in the lower part of the bonding apparatus

Industry

CPC
H01L2224/75755

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75755in the lower part of the bonding apparatus

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus, manufacturing system, and semiconducto...
- Patent number 11,776,931
- Issue date Oct 3, 2023
- Kioxia Corporation
- Sho Kawadahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach systems including a verification substrate
- Patent number 11,574,832
- Issue date Feb 7, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing a semiconductor device
- Patent number 11,227,779
- Issue date Jan 18, 2022
- ASM Technology Singapore Pte. Ltd.
- Jiapei Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positioning device
- Patent number 11,075,102
- Issue date Jul 27, 2021
- Suss MicroTec Lithography GmbH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,692,783
- Issue date Jun 23, 2020
- KULICKE AND SOFFA, INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stacking devices in an integrated circuit...
- Patent number 10,515,838
- Issue date Dec 24, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guiding board for a ball placement machine
- Patent number 10,369,648
- Issue date Aug 6, 2019
- Horng Terng Automation Co., Ltd.
- Eric Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus
- Patent number 10,181,451
- Issue date Jan 15, 2019
- Shinkawa Ltd.
- Akira Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 9,892,952
- Issue date Feb 13, 2018
- Semiconductor Components Industries, LLC
- Darrell Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method
- Patent number 9,780,514
- Issue date Oct 3, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Mimura
- G02 - OPTICS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 9,016,342
- Issue date Apr 28, 2015
- Apic Yamada Corporation
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic thermal joint for high power density chips
- Patent number 8,368,205
- Issue date Feb 5, 2013
- Oracle America, Inc.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compressive bonding with separate die-attach and reflow pro...
- Patent number 8,317,077
- Issue date Nov 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compressive bonding with separate die-attach and reflow pro...
- Patent number 8,104,666
- Issue date Jan 31, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 8,039,757
- Issue date Oct 18, 2011
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compression bonding device
- Patent number 8,011,407
- Issue date Sep 6, 2011
- Sony Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,754,534
- Issue date Jul 13, 2010
- Fujitsu Semiconductor Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compression bonding device and a mounting method
- Patent number 7,736,459
- Issue date Jun 15, 2010
- Sony Corporation
- Takashi Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component
- Patent number 7,350,685
- Issue date Apr 1, 2008
- Fujitsu Limited
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 7,159,310
- Issue date Jan 9, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,794,273
- Issue date Sep 21, 2004
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of attaching a conformal chip carrier to a flip chip
- Patent number 6,524,888
- Issue date Feb 25, 2003
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE HOLDER AND BONDING SYSTEM
- Publication number 20240014167
- Publication date Jan 11, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20230148420
- Publication date May 11, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220077103
- Publication date Mar 10, 2022
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...
- Publication number 20210074670
- Publication date Mar 11, 2021
- Kioxia Corporation
- Sho KAWADAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20200075381
- Publication date Mar 5, 2020
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...
- Publication number 20190088527
- Publication date Mar 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
- Publication number 20190080939
- Publication date Mar 14, 2019
- ASM Technology Singapore Pte Ltd
- Jiapei DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING DEVICE
- Publication number 20180138070
- Publication date May 17, 2018
- SUSS MICROTEC LITHOGRAPHY GMBH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180090395
- Publication date Mar 29, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS
- Publication number 20170154865
- Publication date Jun 1, 2017
- SHINKAWA LTD.
- Akira SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD
- Publication number 20120279653
- Publication date Nov 8, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120247664
- Publication date Oct 4, 2012
- Kazuhiko KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Compressive Bonding with Separate Die-Attach and Reflow Pro...
- Publication number 20120111922
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compression bonding device
- Publication number 20090314437
- Publication date Dec 24, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
Compression bonding device and a mounting method
- Publication number 20090032570
- Publication date Feb 5, 2009
- SONY CHEMICAL & INFORMAION DEVICE CORPORATION
- Takashi Matsumura
- B30 - PRESSES
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20080261336
- Publication date Oct 23, 2008
- Fujitsu Limited
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic part mounting substrate and method for producing same
- Publication number 20070089291
- Publication date Apr 26, 2007
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of mounting electronic component
- Publication number 20060091185
- Publication date May 4, 2006
- FUJITSU LIMITED
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic part mounting substrate and method for producing same
- Publication number 20050047101
- Publication date Mar 3, 2005
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040232549
- Publication date Nov 25, 2004
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030219969
- Publication date Nov 27, 2003
- FUJITSU LIMITED
- Nobukatsu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for assembling a conformal chip carrier to a f...
- Publication number 20020096746
- Publication date Jul 25, 2002
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A F...
- Publication number 20010019174
- Publication date Sep 6, 2001
- DAVID N. COKELY
- H01 - BASIC ELECTRIC ELEMENTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Substrate bonding apparatus, manufacturing system, and semiconducto...

Bonding of bridge to multiple semiconductor chips

Die attach systems including a verification substrate

Ultrasonic-assisted solder transfer

Systems and methods for bonding semiconductor elements

Apparatus and method for processing a semiconductor device

Positioning device

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Systems and methods for bonding semiconductor elements

Method and apparatus for stacking devices in an integrated circuit...

Guiding board for a ball placement machine

Wafer level flat no-lead semiconductor packages and methods of manu...

Electronic component mounting apparatus

Wafer level flat no-lead semiconductor packages and methods of manu...

Component mounting method

Bonding apparatus and bonding method

Metallic thermal joint for high power density chips

Thermal compressive bonding with separate die-attach and reflow pro...

Thermal compressive bonding with separate die-attach and reflow pro...

Electronic part mounting substrate and method for producing same

Compression bonding device

Semiconductor device and manufacturing method thereof

Compression bonding device and a mounting method

Method of mounting electronic component

Electronic part mounting substrate and method for producing same

Semiconductor device and manufacturing method thereof

Method of attaching a conformal chip carrier to a flip chip

Patents Applicationslast 30 patents

SUBSTRATE HOLDER AND BONDING SYSTEM

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

ULTRASONIC-ASSISTED SOLDER TRANSFER

SUBSTRATE BONDING APPARATUS, MANUFACTURING SYSTEM, AND SEMICONDUCTO...

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...

APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

POSITIONING DEVICE

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

ELECTRONIC COMPONENT MOUNTING APPARATUS

HEATING APPARATUS AND IMPLEMENTED BODY MANUFACTURING METHOD

BONDING APPARATUS AND BONDING METHOD

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

Thermal Compressive Bonding with Separate Die-Attach and Reflow Pro...

Compression bonding device

Compression bonding device and a mounting method

Semiconductor device and manufacturing method thereof

Electronic part mounting substrate and method for producing same

Method of mounting electronic component

Electronic part mounting substrate and method for producing same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Method and apparatus for assembling a conformal chip carrier to a f...

METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A F...