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H01L2224/0341

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0341in liquid form

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shield created on package using high t...
- Patent number 11,380,624
- Issue date Jul 5, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 11,348,833
- Issue date May 31, 2022
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a photoresist over a bond pad to mitigate bond pa...
- Patent number 11,222,857
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,018,101
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 10,522,406
- Issue date Dec 31, 2019
- International Busniess Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for interconnects in 3D integrated device
- Patent number 10,354,975
- Issue date Jul 16, 2019
- Raytheon Company
- Edward R. Soares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 10,325,869
- Issue date Jun 18, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar structure
- Patent number 10,128,206
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating treatment method with airflow control, and non-transitory r...
- Patent number 9,947,534
- Issue date Apr 17, 2018
- Tokyo Electron Limited
- Kousuke Yoshihara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
- Patent number 9,935,009
- Issue date Apr 3, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 9,754,905
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,698,075
- Issue date Jul 4, 2017
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 9,646,928
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company Limited
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of backside heat spreader for thermal management
- Patent number 9,496,198
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering device, soldering method, and substrate and electronic co...
- Patent number 9,289,841
- Issue date Mar 22, 2016
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating and development treatment system with airflow control inclu...
- Patent number 9,162,247
- Issue date Oct 20, 2015
- Tokyo Electron Limited
- Kousuke Yoshihara
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of manufacturing a semiconductor component
- Patent number 8,802,564
- Issue date Aug 12, 2014
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for attaching a metal surface to a carrier, a method for att...
- Patent number 8,569,109
- Issue date Oct 29, 2013
- Infineon Technologies AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 8,373,284
- Issue date Feb 12, 2013
- NEC Corporation
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021550
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240021551
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING LAYER AND PROCESS OF MAKING
- Publication number 20230062465
- Publication date Mar 2, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...
- Publication number 20210272918
- Publication date Sep 2, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PHOTORESIST OVER A BOND PAD TO MITIGATE BOND PA...
- Publication number 20210265291
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELD CREATED ON PACKAGE USING HIGH T...
- Publication number 20200312782
- Publication date Oct 1, 2020
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20200098638
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR INTERCONNECTS IN 3D INTEGRATED DEVICE
- Publication number 20190267353
- Publication date Aug 29, 2019
- Raytheon Company
- Edward R. Soares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...
- Publication number 20190259718
- Publication date Aug 22, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20190109105
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...
- Publication number 20190027450
- Publication date Jan 24, 2019
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER
- Publication number 20180182672
- Publication date Jun 28, 2018
- International Business Machines Corporation
- Bing Dang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION
- Publication number 20180108626
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT
- Publication number 20160322277
- Publication date Nov 3, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Environmental hardened packaged integrated circuit
- Publication number 20160181168
- Publication date Jun 23, 2016
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...
- Publication number 20140212678
- Publication date Jul 31, 2014
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
- Publication number 20130341785
- Publication date Dec 26, 2013
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130277850
- Publication date Oct 24, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...
- Publication number 20130001803
- Publication date Jan 3, 2013
- INFINEON TECHNOLOGIES AG
- Manfred Mengel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20120282772
- Publication date Nov 8, 2012
- Danfoss Silicon Power GmbH
- Mathias Kock
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COATING TREATMENT APPARATUS, COATING AND DEVELOPING TREATMENT SYSTE...
- Publication number 20120276753
- Publication date Nov 1, 2012
- TOKYO ELECTRON LIMITED
- Kousuke YOSHIHARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CONDUCTIVE PILLAR STRUCTURE
- Publication number 20120091574
- Publication date Apr 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100213622
- Publication date Aug 26, 2010
- Toshinobu Ogatsu
- H01 - BASIC ELECTRIC ELEMENTS

in liquid form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices, semiconductor packages, and methods of manuf...

Structure and method for semiconductor packaging

Electromagnetic interference shield created on package using high t...

IR assisted fan-out wafer level packaging using silicon handler

Method of forming a photoresist over a bond pad to mitigate bond pa...

Semiconductor packages with an intermetallic layer

Semiconductor devices, semiconductor packages, and methods of manuf...

IR assisted fan-out wafer level packaging using silicon handler

Barrier layer for interconnects in 3D integrated device

Semiconductor devices, semiconductor packages, and methods of manuf...

Conductive pillar structure

Coating treatment method with airflow control, and non-transitory r...

IR assisted fan-out wafer level packaging using silicon handler

Final passivation for wafer level warpage and ULK stress reduction

Integration of backside heat spreader for thermal management

Semiconductor arrangement and formation thereof

Methods of forming semiconductor packages with an intermetallic lay...

Integration of backside heat spreader for thermal management

Soldering device, soldering method, and substrate and electronic co...

Coating and development treatment system with airflow control inclu...

Method of manufacturing a semiconductor component

Method for attaching a metal surface to a carrier, a method for att...

Semiconductor device

Patents Applicationslast 30 patents

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

BONDING LAYER AND PROCESS OF MAKING

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

METHOD OF FORMING A PHOTORESIST OVER A BOND PAD TO MITIGATE BOND PA...

ELECTROMAGNETIC INTERFERENCE SHIELD CREATED ON PACKAGE USING HIGH T...

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

BARRIER LAYER FOR INTERCONNECTS IN 3D INTEGRATED DEVICE

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUF...

IR ASSISTED FAN-OUT WAFER LEVEL PACKAGING USING SILICON HANDLER

FINAL PASSIVATION FOR WAFER LEVEL WARPAGE AND ULK STRESS REDUCTION

INTEGRATION OF BACKSIDE HEAT SPREADER FOR THERMAL MANAGEMENT

Environmental hardened packaged integrated circuit

SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC CO...

SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES

ELECTRONIC DEVICE

METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATT...

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

COATING TREATMENT APPARATUS, COATING AND DEVELOPING TREATMENT SYSTE...

CONDUCTIVE PILLAR STRUCTURE

SEMICONDUCTOR DEVICE