in the lower part of the bonding apparatus

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H01L2224/78755

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78755in the lower part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 7,508,054
- Issue date Mar 24, 2009
- Hitachi, Ltd.
- Fujiaki Nose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 6,924,549
- Issue date Aug 2, 2005
- Hitachi, Ltd.
- Fujiaki Nose
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20050233501
- Publication date Oct 20, 2005
- Hitachi, Ltd.
- Fujiaki Nose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20040041250
- Publication date Mar 4, 2004
- Hitachi, Ltd.
- Fujiaki Nose
- H01 - BASIC ELECTRIC ELEMENTS