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H01L2224/16057

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 12,113,003
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,057,424
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding structures for die-to-die and wafer-to-wafer bonding
- Patent number 12,057,429
- Issue date Aug 6, 2024
- HRL Laboratories, LLC
- Aurelio Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 11,881,446
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,756,946
- Issue date Sep 12, 2023
- Kioxia Corporation
- Tomoya Sanuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure having counductive bump with tapered portio...
- Patent number 11,495,556
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,430,761
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 11,417,642
- Issue date Aug 16, 2022
- Kioxia Corporation
- Tomoya Sanuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and device for producing and filling containers
- Patent number 11,345,073
- Issue date May 31, 2022
- KHS GmbH
- Ludwig Clüsserath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit connection method and electronic circuit
- Patent number 11,270,968
- Issue date Mar 8, 2022
- National Institute of Advanced Industrial Science and Technology
- Masaru Hashino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a conductive bump with a plurality o...
- Patent number 11,018,099
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency module and communication device
- Patent number 10,971,466
- Issue date Apr 6, 2021
- Murata Manufacturing Co., Ltd.
- Katsunari Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a gap control electrode and method of man...
- Patent number 10,867,950
- Issue date Dec 15, 2020
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 10,615,154
- Issue date Apr 7, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded graphite heat spreader for 3DIC
- Patent number 10,586,785
- Issue date Mar 10, 2020
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,504,825
- Issue date Dec 10, 2019
- Samsung Electronics Co., Ltd.
- Jeong Il Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 10,396,024
- Issue date Aug 27, 2019
- Shinko Electric Industries Co., Ltd.
- Kosuke Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip alignment utilizing superomniphobic surface treatment of silic...
- Patent number 10,396,050
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, LED module and method
- Patent number 10,361,178
- Issue date Jul 23, 2019
- Infineon Technologies Austria AG
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device substrate, semiconductor device wiring member...
- Patent number 10,276,422
- Issue date Apr 30, 2019
- OHKUCHI MATERIALS CO., LTD.
- Satoshi Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, fan-out package structure and method of the same
- Patent number 10,269,582
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package integrated circuit assembly with package on package i...
- Patent number 10,181,456
- Issue date Jan 15, 2019
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...
- Publication number 20240413137
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
- Publication number 20240266267
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- PEI CHENG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...
- Publication number 20240170351
- Publication date May 23, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
- Publication number 20230361013
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- PEI CHENG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FAN-OUT MEMORY PACKAGE STRUCTURE AND PACKAGING ME...
- Publication number 20230352461
- Publication date Nov 2, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
- Publication number 20230317545
- Publication date Oct 5, 2023
- Intel Corporation
- Pilin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING M...
- Publication number 20230163114
- Publication date May 25, 2023
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME
- Publication number 20230163103
- Publication date May 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
- Publication number 20230131247
- Publication date Apr 27, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT-RECEIVING DEVICE AND LIGHT-RECEIVING...
- Publication number 20220384510
- Publication date Dec 1, 2022
- Sumitomo Electric Industries, Ltd.
- Masaki MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20220320065
- Publication date Oct 6, 2022
- KIOXIA Corporation
- Tomoya SANUKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20210272946
- Publication date Sep 2, 2021
- KIOXIA Corporation
- Tomoya SANUKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257331
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT
- Publication number 20210249374
- Publication date Aug 12, 2021
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Masaru HASHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20200402958
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20200243493
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20200051943
- Publication date Feb 13, 2020
- Murata Manufacturing Co., Ltd.
- Katsunari NAKAZAWA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190139876
- Publication date May 9, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Il LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190096832
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...
- Publication number 20180374827
- Publication date Dec 27, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...
- Publication number 20180342653
- Publication date Nov 29, 2018
- Chung Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-PACKAGE INTEGRATED CIRCUIT ASSEMBLY WITH PACKAGE ON PACKAGE I...
- Publication number 20180269183
- Publication date Sep 20, 2018
- Intel Corporation
- Hyoung IL Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20180226387
- Publication date Aug 9, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC
- Publication number 20180219001
- Publication date Aug 2, 2018
- Invensas Corporation
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, FAN-OUT PACKAGE STRUCTURE AND METHOD OF THE SAME
- Publication number 20180130673
- Publication date May 10, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIEN LING HWANG
- H01 - BASIC ELECTRIC ELEMENTS

in side view

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with interconnectors of different density

Semiconductor device with composite middle interconnectors

Supporting backplane, manufacturing method therefor and backplane

Package structure and method for forming the same

Temporary bonding structures for die-to-die and wafer-to-wafer bonding

Semiconductor device with composite middle interconnectors

Semiconductor storage device

Semiconductor structure having counductive bump with tapered portio...

Semiconductor device assembly with through-package interconnect and...

Semiconductor package and method for manufacturing the same

Semiconductor storage device

Method and device for producing and filling containers

Semiconductor chip with patterned underbump metallization and polym...

Electronic circuit connection method and electronic circuit

Semiconductor structure having a conductive bump with a plurality o...

High frequency module and communication device

Semiconductor device with a gap control electrode and method of man...

Mechanisms for forming hybrid bonding structures with elongated bumps

Semiconductor device assembly with through-package interconnect and...

Embedded graphite heat spreader for 3DIC

Package-on-package (PoP) structure including stud bulbs

Fan-out semiconductor package

Semiconductor chip mounted on a packaging substrate

Wiring substrate and semiconductor device

Chip alignment utilizing superomniphobic surface treatment of silic...

Interconnection structure, LED module and method

Bonding structure and method for producing bonding structure

Semiconductor device substrate, semiconductor device wiring member...

Package structure, fan-out package structure and method of the same

Multi-package integrated circuit assembly with package on package i...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A METAL BLOCK WITH METAL...

SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS

REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...

DISPLAY DEVICE

SUBSTRATE BONDING METHOD

SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS

THREE-DIMENSIONAL FAN-OUT MEMORY PACKAGE STRUCTURE AND PACKAGING ME...

PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER

THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING M...

STACKED DIE PACKAGE AND METHODS OF FORMING THE SAME

SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

METHOD OF MANUFACTURING LIGHT-RECEIVING DEVICE AND LIGHT-RECEIVING...

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC CIRCUIT CONNECTION METHOD AND ELECTRONIC CIRCUIT

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

FAN-OUT SEMICONDUCTOR PACKAGE

Package-On-Package (PoP) Structure Including Stud Bulbs

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHO...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIV...

MULTI-PACKAGE INTEGRATED CIRCUIT ASSEMBLY WITH PACKAGE ON PACKAGE I...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

EMBEDDED GRAPHITE HEAT SPREADER FOR 3DIC

PACKAGE STRUCTURE, FAN-OUT PACKAGE STRUCTURE AND METHOD OF THE SAME