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H01L2224/05016

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and semiconductor packages including the same
- Patent number 12,040,294
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure for wafer level bonding and bonded semicond...
- Patent number 11,929,335
- Issue date Mar 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad layout including floating conductive sections
- Patent number 11,887,949
- Issue date Jan 30, 2024
- Macronix International Co., Ltd.
- Su-Chueh Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bond pad with fixing parts fixed ont...
- Patent number 11,876,061
- Issue date Jan 16, 2024
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having polygonal bo...
- Patent number 11,776,921
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of treatment of an electronic circuit for a hybrid molecular...
- Patent number 11,715,710
- Issue date Aug 1, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for semiconductor packaging
- Patent number 11,705,414
- Issue date Jul 18, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same
- Patent number 11,694,978
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact photolithography-based nanopatterning using photoresist fea...
- Patent number 11,616,129
- Issue date Mar 28, 2023
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor packages including the same
- Patent number 11,302,660
- Issue date Apr 12, 2022
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing reentrant shaped bonding pads an...
- Patent number 11,201,139
- Issue date Dec 14, 2021
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,189,583
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing reentrant shaped bonding pads an...
- Patent number 11,145,628
- Issue date Oct 12, 2021
- SanDisk Technologies LLC
- Rahul Sharangpani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 11,133,274
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate conductor support
- Patent number 11,084,717
- Issue date Aug 10, 2021
- Texas Instruments Incorporated
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,018,101
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact photolithography-based nanopatterning using photoresist fea...
- Patent number 10,903,329
- Issue date Jan 26, 2021
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor element with improved yield
- Patent number 10,727,209
- Issue date Jul 28, 2020
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 10,700,025
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical gallium nitride Schottky diode
- Patent number 10,573,762
- Issue date Feb 25, 2020
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with over pad metal electrode and method for m...
- Patent number 10,504,861
- Issue date Dec 10, 2019
- Renesas Electronics Corporation
- Takashi Moriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Termination structure for gallium nitride Schottky diode including...
- Patent number 10,333,006
- Issue date Jun 25, 2019
- Alpha and Omega Semiconductor Incorporated
- TingGang Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,290,597
- Issue date May 14, 2019
- LG Innotek Co., Ltd
- Yeong Deuk Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laterally extended conductive bump buffer
- Patent number 10,276,530
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a conductive via structure
- Patent number 10,157,831
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method of fabricating the same
- Patent number 10,090,266
- Issue date Oct 2, 2018
- Samsung Electronics Co., Ltd.
- Ae-Hee Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer dicing
- Patent number 10,014,269
- Issue date Jul 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yueh-Chuan Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...
- Publication number 20240332228
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Joongwon SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING-TYPE INTERCONNECTION MEMBER
- Publication number 20240321790
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kei OBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND APPARATUS
- Publication number 20240203972
- Publication date Jun 20, 2024
- TDK Corporation
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR WAFER LEVEL BONDING AND BONDED SEMICOND...
- Publication number 20240178171
- Publication date May 30, 2024
- UNITED MICROELECTRONICS CORP.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063160
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20230299027
- Publication date Sep 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20230275052
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED BOND PAD IN STACKED WAFER STRUCTURE
- Publication number 20230245987
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230209926
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Shinhyuk Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...
- Publication number 20230178501
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS
- Publication number 20230056520
- Publication date Feb 23, 2023
- Macronix International Co., Ltd.
- Su-Chueh LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE FOR WAFER LEVEL BONDING AND BONDED SEMICOND...
- Publication number 20220399295
- Publication date Dec 15, 2022
- UNITED MICROELECTRONICS CORP.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
- Publication number 20220336421
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Seungyoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20220208703
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220093544
- Publication date Mar 24, 2022
- Mitsubishi Electric Corporation
- Yasuki Aihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TREATMENT OF AN ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR...
- Publication number 20210366851
- Publication date Nov 25, 2021
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE CONDUCTOR SUPPORT
- Publication number 20210323816
- Publication date Oct 21, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Virgil Cotoco Ararao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...
- Publication number 20210296284
- Publication date Sep 23, 2021
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...
- Publication number 20210296285
- Publication date Sep 23, 2021
- SANDISK TECHNOLOGIES LLC
- Rahul SHARANGPANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20200402935
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Interconnect Structure and Method for Forming Same
- Publication number 20200328169
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200144207
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
- Publication number 20190109105
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LATERALLY EXTENDED CONDUCTIVE BUMP BUFFER
- Publication number 20190088610
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Hsiang TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT
- Publication number 20190035770
- Publication date Jan 31, 2019
- KABUSHIKI KAISHA TOSHIBA
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20180053737
- Publication date Feb 22, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Shohei OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20170317043
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yueh-Chuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20170236793
- Publication date Aug 17, 2017
- LG Innotek Co., Ltd.
- Yeong Deuk Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATING THE SAME
- Publication number 20170062363
- Publication date Mar 2, 2017
- Samsung Electronics Co., Ltd.
- Ae-Hee CHOI
- H01 - BASIC ELECTRIC ELEMENTS

in side view

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and semiconductor packages including the same

Semiconductor structure having polygonal bonding pad

Semiconductor structure for wafer level bonding and bonded semicond...

Bond pad layout including floating conductive sections

Semiconductor device including bond pad with fixing parts fixed ont...

Method of manufacturing semiconductor structure having polygonal bo...

Semiconductor devices, semiconductor packages, and methods of manuf...

Method of treatment of an electronic circuit for a hybrid molecular...

Structure and method for semiconductor packaging

Semiconductor devices and semiconductor packages including the same

Contact photolithography-based nanopatterning using photoresist fea...

Semiconductor devices and semiconductor packages including the same

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor structure containing reentrant shaped bonding pads an...

Semiconductor structure and manufacturing method thereof

Semiconductor structure containing reentrant shaped bonding pads an...

Fan-out interconnect structure and method for forming same

Through-substrate conductor support

Semiconductor devices, semiconductor packages, and methods of manuf...

Contact photolithography-based nanopatterning using photoresist fea...

Semiconductor device and semiconductor element with improved yield

Fan-out interconnect structure and method for forming same

Vertical gallium nitride Schottky diode

Semiconductor device with over pad metal electrode and method for m...

Termination structure for gallium nitride Schottky diode including...

Semiconductor device

Laterally extended conductive bump buffer

Semiconductor device having a conductive via structure

Semiconductor device, and method of fabricating the same

Method for wafer dicing

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES HAVING UPPER CONDUCTIVE PATTERNS AND SEMICOND...

BONDING-TYPE INTERCONNECTION MEMBER

ELECTRONIC COMPONENT AND APPARATUS

SEMICONDUCTOR STRUCTURE FOR WAFER LEVEL BONDING AND BONDED SEMICOND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

SLOTTED BOND PAD IN STACKED WAFER STRUCTURE

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...

BOND PAD LAYOUT INCLUDING FLOATING CONDUCTIVE SECTIONS

SEMICONDUCTOR STRUCTURE FOR WAFER LEVEL BONDING AND BONDED SEMICOND...

SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF TREATMENT OF AN ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR...

THROUGH-SUBSTRATE CONDUCTOR SUPPORT

SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...

SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AN...

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

Fan-Out Interconnect Structure and Method for Forming Same

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING

LATERALLY EXTENDED CONDUCTIVE BUMP BUFFER

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ELEMENT

POWER SEMICONDUCTOR DEVICE

METHOD FOR WAFER DICING

Semiconductor Device

SEMICONDUCTOR DEVICE, AND METHOD OF FABRICATING THE SAME