in the lower part of the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75704in the lower part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,742,321
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Uniform pressure gang bonding method
- Patent number 11,637,082
- Issue date Apr 25, 2023
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for uniform pressure gang bonding
- Patent number 11,152,328
- Issue date Oct 19, 2021
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Positioning device
- Patent number 11,075,102
- Issue date Jul 27, 2021
- Suss MicroTec Lithography GmbH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,031,369
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for securing a bonding product in a working region of a bonder
- Patent number 11,017,554
- Issue date May 25, 2021
- Hesse GmbH
- Hans-Juergen Hesse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretching retention plate for electronic assemblies
- Patent number 10,825,714
- Issue date Nov 3, 2020
- Intel Corporation
- Daniel Chavez-Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for the material-bonded connection of connection partners...
- Patent number 10,603,741
- Issue date Mar 31, 2020
- Semikron Elektronik GmbH & Co., KG
- Ingo Bogen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 10,497,667
- Issue date Dec 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,090,234
- Issue date Oct 2, 2018
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dynamic alignment of semiconductor devices
- Patent number 10,041,973
- Issue date Aug 7, 2018
- Infineon Technologies AG
- Nee Wan Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal clamping fixture to maintain laminate flatness during chi...
- Patent number 9,735,041
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Donald A. Merte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Universal clamping fixture to maintain laminate flatness during chi...
- Patent number 9,716,028
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Donald A. Merte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and substrate manufacturing equipment including t...
- Patent number 9,553,069
- Issue date Jan 24, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping mechanism for processing of a substrate within a substrate...
- Patent number 9,443,819
- Issue date Sep 13, 2016
- Apple Inc.
- Gerard Anthony C. Afable
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of joining a chip on a substrate
- Patent number 9,393,633
- Issue date Jul 19, 2016
- GLOBALFOUNDRIES Inc.
- Pascal P Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dense-pitch small-pad copper wire bonded double IC chip stack packa...
- Patent number 9,312,242
- Issue date Apr 12, 2016
- TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
- Wei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing flip chip semiconductor packages using dou...
- Patent number 9,252,130
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 9,016,342
- Issue date Apr 28, 2015
- Apic Yamada Corporation
- Kazuhiko Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming packages
- Patent number 8,603,860
- Issue date Dec 10, 2013
- Taiwan Semiconductor Manufacturing Company, L.L.C.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with plank stack of semiconductor dies
- Patent number 8,390,109
- Issue date Mar 5, 2013
- Oracle America, Inc.
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing electronic integrated circui...
- Patent number 7,964,444
- Issue date Jun 21, 2011
- International Business Machines Corporation
- Sri M. Sri-Jayantha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic device
- Patent number 7,605,021
- Issue date Oct 20, 2009
- Fujitsu Limited
- Hiroshi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3887997
- Patent number 3,887,997
- Issue date Jun 10, 1975
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220077103
- Publication date Mar 10, 2022
- Fuji Electric Co., Ltd.
- Narumi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR LASER BONDING OF FLIP CHIP
- Publication number 20220052019
- Publication date Feb 17, 2022
- PROTEC CO., LTD.
- YOUN SUNG KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20210272928
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BOND WAVE PROPAGATION CONTROL
- Publication number 20200051950
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SECURING A BONDING PRODUCT IN A WORKING REGION OF A BONDER
- Publication number 20190355146
- Publication date Nov 21, 2019
- Hesse GmbH
- Hans-Juergen HESSE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20190027462
- Publication date Jan 24, 2019
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING DEVICE
- Publication number 20180138070
- Publication date May 17, 2018
- SUSS MICROTEC LITHOGRAPHY GMBH
- Sven Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
SINTERING DEVICE
- Publication number 20170229418
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING T...
- Publication number 20160118362
- Publication date Apr 28, 2016
- Samsung Electronics Co., Ltd.
- ILYOUNG HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Manufacturing Flip Chip Semiconductor Packages Using Dou...
- Publication number 20140295618
- Publication date Oct 2, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL CLAMPING FIXTURE TO MAINTAIN LAMINATE FLATNESS DURING CHI...
- Publication number 20140239569
- Publication date Aug 28, 2014
- International Business Machines Corporation
- Donald A. Merte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method And System For A Semiconductor Device Package With A Die To...
- Publication number 20140134796
- Publication date May 15, 2014
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for Forming Packages
- Publication number 20130102112
- Publication date Apr 25, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF JOINING A CHIP ON A SUBSTRATE
- Publication number 20120292375
- Publication date Nov 22, 2012
- International Business Machines Corporation
- Pascal P. Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120247664
- Publication date Oct 4, 2012
- Kazuhiko KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF JOINING A CHIP ON A SUBSTRATE
- Publication number 20110049221
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Pascal P. Blais
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC INTEGRATED CIRCUI...
- Publication number 20080199986
- Publication date Aug 21, 2008
- Sri M. SRI-JAYANTHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of electronic device
- Publication number 20080176361
- Publication date Jul 24, 2008
- Fujitsu Limited
- Hiroshi Kobayashi
- G06 - COMPUTING CALCULATING COUNTING

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for bond wave propagation control

Uniform pressure gang bonding method

Method and apparatus for embedding semiconductor devices

System and method for uniform pressure gang bonding

Positioning device

Apparatus for bond wave propagation control

Method for securing a bonding product in a working region of a bonder

Stretching retention plate for electronic assemblies

Apparatus for the material-bonded connection of connection partners...

Method for bonding substrates together, and substrate bonding device

Apparatus for bond wave propagation control

Sintering device

Semiconductor device package and manufacturing method thereof

Method and apparatus for dynamic alignment of semiconductor devices

Method for bonding substrates

Bonding method, storage medium, bonding apparatus and bonding system

Universal clamping fixture to maintain laminate flatness during chi...

Universal clamping fixture to maintain laminate flatness during chi...

Bonding apparatus and substrate manufacturing equipment including t...

Clamping mechanism for processing of a substrate within a substrate...

Method of joining a chip on a substrate

Dense-pitch small-pad copper wire bonded double IC chip stack packa...

Methods of manufacturing flip chip semiconductor packages using dou...

Method for device packaging

Bonding apparatus and bonding method

Process for forming packages

Chip package with plank stack of semiconductor dies

Method and apparatus for manufacturing electronic integrated circui...

Manufacturing method of electronic device

3887997

Patents Applicationslast 30 patents

SOLDER REFLOW APPARATUS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SYSTEM FOR LASER BONDING OF FLIP CHIP

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

APPARATUS FOR BOND WAVE PROPAGATION CONTROL

METHOD FOR SECURING A BONDING PRODUCT IN A WORKING REGION OF A BONDER

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

POSITIONING DEVICE

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

SINTERING DEVICE

BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING T...

Methods of Manufacturing Flip Chip Semiconductor Packages Using Dou...

UNIVERSAL CLAMPING FIXTURE TO MAINTAIN LAMINATE FLATNESS DURING CHI...

Electrical Connecting Element and Method for Manufacturing the Same

Method And System For A Semiconductor Device Package With A Die To...

Process for Forming Packages

METHOD OF JOINING A CHIP ON A SUBSTRATE

BONDING APPARATUS AND BONDING METHOD

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...

METHOD OF JOINING A CHIP ON A SUBSTRATE

METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC INTEGRATED CIRCUI...

Manufacturing method of electronic device