in the lower part of the bonding apparatus

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H01L2224/78701

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78701in the lower part of the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and alignment method
- Patent number 12,080,679
- Issue date Sep 3, 2024
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping system, wire bonding machine, and method for bonding wires
- Patent number 10,770,423
- Issue date Sep 8, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 10,262,968
- Issue date Apr 16, 2019
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Positioning system
- Patent number 9,076,856
- Issue date Jul 7, 2015
- Lite-On Electronics (Guangzhou) Limited
- Yan-Yi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 9,070,762
- Issue date Jun 30, 2015
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 8,752,751
- Issue date Jun 17, 2014
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,508,054
- Issue date Mar 24, 2009
- Hitachi, Ltd.
- Fujiaki Nose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 6,924,549
- Issue date Aug 2, 2005
- Hitachi, Ltd.
- Fujiaki Nose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-Y table for bonding devices
- Patent number 5,157,985
- Issue date Oct 27, 1992
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND ALIGNMENT METHOD
- Publication number 20240105673
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20180090464
- Publication date Mar 29, 2018
- SHINKAWA LTD.
- Shigeru HAYATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140217152
- Publication date Aug 7, 2014
- ASM Technology Singapore Pte Ltd
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140014708
- Publication date Jan 16, 2014
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POSITIONING SYSTEM
- Publication number 20130201465
- Publication date Aug 8, 2013
- Lite-On Technology Corporation
- YAN-YI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20050233501
- Publication date Oct 20, 2005
- Hitachi, Ltd.
- Fujiaki Nose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040041250
- Publication date Mar 4, 2004
- Hitachi, Ltd.
- Fujiaki Nose
- H01 - BASIC ELECTRIC ELEMENTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and alignment method

Clamping system, wire bonding machine, and method for bonding wires

Wire bonding apparatus and wire bonding method

Positioning system

Lead frame support plate and window clamp for wire bonding machines

Lead frame support plate and window clamp for wire bonding machines

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

X-Y table for bonding devices

Patents Applicationslast 30 patents

BONDING APPARATUS AND ALIGNMENT METHOD

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

POSITIONING SYSTEM

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same