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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/2733
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Patents Grants
last 30 patents
Information
Patent Grant
Low pressure sintering powder
Patent number
12,113,039
Issue date
Oct 8, 2024
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method of forming semiconductor packages having through package vias
Patent number
12,107,051
Issue date
Oct 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective transfer of micro devices
Patent number
12,075,565
Issue date
Aug 27, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming semiconductor packages having through package vias
Patent number
11,837,550
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,545
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,547
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,735,546
Issue date
Aug 22, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connection structure
Patent number
11,735,556
Issue date
Aug 22, 2023
Mikuni Electron Corporation
Sakae Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,302
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,728,306
Issue date
Aug 15, 2023
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electroconductive film, roll, connected structure, and process for...
Patent number
11,667,817
Issue date
Jun 6, 2023
SHOWA DENKO MATERIALS CO., LTD.
Takashi Tatsuzawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive bonding composition and method of use
Patent number
11,648,750
Issue date
May 16, 2023
Immunolight, LLC
Zakaryae Fathi
B32 - LAYERED PRODUCTS
Information
Patent Grant
Adhesive for semiconductor device, and high productivity method for...
Patent number
11,608,455
Issue date
Mar 21, 2023
SHOWA DENKO MATERIALS CO., LTD.
Kazutaka Honda
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Semiconductor devices and methods of making the same
Patent number
11,557,530
Issue date
Jan 17, 2023
Semiconductor Components Industries, LLC
Swee Har Khor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
11,508,694
Issue date
Nov 22, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective micro device transfer to receiver substrate
Patent number
11,476,216
Issue date
Oct 18, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sintering materials and attachment methods using same
Patent number
11,389,865
Issue date
Jul 19, 2022
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Anisotropic conductive film and production method of the same
Patent number
11,195,813
Issue date
Dec 7, 2021
Dexerials Corporation
Reiji Tsukao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connection structure
Patent number
11,133,279
Issue date
Sep 28, 2021
Mikuni Electron Corporation
Sakae Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment method, method for connecting electronic component, metho...
Patent number
11,049,842
Issue date
Jun 29, 2021
Dexerials Corporation
Yasushi Akutsu
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Low pressure sintering powder
Patent number
10,998,284
Issue date
May 4, 2021
Alpha Assembly Solutions Inc.
Shamik Ghoshal
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method of forming semiconductor packages having through package vias
Patent number
10,964,641
Issue date
Mar 30, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
Patent number
10,943,879
Issue date
Mar 9, 2021
Dexerials Corporation
Yasushi Akutsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packaging structure and process
Patent number
10,867,835
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Lin Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stack assembly using an edge separation structure for connectiv...
Patent number
10,854,581
Issue date
Dec 1, 2020
Littelfuse, Inc.
Elmar Wisotzki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic electrically conductive film, method for producing same...
Patent number
10,832,830
Issue date
Nov 10, 2020
Dexerials Corporation
Tomoyuki Ishimatsu
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Electronic element and electronic device comprising the same
Patent number
10,825,787
Issue date
Nov 3, 2020
Innolux Corporation
Wei-Cheng Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connection structure
Patent number
10,804,235
Issue date
Oct 13, 2020
Mikuni Electron Corporation
Sakae Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
Patent number
10,770,333
Issue date
Sep 8, 2020
Semiconductor Components Industries, LLC
Darrell D. Truhitte
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
Patent number
10,770,332
Issue date
Sep 8, 2020
Semiconductor Components Industries, LLC
Darrell D. Truhitte
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SOLDERABLE ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240266311
Publication date
Aug 8, 2024
INFINEON TECHNOLOGIES AG
Alexander Roth
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
Publication number
20230378075
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMBER, CONDUCTIVE LAYER, METHOD FOR MANUFACTURING MEMBER, AND METH...
Publication number
20230307407
Publication date
Sep 28, 2023
Tohru YASHIRO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
Publication number
20230290751
Publication date
Sep 14, 2023
SAMSUNG DISPLAY CO., LTD.
Joo Nyung JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
Publication number
20230191747
Publication date
Jun 22, 2023
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
Publication number
20230137299
Publication date
May 4, 2023
Showa Denko Materials Co., Ltd.
Takashi TATSUZAWA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20220254745
Publication date
Aug 11, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20220139856
Publication date
May 5, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20220139857
Publication date
May 5, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20220130783
Publication date
Apr 28, 2022
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20220045027
Publication date
Feb 10, 2022
Panasonic Intellectual Property Management Co., Ltd.
SHOZO OCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE
Publication number
20210398931
Publication date
Dec 23, 2021
MIKUNI ELECTRON CORPORATION
SAKAE TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20210327739
Publication date
Oct 21, 2021
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20210327740
Publication date
Oct 21, 2021
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
Publication number
20210233854
Publication date
Jul 29, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
Publication number
20200365552
Publication date
Nov 19, 2020
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
Publication number
20200350281
Publication date
Nov 5, 2020
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE
Publication number
20200343211
Publication date
Oct 29, 2020
MIKUNI ELECTRON CORPORATION
SAKAE TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED-BRIDGE SUBSTRATE CONNECTORS AND METHODS OF ASSEMBLING SAME
Publication number
20200328182
Publication date
Oct 15, 2020
Intel IP Corporation
Bernd WAIDHAS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Stack Assembly Using An Edge Separation Structure For Connectiv...
Publication number
20200266174
Publication date
Aug 20, 2020
LITTELFUSE, INC.
Elmar Wisotzki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Publication number
20200248040
Publication date
Aug 6, 2020
DUPONT ELECTRONICS, INC.
Yumi Matsuura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
Publication number
20200219848
Publication date
Jul 9, 2020
INFINEON TECHNOLOGIES AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
Publication number
20200152352
Publication date
May 14, 2020
DEXERIALS CORPORATION
Tomoyuki ISHIMATSU
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ANISOTROPIC CONDUCTIVE FILM
Publication number
20200144214
Publication date
May 7, 2020
DEXERIALS CORPORATION
Yasushi AKUTSU
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
CONNECTION STRUCTURE
Publication number
20200098718
Publication date
Mar 26, 2020
Mikuni Electron Corporation
SAKAE TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MA...
Publication number
20200095481
Publication date
Mar 26, 2020
Hitachi Chemical Company, Ltd.
Kazutaka HONDA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
Publication number
20190341364
Publication date
Nov 7, 2019
Immunolight, LLC
Zakaryae Fathi
B32 - LAYERED PRODUCTS
Information
Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
Publication number
20190311988
Publication date
Oct 10, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
Publication number
20190237424
Publication date
Aug 1, 2019
Mikuni Electron Corporation
SAKAE TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NANOSCALE INTERCONNECT ARRAY FOR STACKED DIES
Publication number
20190237437
Publication date
Aug 1, 2019
Invensas Corporation
Liang Wang
H01 - BASIC ELECTRIC ELEMENTS