in liquid form

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H01L2224/0331

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0331in liquid form

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,020,951
- Issue date Jun 25, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,417
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure and manufacturing method thereof and driving s...
- Patent number 11,715,715
- Issue date Aug 1, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 11,699,678
- Issue date Jul 11, 2023
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package devices and method for forming semiconductor...
- Patent number 11,393,784
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 11,367,699
- Issue date Jun 21, 2022
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device
- Patent number 11,327,468
- Issue date May 10, 2022
- Omron Corporation
- Wakahiro Kawai
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor package having a laser-activatable mold compound
- Patent number 11,289,436
- Issue date Mar 29, 2022
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 11,075,187
- Issue date Jul 27, 2021
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive substrate, transfer device having adhesive substrate, and...
- Patent number 10,818,618
- Issue date Oct 27, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor chips to a landing wafer
- Patent number 10,797,016
- Issue date Oct 6, 2020
- Imec VZW
- Vikas Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 10,763,230
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate comprising side pads on edge, chip stack, semicon...
- Patent number 10,522,522
- Issue date Dec 31, 2019
- Young Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a porous conductive structure in connection to...
- Patent number 10,373,868
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layers for high-yield printed electronic devices
- Patent number 10,304,836
- Issue date May 28, 2019
- Xerox Corporation
- Kyle B. Tallman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die sidewall interconnects for 3D chip assemblies
- Patent number 10,199,354
- Issue date Feb 5, 2019
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 10,153,248
- Issue date Dec 11, 2018
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,049,998
- Issue date Aug 14, 2018
- Invensas Corporation
- Rajesh Katkar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a layer structure having partially sealed p...
- Patent number 9,929,111
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with semiconductor die attached with sintered me...
- Patent number 9,875,987
- Issue date Jan 23, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with under bump metallization a...
- Patent number 9,865,554
- Issue date Jan 9, 2018
- STATS ChipPAC Ptc. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 9,837,375
- Issue date Dec 5, 2017
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental hardened packaged integrated circuit
- Patent number 9,711,480
- Issue date Jul 18, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure for three-dimensional semiconductor device
- Patent number 9,698,080
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
- Publication number 20240282592
- Publication date Aug 22, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Producing A Solder Contact Surface On A Chip By Producin...
- Publication number 20240203913
- Publication date Jun 20, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...
- Publication number 20240096825
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
- Publication number 20230340686
- Publication date Oct 26, 2023
- LAM RESEARCH CORPORATION
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...
- Publication number 20230275076
- Publication date Aug 31, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20230275065
- Publication date Aug 31, 2023
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005849
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...
- Publication number 20220293558
- Publication date Sep 15, 2022
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...
- Publication number 20220238471
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC STRUCTURE
- Publication number 20220238472
- Publication date Jul 28, 2022
- PRAGMATIC PRINTING LTD.
- Brian COBB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
- Publication number 20220189790
- Publication date Jun 16, 2022
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20210057378
- Publication date Feb 25, 2021
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200381380
- Publication date Dec 3, 2020
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200350268
- Publication date Nov 5, 2020
- WINBOND ELECTRONICS CORP.
- Yen-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20190067241
- Publication date Feb 28, 2019
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING SIDE PADS ON EDGE, CHIP STACK, SEMICON...
- Publication number 20180211943
- Publication date Jul 26, 2018
- Young Hee SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SIDEWALL INTERCONNECTS FOR 3D CHIP ASSEMBLIES
- Publication number 20180174999
- Publication date Jun 21, 2018
- Intel Corporation
- Mitul MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20180068976
- Publication date Mar 8, 2018
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layers Around...
- Publication number 20170250158
- Publication date Aug 31, 2017
- SEMTECH CORPORATION
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE
- Publication number 20170207123
- Publication date Jul 20, 2017
- Infineon Technologies Austria AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...
- Publication number 20170194272
- Publication date Jul 6, 2017
- INFINEON TECHNOLOGIES AG
- Martin MISCHITZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170012081
- Publication date Jan 12, 2017
- XINTEC INC.
- Chia-Lun SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20160336286
- Publication date Nov 17, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION A...
- Publication number 20160099222
- Publication date Apr 7, 2016
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20160049390
- Publication date Feb 18, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device
- Publication number 20150380341
- Publication date Dec 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS

in liquid form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for registration of circuit dies and electrical interconnects

Semiconductor structure and manufacturing method thereof

Industrial chip scale package for microelectronic device

Metal bump structure and manufacturing method thereof and driving s...

Semiconductor device and method of forming insulating layers around...

Semiconductor package devices and method for forming semiconductor...

Integrated circuit backside metallization

Control device

Semiconductor package having a laser-activatable mold compound

Semiconductor device and method of forming insulating layers around...

Lead-free solder joining of electronic structures

Adhesive substrate, transfer device having adhesive substrate, and...

Method for bonding semiconductor chips to a landing wafer

Integrated circuit backside metallization

Lead-free solder joining of electronic structures

Package substrate comprising side pads on edge, chip stack, semicon...

Method of processing a porous conductive structure in connection to...

Protective layers for high-yield printed electronic devices

Die sidewall interconnects for 3D chip assemblies

Semiconductor device and method of forming insulating layers around...

Conductive connections, structures with such connections, and metho...

Conductive connections, structures with such connections, and metho...

Method of manufacturing a layer structure having partially sealed p...

Electronic devices with semiconductor die attached with sintered me...

Integrated circuit packaging system with under bump metallization a...

Semiconductor device and method of forming insulating layers around...

Conductive connections, structures with such connections, and metho...

Multiple bond via arrays of different wire heights on a same substrate

Environmental hardened packaged integrated circuit

Conductor structure for three-dimensional semiconductor device

Patents Applicationslast 30 patents

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

Method For Producing A Solder Contact Surface On A Chip By Producin...

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...

ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...

DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...

Semiconductor Device and Method of Forming Insulating Layers Around...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING SEMICONDUCTOR DEVICES USING A GLASS STRUCTURE AT...

METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...

FLEXIBLE ELECTRONIC STRUCTURE

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

Semiconductor Device and Method of Forming Insulating Layers Around...

Semiconductor Package Having a Laser-Activatable Mold Compound

WIRE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

Semiconductor Device and Method of Forming Insulating Layers Around...

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

PACKAGE SUBSTRATE COMPRISING SIDE PADS ON EDGE, CHIP STACK, SEMICON...

DIE SIDEWALL INTERCONNECTS FOR 3D CHIP ASSEMBLIES

Semiconductor Device and Method of Forming Insulating Layers Around...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

Semiconductor Device and Method of Forming Insulating Layers Around...

METHOD FOR PROCESSING A SUBSTRATE AND AN ELECTRONIC DEVICE

METHOD OF MANUFACTURING A LAYER STRUCTURE HAVING PARTIALLY SEALED P...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDER BUMP METALLIZATION A...

Multiple bond via arrays of different wire heights on a same substrate

Three-Dimensional Semiconductor Device