in gaseous form

Industry

CPC
H01L2224/27444

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27444in gaseous form

Industries

Patents Grantslast 30 patents

Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for permanently bonding wafers
- Patent number 10,825,793
- Issue date Nov 3, 2020
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,553,014
- Issue date Jan 24, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for connecting joining parts
- Patent number 9,502,376
- Issue date Nov 22, 2016
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fastening chips with a contact element onto a substrate...
- Patent number 9,245,869
- Issue date Jan 26, 2016
- EV Group E. Thallner GmbH
- Jurgen Burggraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,187,312
- Issue date Nov 17, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 9,174,836
- Issue date Nov 3, 2015
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
- Patent number 9,093,562
- Issue date Jul 28, 2015
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,041,214
- Issue date May 26, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated bondline spacers for wafer level packaged circuit devices
- Patent number 8,736,045
- Issue date May 27, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of forming bonded semiconductor structures using a temporar...
- Patent number 8,461,017
- Issue date Jun 11, 2013
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20180340100
- Publication date Nov 29, 2018
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD FOR PERMANENTLY BONDING WAFERS
- Publication number 20170229423
- Publication date Aug 10, 2017
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140346643
- Publication date Nov 27, 2014
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140193948
- Publication date Jul 10, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES
- Publication number 20140124899
- Publication date May 8, 2014
- Raytheon Company
- Roland Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
- Publication number 20130256907
- Publication date Oct 3, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...
- Publication number 20120013013
- Publication date Jan 19, 2012
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20110081738
- Publication date Apr 7, 2011
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20060097354
- Publication date May 11, 2006
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

in gaseous form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Enhanced adhesive materials and processes for 3D applications

Method for permanently bonding wafers

Enhanced adhesive materials and processes for 3D applications

Low-temperature bonding with spaced nanorods and eutectic alloys

Method for bonding metallic contact areas with solution of a sacrif...

Bonded processed semiconductor structures and carriers

Process for connecting joining parts

Method for fastening chips with a contact element onto a substrate...

Integrated bondline spacers for wafer level packaged circuit devices

Integrated bondline spacers for wafer level packaged circuit devices

Semiconductor composite apparatus, method for manufacturing the sem...

Bonded processed semiconductor structures and carriers

Integrated bondline spacers for wafer level packaged circuit devices

Methods of forming bonded semiconductor structures using a temporar...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

METHOD FOR PERMANENTLY BONDING WAFERS

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

Semiconductor Device and Manufacturing Method Thereof

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

INTEGRATED BONDLINE SPACERS FOR WAFER LEVEL PACKAGED CIRCUIT DEVICES

BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS

TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...

Semiconductor composite apparatus, method for manufacturing the sem...

Semiconductor composite apparatus, method for manufacturing the sem...