in gaseous form

Industry

CPC
H01L2224/03444

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03444in gaseous form

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions having through-substrate interconnects
- Patent number 9,583,419
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die edge side connection
- Patent number 9,209,143
- Issue date Dec 8, 2015
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 9,165,888
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming through-substrate interconnects
- Patent number 8,853,072
- Issue date Oct 7, 2014
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 8,802,564
- Issue date Aug 12, 2014
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for directly bonding together semiconductor structures, and...
- Patent number 8,778,773
- Issue date Jul 15, 2014
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,680,654
- Issue date Mar 25, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for directly bonding together semiconductor structures, and...
- Patent number 8,575,001
- Issue date Nov 5, 2013
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 8,435,836
- Issue date May 7, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated semiconductor substrate, laminated chip package and metho...
- Patent number 8,426,946
- Issue date Apr 23, 2013
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for stacked dies, including penetrating str...
- Patent number 7,872,332
- Issue date Jan 18, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240145416
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Wonyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER AND PROCESS OF MAKING
- Publication number 20230062465
- Publication date Mar 2, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof
- Publication number 20140252576
- Publication date Sep 11, 2014
- Hitachi, Ltd
- Hisashi Tanie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20140206145
- Publication date Jul 24, 2014
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND PRODUCTION METHOD
- Publication number 20140097232
- Publication date Apr 10, 2014
- FUJIKURA LTD.
- Nozomu Toyohara
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...
- Publication number 20130323884
- Publication date Dec 5, 2013
- The Charles Stark Draper Laboratory
- Maurice Samuel Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...
- Publication number 20130316497
- Publication date Nov 28, 2013
- The Charles Stark Draper Laboratory
- Maurice Samuel Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20130234296
- Publication date Sep 12, 2013
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Constructions Having Through-Substrate Interconnects,...
- Publication number 20120306084
- Publication date Dec 6, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20120282772
- Publication date Nov 8, 2012
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Contact Metal for Hybridization and Related Methods
- Publication number 20120273951
- Publication date Nov 1, 2012
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR DIRECTLY BONDING TOGETHER SEMICONDUCTOR STRUCTURES, AND...
- Publication number 20120153484
- Publication date Jun 21, 2012
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated semiconductor substrate, laminated chip package and metho...
- Publication number 20110316123
- Publication date Dec 29, 2011
- SAE MAGNETICS (H.K.) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20110111561
- Publication date May 12, 2011
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...
- Publication number 20100059897
- Publication date Mar 11, 2010
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

in gaseous form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Semiconductor constructions having through-substrate interconnects

Methods of forming semiconductor packages with an intermetallic lay...

Die edge side connection

Interconnect structures for stacked dies, including penetrating str...

Methods of forming through-substrate interconnects

Method of manufacturing a semiconductor component

Methods for directly bonding together semiconductor structures, and...

Interconnect structures for stacked dies, including penetrating str...

Methods for directly bonding together semiconductor structures, and...

Interconnect structures for stacked dies, including penetrating str...

Laminated semiconductor substrate, laminated chip package and metho...

Interconnect structures for stacked dies, including penetrating str...

Patents Applicationslast 30 patents

PASSIVE ELEMENT AND ELECTRONIC DEVICE

SUBSTRATE BONDING METHOD

BONDING LAYER AND PROCESS OF MAKING

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

Semiconductor Device and Manufacturing Method Thereof

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

BONDING METHOD AND PRODUCTION METHOD

THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...

THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

Semiconductor Constructions Having Through-Substrate Interconnects,...

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

Contact Metal for Hybridization and Related Methods

METHODS FOR DIRECTLY BONDING TOGETHER SEMICONDUCTOR STRUCTURES, AND...

Laminated semiconductor substrate, laminated chip package and metho...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...

INTERCONNECT STRUCTURES FOR STACKED DIES, INCLUDING PENETRATING STR...