in the lower part of the bonding apparatus

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H01L2224/77704

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/77704in the lower part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Window clamp
- Patent number 9,997,490
- Issue date Jun 12, 2018
- Texas Instruments Incorporated
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE
- Publication number 20230395555
- Publication date Dec 7, 2023
- HYUNDAI MOBIS CO., LTD.
- Se Min PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261568
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261567
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS