in-situ cleaning after layer formation

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H01L21/02334

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02334in-situ cleaning after layer formation

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing method
- Patent number 12,165,882
- Issue date Dec 10, 2024
- Yuta Akasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion removal method and film-forming method
- Patent number 12,116,675
- Issue date Oct 15, 2024
- Resonac Corporation
- Yosuke Tanimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Particle removal method in semiconductor fabrication process
- Patent number 12,062,535
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with metal cap layer and method for manufac...
- Patent number 12,009,403
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming silicon dioxide film and method for forming meta...
- Patent number 11,990,331
- Issue date May 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molecular doping
- Patent number 11,978,633
- Issue date May 7, 2024
- Consiglio Nazionale Delle Ricerche
- Rosaria Anna Puglisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing impurities in thin film and substrate processin...
- Patent number 11,972,946
- Issue date Apr 30, 2024
- Eugene Technology Co., Ltd.
- Kyu Jin Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for manufacturing semiconductor memory
- Patent number 11,854,797
- Issue date Dec 26, 2023
- Changxin Memory Technologies, Inc.
- Haodong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bevel portion treatment agent composition and method of manufacturi...
- Patent number 11,817,310
- Issue date Nov 14, 2023
- Central Glass Company, Limited
- Yuki Fukui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,776,806
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for die stack flux removal
- Patent number 11,756,805
- Issue date Sep 12, 2023
- Veeco Instruments Inc.
- John Taddei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming semiconductor structure
- Patent number 11,749,741
- Issue date Sep 5, 2023
- United Microelectronics Corp.
- Zhe Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer treatment for achieving defect-free self-assembled monolayers
- Patent number 11,735,420
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Chang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 11,735,412
- Issue date Aug 22, 2023
- Kokusai Electric Corporation
- Atsushi Sano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and composition for selectively modifying base material surface
- Patent number 11,705,331
- Issue date Jul 18, 2023
- JSR Corporation
- Hiroyuki Komatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Using sacrificial polymer materials in semiconductor processing
- Patent number 11,651,952
- Issue date May 16, 2023
- Micron Technology, Inc.
- Michael T. Andreas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Freezing a sacrificial material in forming a semiconductor
- Patent number 11,482,409
- Issue date Oct 25, 2022
- Micron Technology, Inc.
- Matthew S. Thorum
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure with metal cap layer
- Patent number 11,393,912
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation structuring and plating for semiconductor devices
- Patent number 11,387,095
- Issue date Jul 12, 2022
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step pre-clean for selective metal gap fill
- Patent number 11,380,536
- Issue date Jul 5, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing product layer
- Patent number 11,309,179
- Issue date Apr 19, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hui Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern-forming method and composition
- Patent number 11,270,883
- Issue date Mar 8, 2022
- JSR Corporation
- Hiroyuki Komatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 11,244,851
- Issue date Feb 8, 2022
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ammonium fluoride pre-clean protection
- Patent number 11,232,947
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and composition for selectively modifying base material surface
- Patent number 11,211,246
- Issue date Dec 28, 2021
- JSR Corporation
- Hiroyuki Komatsu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
In situ vapor deposition polymerization to form polymers as precurs...
- Patent number 11,065,654
- Issue date Jul 20, 2021
- Lam Research Corporation
- Mark Kawaguchi
- B08 - CLEANING
Information Patent Grant
Removal of surface passivation
- Patent number 11,062,914
- Issue date Jul 13, 2021
- ASM IP Holding B.V.
- Antti Juhani Niskanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for inhibiting detectivity, metal particle cont...
- Patent number 11,043,378
- Issue date Jun 22, 2021
- Tokyo Electron Limited
- Corey Lemley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Freezing a sacrificial material in forming a semiconductor
- Patent number 10,957,530
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Matthew S. Thorum
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and composition for selectively modifying base material surface
- Patent number 10,950,438
- Issue date Mar 16, 2021
- JSR Corporation
- Hiroyuki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240395908
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. MORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLE REMOVAL METHOD IN SEMICONDUCTOR FABRICATION PROCESS
- Publication number 20240363329
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-MING TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC/HYBRID STRESS FILMS
- Publication number 20240363340
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Charlotte Cutler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PURIFIED SURFACE REGION OF AN OXIDE SEMICONDUCTOR, AND METHOD OF NE...
- Publication number 20240355884
- Publication date Oct 24, 2024
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Edmund G. Seebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE...
- Publication number 20240312778
- Publication date Sep 19, 2024
- LAM RESEARCH CORPORATION
- Stephen J. BANIK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CARRIER STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240282761
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-V, II-VI IN-SITU COMPLIANT SUBSTRATE FORMATION
- Publication number 20240266165
- Publication date Aug 8, 2024
- The Regents of the University of California
- Shuji Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING CONTACT RESISTANCE
- Publication number 20240105464
- Publication date Mar 28, 2024
- Shanghai Huali Integrated Circuit Corporation
- Wensheng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20230343580
- Publication date Oct 26, 2023
- Kokusai Electric Corporation
- Atsushi SANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming semiconductor structure
- Publication number 20230070135
- Publication date Mar 9, 2023
- UNITED MICROELECTRONICS CORP.
- ZHE WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230036388
- Publication date Feb 2, 2023
- Sumitomo Electric Industries, Ltd.
- Isao MAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20230023936
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shahaji B. MORE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLE REMOVAL METHOD IN SEMICONDUCTOR FABRICATION PROCESS
- Publication number 20230018029
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-MING TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING SEMICONDUCTOR MEMORY
- Publication number 20220328307
- Publication date Oct 13, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Haodong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20220319872
- Publication date Oct 6, 2022
- Showa Denko Materials Co., Ltd.
- Yuta AKASU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH METAL CAP LAYER AND METHOD FOR MANUFAC...
- Publication number 20220293765
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE HAVING A STRUCTURED METALLIZATION LAYER
- Publication number 20220285149
- Publication date Sep 8, 2022
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20220270926
- Publication date Aug 25, 2022
- TOKYO ELECTRON LIMITED
- Yasutaka MIZOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL
- Publication number 20220270871
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING IMPURITIES IN THIN FILM AND SUBSTRATE PROCESSIN...
- Publication number 20220230875
- Publication date Jul 21, 2022
- EUGENE TECHNOLOGY CO., LTD.
- Kyu Jin CHOI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLECULAR DOPING
- Publication number 20220216057
- Publication date Jul 7, 2022
- Consiglio Nazionale Delle Ricerche
- Rosaria Anna PUGLISI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220130689
- Publication date Apr 28, 2022
- TOKYO ELECTRON LIMITED
- Takashi UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION REMOVAL METHOD AND FILM-FORMING METHOD
- Publication number 20220064788
- Publication date Mar 3, 2022
- SHOWA DENKO K.K.
- Yosuke TANIMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PASSIVATION STRUCTURING AND PLATING FOR SEMICONDUCTOR DEVICES
- Publication number 20220059347
- Publication date Feb 24, 2022
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVEL PORTION TREATMENT AGENT COMPOSITION AND METHOD OF MANUFACTURI...
- Publication number 20220020582
- Publication date Jan 20, 2022
- Central Glass Company, Limited
- Yuki FUKUI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METHOD FOR FORMING SILICON DIOXIDE FILM AND METHOD FOR FORMING META...
- Publication number 20210391169
- Publication date Dec 16, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Jingwen LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD, METHOD OF REMOVING ETCHING RESIDUE, AND STORAGE MEDIUM
- Publication number 20210358761
- Publication date Nov 18, 2021
- Tokyo Electron Limited
- Nobuhiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Step Pre-Clean for Selective Metal Gap Fill
- Publication number 20210351032
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20210332477
- Publication date Oct 28, 2021
- Kokusai Electric Corporation
- Shin SONE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TRANSISTOR STRUCTURE WITH SILICIDE LAYER AND FABRICATING METHOD OF...
- Publication number 20210313447
- Publication date Oct 7, 2021
- UNITED MICROELECTRONICS CORP.
- HAO SU
- H01 - BASIC ELECTRIC ELEMENTS

