in the lower part of the bonding apparatus

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H01L2224/75265

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75265in the lower part of the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,894,337
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of power semiconductor device, power semicondu...
- Patent number 11,121,116
- Issue date Sep 14, 2021
- Mitsubishi Electric Corporation
- Keisuke Kawamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,422
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chucks having individually-controllable regions, and associate...
- Patent number 10,770,421
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating and cooling device
- Patent number 10,583,510
- Issue date Mar 10, 2020
- Fuji Electric Co., Ltd.
- Shoji Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a chip assembly with a die attach liquid
- Patent number 9,837,381
- Issue date Dec 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for directly bonding silicon to silicon or silicon carbide...
- Patent number 9,741,685
- Issue date Aug 22, 2017
- Lam Research Corporation
- Jihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a composite and a power semiconductor module
- Patent number 9,688,060
- Issue date Jun 27, 2017
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...
- Publication number 20220157773
- Publication date May 19, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE, POWER SEMICONDU...
- Publication number 20200235072
- Publication date Jul 23, 2020
- Mitsubishi Electric Corporation
- Keisuke KAWAMOTO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212002
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...
- Publication number 20200212003
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- B32 - LAYERED PRODUCTS
Information Patent Application
METHODS FOR DIRECTLY BONDING SILICON TO SILICON OR SILICON CARBIDE...
- Publication number 20170040284
- Publication date Feb 9, 2017
- LAM RESEARCH CORPORATION
- Jihong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Composite and a Power Semiconductor Module
- Publication number 20130203218
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- B32 - LAYERED PRODUCTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure sintering device and method for manufacturing an electroni...

Manufacturing method of power semiconductor device, power semicondu...

Chip assembly

Manufacturing method of power semiconductor device, power semicondu...

Bond chucks having individually-controllable regions, and associate...

Bond chucks having individually-controllable regions, and associate...

Chip assembly

Heating and cooling device

Thermo-compression bonding system, subsystems, and methods of use

Method of forming a chip assembly with a die attach liquid

UV-curable anisotropic conductive adhesive

Methods for directly bonding silicon to silicon or silicon carbide...

Method for producing a composite and a power semiconductor module

Patents Applicationslast 30 patents

PRESSURE SINTERING DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONI...

MANUFACTURING METHOD OF POWER SEMICONDUCTOR DEVICE, POWER SEMICONDU...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

BOND CHUCKS HAVING INDIVIDUALLY-CONTROLLABLE REGIONS, AND ASSOCIATE...

METHODS FOR DIRECTLY BONDING SILICON TO SILICON OR SILICON CARBIDE...

Method for Producing a Composite and a Power Semiconductor Module