in the lower part of the bonding apparatus

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H01L2224/76701

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/76701in the lower part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents