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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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in-situ cleaning after layer formation
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Method for removing impurities in thin film and substrate processin...
Patent number
11,972,946
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Apr 30, 2024
Eugene Technology Co., Ltd.
Kyu Jin Choi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Methods for manufacturing semiconductor memory
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11,854,797
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Dec 26, 2023
Changxin Memory Technologies, Inc.
Haodong Liu
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Bevel portion treatment agent composition and method of manufacturi...
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11,817,310
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Nov 14, 2023
Central Glass Company, Limited
Yuki Fukui
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Multi-step pre-clean for selective metal gap fill
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11,776,806
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Oct 3, 2023
Applied Materials, Inc.
Xi Cen
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Apparatus and method for die stack flux removal
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11,756,805
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Sep 12, 2023
Veeco Instruments Inc.
John Taddei
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Method for forming semiconductor structure
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11,749,741
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Sep 5, 2023
United Microelectronics Corp.
Zhe Wang
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Wafer treatment for achieving defect-free self-assembled monolayers
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11,735,420
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Aug 22, 2023
Applied Materials, Inc.
Chang Ke
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Method of manufacturing semiconductor device, substrate processing...
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11,735,412
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Aug 22, 2023
Kokusai Electric Corporation
Atsushi Sano
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Method and composition for selectively modifying base material surface
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11,705,331
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Jul 18, 2023
JSR Corporation
Hiroyuki Komatsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Using sacrificial polymer materials in semiconductor processing
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11,651,952
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May 16, 2023
Micron Technology, Inc.
Michael T. Andreas
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Freezing a sacrificial material in forming a semiconductor
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11,482,409
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Oct 25, 2022
Micron Technology, Inc.
Matthew S. Thorum
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Semiconductor structure with metal cap layer
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11,393,912
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Jul 19, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chung-Liang Cheng
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Passivation structuring and plating for semiconductor devices
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11,387,095
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Jul 12, 2022
Infineon Technologies Austria AG
Ravi Keshav Joshi
H01 - BASIC ELECTRIC ELEMENTS
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Multi-step pre-clean for selective metal gap fill
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11,380,536
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Jul 5, 2022
Applied Materials, Inc.
Xi Cen
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Method for processing product layer
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11,309,179
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Apr 19, 2022
Semiconductor Manufacturing International (Shanghai) Corporation
Hui Qu
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Pattern-forming method and composition
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11,270,883
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Mar 8, 2022
JSR Corporation
Hiroyuki Komatsu
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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Method for manufacturing SOI wafer
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11,244,851
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Feb 8, 2022
Shin-Etsu Handotai Co., Ltd.
Hiroji Aga
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Ammonium fluoride pre-clean protection
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11,232,947
Issue date
Jan 25, 2022
Taiwan Semiconductor Manufacturing Company Limited
Li-Wei Chu
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Method and composition for selectively modifying base material surface
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11,211,246
Issue date
Dec 28, 2021
JSR Corporation
Hiroyuki Komatsu
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In situ vapor deposition polymerization to form polymers as precurs...
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11,065,654
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Jul 20, 2021
Lam Research Corporation
Mark Kawaguchi
B08 - CLEANING
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Removal of surface passivation
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11,062,914
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Jul 13, 2021
ASM IP Holding B.V.
Antti Juhani Niskanen
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Systems and methods for inhibiting detectivity, metal particle cont...
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11,043,378
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Jun 22, 2021
Tokyo Electron Limited
Corey Lemley
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Freezing a sacrificial material in forming a semiconductor
Patent number
10,957,530
Issue date
Mar 23, 2021
Micron Technology, Inc.
Matthew S. Thorum
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Method and composition for selectively modifying base material surface
Patent number
10,950,438
Issue date
Mar 16, 2021
JSR Corporation
Hiroyuki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
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Using sacrificial polymer materials in semiconductor processing
Patent number
10,916,418
Issue date
Feb 9, 2021
Micron Technology, Inc.
Michael T. Andreas
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Sulfur-containing thin films
Patent number
10,854,444
Issue date
Dec 1, 2020
ASM IP Holding B.V.
Suvi P. Haukka
H01 - BASIC ELECTRIC ELEMENTS
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Method for forming metal cap layers to improve performance of semic...
Patent number
10,818,768
Issue date
Oct 27, 2020
Taiwan Semiconductor Manufacturing Co., Ltd
Chung-Liang Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing semiconductor device, substrate processing...
Patent number
10,790,136
Issue date
Sep 29, 2020
Kokusai Electric Corporation
Tatsuru Matsuoka
H01 - BASIC ELECTRIC ELEMENTS
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Wafer treatment for achieving defect-free self-assembled monolayers
Patent number
10,770,292
Issue date
Sep 8, 2020
Applied Materials, Inc.
Chang Ke
H01 - BASIC ELECTRIC ELEMENTS
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Insulating layer structure for semiconductor product, and preparati...
Patent number
10,748,989
Issue date
Aug 18, 2020
Shenyang Silicon Technology Co., Ltd.
Wenlin Gao
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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METHOD FOR REDUCING CONTACT RESISTANCE
Publication number
20240105464
Publication date
Mar 28, 2024
Shanghai Huali Integrated Circuit Corporation
Wensheng Xu
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20230343580
Publication date
Oct 26, 2023
Kokusai Electric Corporation
Atsushi SANO
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Method for forming semiconductor structure
Publication number
20230070135
Publication date
Mar 9, 2023
UNITED MICROELECTRONICS CORP.
