in liquid form

Industry

CPC
H01L2224/1131

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1131in liquid form

Industries

Patents Grantslast 30 patents

Information Patent Grant
Uniform chip gaps via injection-molded solder pillars
- Patent number 12,107,065
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming conductive layer, and conductive structure and f...
- Patent number 12,040,292
- Issue date Jul 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ming-Teng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package assembly
- Patent number 11,929,308
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a can housing a semiconductor die w...
- Patent number 11,817,418
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for reflowed solder balls and their under bump...
- Patent number 11,664,297
- Issue date May 30, 2023
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,569,196
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball disposition system, method of disposing a ball on a substrate...
- Patent number 11,488,928
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Sukmin Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 11,488,882
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,413,709
- Issue date Aug 16, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for discharging fluid
- Patent number 11,259,415
- Issue date Feb 22, 2022
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 11,229,979
- Issue date Jan 25, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 11,158,605
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip to chip interconnect in encapsulant of molded semiconductor pa...
- Patent number 11,133,281
- Issue date Sep 28, 2021
- Infineon Technologies AG
- Khay Chwan Saw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for reflowed solder balls and their under bump...
- Patent number 11,127,658
- Issue date Sep 21, 2021
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly comprising hybrid interconnecting means including intermed...
- Patent number 11,011,490
- Issue date May 18, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Rabih Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid discharge device
- Patent number 10,932,372
- Issue date Feb 23, 2021
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack and method for manufacturing semiconductor...
- Patent number 10,861,813
- Issue date Dec 8, 2020
- SHARP KABUSHIKI KAISHA
- Toshiya Ishio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux, solder paste, and method for forming solder bump
- Patent number 10,836,000
- Issue date Nov 17, 2020
- Tamura Corporation
- Masanori Shibasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices including redistribution layers
- Patent number 10,818,536
- Issue date Oct 27, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
- Patent number 10,741,467
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of fabricating the same
- Patent number 10,700,249
- Issue date Jun 30, 2020
- SEOUL VIOSYS CO., LTD.
- Chang Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME
- Publication number 20240332234
- Publication date Oct 3, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- KEIKO IKUTA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER VOLUME FOR FLIP-CHIP BONDING
- Publication number 20240282735
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE, LED DISPLAY, AND MOUNTING METHOD
- Publication number 20240038951
- Publication date Feb 1, 2024
- DAICEL CORPORATION
- Hiroto MIYAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20230402417
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...
- Publication number 20230395549
- Publication date Dec 7, 2023
- Hewlett-Packard Development Company, L.P.
- DAVID WAYNE GEORGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20230307419
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230178506
- Publication date Jun 8, 2023
- Mitsubishi Electric Corporation
- Tatsushi MORISADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE ASSEMBLY
- Publication number 20230137852
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Steffany Ann Lacierda Moreno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES
- Publication number 20230005870
- Publication date Jan 5, 2023
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20220331913
- Publication date Oct 20, 2022
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20220020715
- Publication date Jan 20, 2022
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...
- Publication number 20220013479
- Publication date Jan 13, 2022
- Changxin Memory Technologies, Inc.
- Ming-Teng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR REFLOWED SOLDER BALLS AND THEIR UNDER BUMP...
- Publication number 20210366809
- Publication date Nov 25, 2021
- LBSEMICON CO., LTD.
- Jae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...
- Publication number 20210249378
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- SUKMIN OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Comprising a Can Housing a Semiconductor Die w...
- Publication number 20210159204
- Publication date May 27, 2021
- INFINEON TECHNOLOGIES AG
- Wei Lee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20200168497
- Publication date May 28, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20200094353
- Publication date Mar 26, 2020
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP STACK AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20190371756
- Publication date Dec 5, 2019
- Sharp Kabushiki Kaisha
- TOSHIYA ISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...
- Publication number 20190157229
- Publication date May 23, 2019
- SHARP KABUSHIKI KAISHA
- Tomotoshi SATOH
- B22 - CASTING POWDER METALLURGY

in liquid form

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Uniform chip gaps via injection-molded solder pillars

High reliability lead-free solder alloys for harsh environment elec...

Method for forming conductive layer, and conductive structure and f...

Flip chip package assembly

Semiconductor device comprising a can housing a semiconductor die w...

Industrial chip scale package for microelectronic device

Semiconductor device and method of making wafer level chip scale pa...

Manufacturing method for reflowed solder balls and their under bump...

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Ball disposition system, method of disposing a ball on a substrate...

Die-on-interposer assembly with dam structure and method of manufac...

High reliability lead-free solder alloys for harsh environment elec...

Method for discharging fluid

Interconnect crack arrestor structure and methods

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor packaging structure and method

Chip to chip interconnect in encapsulant of molded semiconductor pa...

Manufacturing method for reflowed solder balls and their under bump...

Assembly comprising hybrid interconnecting means including intermed...

Fluid discharge device

Method of forming a solder bump structure

Semiconductor chip stack and method for manufacturing semiconductor...

Flux, solder paste, and method for forming solder bump

Microelectronic devices including redistribution layers

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Die-on-interposer assembly with dam structure and method of manufac...

Fabrication of solder balls with injection molded solder

Wafer level flat no-lead semiconductor packages and methods of manu...

Light emitting device and method of fabricating the same

Patents Applicationslast 30 patents

BUMP MANUFACTURING METHOD AND IMPRINT DIE USED IN SAME

SOLDER VOLUME FOR FLIP-CHIP BONDING

REPAIR OF SOLDER BUMPS

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

MOUNTED STRUCTURE, LED DISPLAY, AND MOUNTING METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING

INTEGRATED CIRCUIT DEVICES WITH ELECTRICAL CONTACTS ON MULTIPLE SUR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

POWER SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME,...

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

FLIP CHIP PACKAGE ASSEMBLY

TERMINAL AND CONNECTION METHOD

3D PRINTED INTERCONNECTS AND RESONATORS FOR SEMICONDUCTOR DEVICES

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

METHOD FOR FORMING CONDUCTIVE LAYER, AND CONDUCTIVE STRUCTURE AND F...

MANUFACTURING METHOD FOR REFLOWED SOLDER BALLS AND THEIR UNDER BUMP...

BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...

Semiconductor Device Comprising a Can Housing a Semiconductor Die w...

EXPANDED HEAD PILLAR FOR BUMP BONDS

MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS

METHOD OF FORMING A SOLDER BUMP STRUCTURE

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

METHOD OF FORMING A SOLDER BUMP STRUCTURE

SEMICONDUCTOR CHIP STACK AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

Interconnect Crack Arrestor Structure and Methods

CONDUCTIVE PASTE, ELECTRODE CONNECTION STRUCTURE, AND ELECTRODE CON...