in the lower part of the bonding apparatus

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H01L2224/78251

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78251in the lower part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Frame feeder
- Patent number 11,315,808
- Issue date Apr 26, 2022
- Shinkawa Ltd.
- Kazuaki Nagano
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping system, wire bonding machine, and method for bonding wires
- Patent number 10,770,423
- Issue date Sep 8, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method
- Patent number 10,600,754
- Issue date Mar 24, 2020
- Kaijo Corporation
- Hideki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating a wire bonding machine to improve clamping of...
- Patent number 10,541,223
- Issue date Jan 21, 2020
- Kulicke and Soffa Industries, Inc.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Multi-functional detachable and replaceable wire bonding heating plate
- Patent number 9,165,903
- Issue date Oct 20, 2015
- PRAM TECHNOLOGY INC.
- Wen-Long Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame feeding system and frame feeding method
- Patent number 8,965,572
- Issue date Feb 24, 2015
- Hitachi High-Tech Instruments Co., Ltd.
- Tatsuyuki Ohkubo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor packages with lead extensions and related methods
- Patent number 8,674,487
- Issue date Mar 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and method using the same
- Patent number 8,245,902
- Issue date Aug 21, 2012
- Samsung Electronics Co., Ltd.
- Yong-Je Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding wire and wire bonding method
- Patent number 8,102,061
- Issue date Jan 24, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus for connecting semiconductor devices
- Patent number 6,516,994
- Issue date Feb 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and wire bonding method of semiconductor device
- Patent number 6,454,158
- Issue date Sep 24, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiharu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 6,229,199
- Issue date May 8, 2001
- Rohm Co., Ltd.
- Kazutaka Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and apparatus for heat sensitive metallization...
- Patent number 6,031,216
- Issue date Feb 29, 2000
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of forming bump on electrode of semiconductor chip and appa...
- Patent number 5,060,843
- Issue date Oct 29, 1991
- NEC Corporation
- Tadao Yasuzato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME FEEDER
- Publication number 20210242045
- Publication date Aug 5, 2021
- SHINKAWA LTD.
- Kazuaki NAGANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
- Publication number 20200238433
- Publication date Jul 30, 2020
- KAIJO CORPORATION
- Yuji KOMAGINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangements and Method for Providing a Bond Connection
- Publication number 20190312008
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...
- Publication number 20180323167
- Publication date Nov 8, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Wong Hing Kuong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES
- Publication number 20170301644
- Publication date Oct 19, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qi LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME
- Publication number 20140374892
- Publication date Dec 25, 2014
- Yit Meng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-functional detachable and replaceable wire bonding heating plate
- Publication number 20140319199
- Publication date Oct 30, 2014
- Pram Technology Inc.
- Wen-Long Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING ASSEMBLY AND METHOD
- Publication number 20140239473
- Publication date Aug 28, 2014
- TEXAS INSTRUMENTS INCORPORATED
- MengThee Chia
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS
- Publication number 20130241041
- Publication date Sep 19, 2013
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Frame Feeding System and Frame Feeding Method
- Publication number 20130017040
- Publication date Jan 17, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Tatsuyuki OHKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATER BLOCK FOR WIRE BONDING SYSTEM
- Publication number 20120318853
- Publication date Dec 20, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND METHOD USING THE SAME
- Publication number 20120111923
- Publication date May 10, 2012
- Yong-Je Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
- Publication number 20100327450
- Publication date Dec 30, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus for connecting semiconductor devices
- Publication number 20010054640
- Publication date Dec 27, 2001
- Yoshiharu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Frame feeder

Bonding process with rotating bonding stage

Bonding apparatus with rotating bonding stage

Clamping system, wire bonding machine, and method for bonding wires

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding method

Methods of operating a wire bonding machine to improve clamping of...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Multi-functional detachable and replaceable wire bonding heating plate

Bonding wire for semiconductor device

Frame feeding system and frame feeding method

Semiconductor packages with lead extensions and related methods

Wire bonding apparatus and method using the same

Semiconductor device bonding wire and wire bonding method

Wire bonding apparatus for connecting semiconductor devices

Wire bonding apparatus and wire bonding method of semiconductor device

Packaged semiconductor device

Wire bonding methods and apparatus for heat sensitive metallization...

Process of forming bump on electrode of semiconductor chip and appa...

Patents Applicationslast 30 patents

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

FRAME FEEDER

BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM

Arrangements and Method for Providing a Bond Connection

BONDING METHOD

METHODS OF OPERATING A WIRE BONDING MACHINE TO IMPROVE CLAMPING OF...

CLAMPING SYSTEM, WIRE BONDING MACHINE, AND METHOD FOR BONDING WIRES

LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME

Multi-functional detachable and replaceable wire bonding heating plate

WIRE BONDING ASSEMBLY AND METHOD

SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS

Frame Feeding System and Frame Feeding Method

HEATER BLOCK FOR WIRE BONDING SYSTEM

WIRE BONDING APPARATUS AND METHOD USING THE SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

Wire bonding apparatus for connecting semiconductor devices