in the lower part of the bonding apparatus

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H01L2224/78354

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78354in the lower part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method, semiconductor device, an...
- Patent number 9,887,174
- Issue date Feb 6, 2018
- Shinkawa Ltd.
- Naoki Sekine
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...
- Publication number 20160358880
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- H01 - BASIC ELECTRIC ELEMENTS