in the lower part of the bonding apparatus

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CPC
H01L2224/78704

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78704in the lower part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,818,581
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping system, wire bonding machine, and method for bonding wires
- Patent number 10,770,423
- Issue date Sep 8, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods of operating wire bonding machines including cl...
- Patent number 10,763,236
- Issue date Sep 1, 2020
- Kulicke and Soffa Industries, Inc.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of operating a wire bonding machine to improve clamping of...
- Patent number 10,541,223
- Issue date Jan 21, 2020
- Kulicke and Soffa Industries, Inc.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Window clamp
- Patent number 9,997,490
- Issue date Jun 12, 2018
- Texas Instruments Incorporated
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,530,723
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Akira Muto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 9,070,762
- Issue date Jun 30, 2015
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame support plate and window clamp for wire bonding machines
- Patent number 8,752,751
- Issue date Jun 17, 2014
- ASM Technology Singapore Pte. Ltd.
- Phui Phoong Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having improved adhesion between bonding and b...
- Patent number 7,449,786
- Issue date Nov 11, 2008
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for reducing oxidation of electronic devices
- Patent number 7,182,793
- Issue date Feb 27, 2007
- ASM Technology Singapore Pty Ltd.
- Rong Duan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device to provide improved...
- Patent number 7,049,214
- Issue date May 23, 2006
- Renesas Technology Corp.
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame retainer mount used in bonding machines
- Patent number 5,154,339
- Issue date Oct 13, 1992
- Kabushiki Kaisha Shinkawa
- Takashi Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hold-down clamp with mult-fingered interchangeable insert for wire...
- Patent number 5,035,034
- Issue date Jul 30, 1991
- Motorola, Inc.
- Garland D. Cotney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...
- Publication number 20190214363
- Publication date Jul 11, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Peter J. Klaerner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Window Clamp
- Publication number 20180261568
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Window Clamp
- Publication number 20180261567
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Maya Merto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140217152
- Publication date Aug 7, 2014
- ASM Technology Singapore Pte Ltd
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES
- Publication number 20140014708
- Publication date Jan 16, 2014
- Phui Phoong CHUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having improved adhesion between bonding and b...
- Publication number 20060138679
- Publication date Jun 29, 2006
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for reducing oxidation of electronic devices
- Publication number 20050161488
- Publication date Jul 28, 2005
- ASM Technology Singapore Pte Ltd
- Rong Duan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a semiconductor device to provide improved...
- Publication number 20050035449
- Publication date Feb 17, 2005
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bond clamp design and lead frame capable of engaging with same

Method of manufacturing semiconductor device and semiconductor device

Clamping system, wire bonding machine, and method for bonding wires

Systems and methods of operating wire bonding machines including cl...

Methods of operating a wire bonding machine to improve clamping of...

Window clamp

Semiconductor device and manufacturing method thereof

Lead frame support plate and window clamp for wire bonding machines

Lead frame support plate and window clamp for wire bonding machines

Semiconductor device having improved adhesion between bonding and b...

System for reducing oxidation of electronic devices

Method of manufacturing a semiconductor device to provide improved...

Frame retainer mount used in bonding machines

Hold-down clamp with mult-fingered interchangeable insert for wire...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CL...

Window Clamp

Window Clamp

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

LEAD FRAME SUPPORT PLATE AND WINDOW CLAMP FOR WIRE BONDING MACHINES

Semiconductor device having improved adhesion between bonding and b...

System for reducing oxidation of electronic devices

Method of manufacturing a semiconductor device to provide improved...