in the lower part of the bonding apparatus

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H01L2224/78744

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78744in the lower part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Frame feeder
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- Shinkawa Ltd.
- Kazuaki Nagano
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Information Patent Grant
Device and method for positioning first object in relation to secon...
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Information Patent Grant
Methods and apparatus for improved bonding
- Patent number 10,050,009
- Issue date Aug 14, 2018
- Semiconductor Components Industries, LLC
- Nobuhisa Onai
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Patents Applicationslast 30 patents

Information Patent Application
FRAME FEEDER
- Publication number 20210242045
- Publication date Aug 5, 2021
- SHINKAWA LTD.
- Kazuaki NAGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IMPROVED BONDING
- Publication number 20170077061
- Publication date Mar 16, 2017
- Semiconductor Components Industries, LLC
- Nobuhisa ONAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING ASSEMBLY AND METHOD
- Publication number 20140239473
- Publication date Aug 28, 2014
- TEXAS INSTRUMENTS INCORPORATED
- MengThee Chia
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