in-situ cleaning after layer formation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device manufacturing method

Adhesion removal method and film-forming method

Particle removal method in semiconductor fabrication process

Semiconductor structure with metal cap layer and method for manufac...

Method for forming silicon dioxide film and method for forming meta...

Molecular doping

Method for removing impurities in thin film and substrate processin...

Methods for manufacturing semiconductor memory

Bevel portion treatment agent composition and method of manufacturi...

Multi-step pre-clean for selective metal gap fill

Apparatus and method for die stack flux removal

Method for forming semiconductor structure

Wafer treatment for achieving defect-free self-assembled monolayers

Method of manufacturing semiconductor device, substrate processing...

Method and composition for selectively modifying base material surface

Using sacrificial polymer materials in semiconductor processing

Freezing a sacrificial material in forming a semiconductor

Semiconductor structure with metal cap layer

Passivation structuring and plating for semiconductor devices

Multi-step pre-clean for selective metal gap fill

Method for processing product layer

Pattern-forming method and composition

Method for manufacturing SOI wafer

Ammonium fluoride pre-clean protection

Method and composition for selectively modifying base material surface

In situ vapor deposition polymerization to form polymers as precurs...

Removal of surface passivation

Systems and methods for inhibiting detectivity, metal particle cont...

Freezing a sacrificial material in forming a semiconductor

Method and composition for selectively modifying base material surface

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

PARTICLE REMOVAL METHOD IN SEMICONDUCTOR FABRICATION PROCESS

INORGANIC/HYBRID STRESS FILMS

PURIFIED SURFACE REGION OF AN OXIDE SEMICONDUCTOR, AND METHOD OF NE...

TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE...

CARRIER STRUCTURE AND METHODS OF FORMING THE SAME

III-V, II-VI IN-SITU COMPLIANT SUBSTRATE FORMATION

METHOD FOR REDUCING CONTACT RESISTANCE

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

Method for forming semiconductor structure

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

PARTICLE REMOVAL METHOD IN SEMICONDUCTOR FABRICATION PROCESS

METHODS FOR MANUFACTURING SEMICONDUCTOR MEMORY

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR STRUCTURE WITH METAL CAP LAYER AND METHOD FOR MANUFAC...

POWER SEMICONDUCTOR DEVICE HAVING A STRUCTURED METALLIZATION LAYER

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL

METHOD FOR REMOVING IMPURITIES IN THIN FILM AND SUBSTRATE PROCESSIN...

MOLECULAR DOPING

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

ADHESION REMOVAL METHOD AND FILM-FORMING METHOD

PASSIVATION STRUCTURING AND PLATING FOR SEMICONDUCTOR DEVICES

BEVEL PORTION TREATMENT AGENT COMPOSITION AND METHOD OF MANUFACTURI...

METHOD FOR FORMING SILICON DIOXIDE FILM AND METHOD FOR FORMING META...

ETCHING METHOD, METHOD OF REMOVING ETCHING RESIDUE, AND STORAGE MEDIUM

Multi-Step Pre-Clean for Selective Metal Gap Fill

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

TRANSISTOR STRUCTURE WITH SILICIDE LAYER AND FABRICATING METHOD OF...