaseous form

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H01L2224/11444

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11444in gaseous form

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and devices for inter-substrate coupling
- Patent number 9,728,489
- Issue date Aug 8, 2017
- Elwha LLC
- William David Duncan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer and method for making the same
- Patent number 9,640,521
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging process tools and systems, and packaging methods for semi...
- Patent number 9,543,185
- Issue date Jan 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with under bump metallization routing
- Patent number 8,680,676
- Issue date Mar 25, 2014
- Volterra Semiconductor Corporation
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with under bump metallization routing
- Patent number 8,368,212
- Issue date Feb 5, 2013
- Volterra Semiconductor Corporation
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate stand-offs for semiconductor devices
- Patent number 8,227,924
- Issue date Jul 24, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip power switch with under bump metallization stack
- Patent number 7,989,953
- Issue date Aug 2, 2011
- Volterra Semiconductor Corporation
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140252604
- Publication date Sep 11, 2014
- TOHOKU-MICROTEC CO., LTD
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Process Tools and Systems, and Packaging Methods for Semi...
- Publication number 20130143361
- Publication date Jun 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH UNDER BUMP METALLIZATION ROUTING
- Publication number 20130037933
- Publication date Feb 14, 2013
- Ilija Jergovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Metal for Hybridization and Related Methods
- Publication number 20120273951
- Publication date Nov 1, 2012
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...
- Publication number 20120127660
- Publication date May 24, 2012
- Hynix Semiconductor Inc.
- Kang Won LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate Stand-Offs for Semiconductor Devices
- Publication number 20120012985
- Publication date Jan 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS

in gaseous form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-die package with bridge layer

Methods for making multi-die package with bridge layer

Systems, methods and devices for inter-substrate coupling

Multi-die package with bridge layer and method for making the same

Packaging process tools and systems, and packaging methods for semi...

Semiconductor package with under bump metallization routing

Semiconductor package with under bump metallization routing

Substrate stand-offs for semiconductor devices

Flip chip power switch with under bump metallization stack

Patents Applicationslast 30 patents

Methods for Making Multi-Die Package With Bridge Layer

STACKED DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Manufacturing Method Thereof

Packaging Process Tools and Systems, and Packaging Methods for Semi...

SEMICONDUCTOR PACKAGE WITH UNDER BUMP METALLIZATION ROUTING

Contact Metal for Hybridization and Related Methods

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...

Substrate Stand-Offs for Semiconductor Devices