ZHE WANG
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230036388
Publication date
Feb 2, 2023
Sumitomo Electric Industries, Ltd.
Isao MAKABE
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
Publication number
20230023936
Publication date
Jan 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shahaji B. MORE
H01 - BASIC ELECTRIC ELEMENTS
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PARTICLE REMOVAL METHOD IN SEMICONDUCTOR FABRICATION PROCESS
Publication number
20230018029
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing company Ltd.
CHIH-MING TSAO
H01 - BASIC ELECTRIC ELEMENTS
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METHODS FOR MANUFACTURING SEMICONDUCTOR MEMORY
Publication number
20220328307
Publication date
Oct 13, 2022
CHANGXIN MEMORY TECHNOLOGIES, INC.
Haodong LIU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20220319872
Publication date
Oct 6, 2022
Showa Denko Materials Co., Ltd.
Yuta AKASU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE WITH METAL CAP LAYER AND METHOD FOR MANUFAC...
Publication number
20220293765
Publication date
Sep 15, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
POWER SEMICONDUCTOR DEVICE HAVING A STRUCTURED METALLIZATION LAYER
Publication number
20220285149
Publication date
Sep 8, 2022
Infineon Technologies Austria AG
Ravi Keshav Joshi
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Publication number
20220270926
Publication date
Aug 25, 2022
TOKYO ELECTRON LIMITED
Yasutaka MIZOMOTO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILL
Publication number
20220270871
Publication date
Aug 25, 2022
Applied Materials, Inc.
Xi Cen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR REMOVING IMPURITIES IN THIN FILM AND SUBSTRATE PROCESSIN...
Publication number
20220230875
Publication date
Jul 21, 2022
EUGENE TECHNOLOGY CO., LTD.
Kyu Jin CHOI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
MOLECULAR DOPING
Publication number
20220216057
Publication date
Jul 7, 2022
Consiglio Nazionale Delle Ricerche
Rosaria Anna PUGLISI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Publication number
20220130689
Publication date
Apr 28, 2022
TOKYO ELECTRON LIMITED
Takashi UNO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ADHESION REMOVAL METHOD AND FILM-FORMING METHOD
Publication number
20220064788
Publication date
Mar 3, 2022
SHOWA DENKO K.K.
Yosuke TANIMOTO
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
PASSIVATION STRUCTURING AND PLATING FOR SEMICONDUCTOR DEVICES
Publication number
20220059347
Publication date
Feb 24, 2022
Ravi Keshav Joshi
H01 - BASIC ELECTRIC ELEMENTS
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BEVEL PORTION TREATMENT AGENT COMPOSITION AND METHOD OF MANUFACTURI...
Publication number
20220020582
Publication date
Jan 20, 2022
Central Glass Company, Limited
Yuki FUKUI
C07 - ORGANIC CHEMISTRY
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METHOD FOR FORMING SILICON DIOXIDE FILM AND METHOD FOR FORMING META...
Publication number
20210391169
Publication date
Dec 16, 2021
CHANGXIN MEMORY TECHNOLOGIES, INC
Jingwen LU
H01 - BASIC ELECTRIC ELEMENTS
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ETCHING METHOD, METHOD OF REMOVING ETCHING RESIDUE, AND STORAGE MEDIUM
Publication number
20210358761
Publication date
Nov 18, 2021
Tokyo Electron Limited
Nobuhiro TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Multi-Step Pre-Clean for Selective Metal Gap Fill
Publication number
20210351032
Publication date
Nov 11, 2021
Applied Materials, Inc.
Xi Cen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
Publication number
20210332477
Publication date
Oct 28, 2021
Kokusai Electric Corporation
Shin SONE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
TRANSISTOR STRUCTURE WITH SILICIDE LAYER AND FABRICATING METHOD OF...
Publication number
20210313447
Publication date
Oct 7, 2021
UNITED MICROELECTRONICS CORP.
HAO SU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FREEZING A SACRIFICIAL MATERIAL IN FORMING A SEMICONDUCTOR
Publication number
20210225637
Publication date
Jul 22, 2021
Micron Technology, Inc.
Matthew S. Thorum
B81 - MICRO-STRUCTURAL TECHNOLOGY
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APPARATUS AND METHOD FOR DIE STACK FLUX REMOVAL
Publication number
20210202272
Publication date
Jul 1, 2021
VEECO INSTRUMENTS INC.
John Taddei
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Application
METHOD AND COMPOSITION FOR SELECTIVELY MODIFYING BASE MATERIAL SURFACE
Publication number
20210166935
Publication date
Jun 3, 2021
JSR Corporation
Hiroyuki Komatsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Patent Application
USING SACRIFICIAL POLYMER MATERIALS IN SEMICONDUCTOR PROCESSING
Publication number
20210159069
Publication date
May 27, 2021
Micron Technology, Inc.
Michael T. Andreas
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patent Application
PATTERN-FORMING METHOD AND COMPOSITION
Publication number
20210082689
Publication date
Mar 18, 2021
JSR Corporation
Hiroyuki KOMATSU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE WITH METAL CAP LAYER
Publication number
20210043747
Publication date
Feb 11, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR PROCESSING PRODUCT LAYER
Publication number
20210013030
Publication date
Jan 14, 2021
Semiconductor Manufacturing International (Shanghai) Corporation
Hui QU
H01 - BASIC ELECTRIC ELEMENTS