in the lower part of the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75701in the lower part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate alignment device and a semiconductor substr...
- Patent number 12,027,401
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Gwanghee Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for connecting electronic assemblies
- Patent number 12,021,058
- Issue date Jun 25, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for and method for aligning dipoles and method of fabrica...
- Patent number 11,728,196
- Issue date Aug 15, 2023
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,692,783
- Issue date Jun 23, 2020
- KULICKE AND SOFFA, INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 9,968,020
- Issue date May 8, 2018
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for assembling a component with a flexible foi...
- Patent number 9,918,392
- Issue date Mar 13, 2018
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method
- Patent number 9,780,514
- Issue date Oct 3, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Mimura
- G02 - OPTICS
Information Patent Grant
Apparatus for mounting semiconductor chips
- Patent number 9,603,294
- Issue date Mar 21, 2017
- Esec AG
- Guido Suter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip support substrate, chip support method, three-dimensional inte...
- Patent number 9,449,948
- Issue date Sep 20, 2016
- Tohoku University
- Mitsumasa Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,418,979
- Issue date Aug 16, 2016
- Renssealer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip bonder and method of correcting flatness and deformation...
- Patent number 9,406,640
- Issue date Aug 2, 2016
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diodes and a method of packaging the same
- Patent number 9,245,875
- Issue date Jan 26, 2016
- Rensselaer Polytechnic Institute
- Robert F. Karlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip BGA assembly process
- Patent number 8,993,378
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems involving soldering
- Patent number 8,939,346
- Issue date Jan 27, 2015
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection components with rows of lead bond sections
- Patent number 5,959,354
- Issue date Sep 28, 1999
- Tessera, Inc.
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20240332249
- Publication date Oct 3, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGMIN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES
- Publication number 20240047413
- Publication date Feb 8, 2024
- PINK GMBH THERMOSYSTEME
- Christoph Oetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
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BONDING APPARATUS AND BONDING METHOD
- Publication number 20230378121
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE ALIGNMENT DEVICE AND A SEMICONDUCTOR SUBSTR...
- Publication number 20220068688
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Gwanghee JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20220005719
- Publication date Jan 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...
- Publication number 20210305201
- Publication date Sep 30, 2021
- SAMSUNG DISPLAY CO., LTD.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
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- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180090395
- Publication date Mar 29, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDER AND METHOD OF CORRECTING FLATNESS AND DEFORMATION...
- Publication number 20160043053
- Publication date Feb 11, 2016
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP SUPPORT SUBSTRATE, CHIP SUPPORT METHOD, THREE-DIMENSIONAL INTE...
- Publication number 20150228622
- Publication date Aug 13, 2015
- TOHOKU UNIVERSITY
- Mitsumasa Koyanagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus For Mounting Semiconductor Chips
- Publication number 20130133188
- Publication date May 30, 2013
- ESEC AG
- Guido Suter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication number 20130059416
- Publication date Mar 7, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Chih LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Systems Involving Soldering
- Publication number 20120205424
- Publication date Aug 16, 2012
- International Business Machines Corporation
- Julien Sylvestre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Alignment and Bonding System
- Publication number 20100122456
- Publication date May 20, 2010
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic element bonding with deformation of leads in rows
- Publication number 20010000032
- Publication date Mar 15, 2001
- John W. Smith
- H01 - BASIC ELECTRIC ELEMENTS

in the lower part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor substrate alignment device and a semiconductor substr...

System and method for connecting electronic assemblies

Bonding apparatus and method of fabricating display device using th...

Apparatus for and method for aligning dipoles and method of fabrica...

Apparatus, system, and method for handling aligned wafer pairs

Method and apparatus for embedding semiconductor devices

Systems and methods for bonding semiconductor elements

System and related techniques for handling aligned substrate pairs

Method for bonding wafers and bonding tool

Bonding system

Apparatus, system, and method for handling aligned wafer pairs

Mounting Method of a semiconductor device using a colored auxiliary...

Systems and methods for bonding semiconductor elements

Method for bonding substrates together, and substrate bonding device

Electronic-component mounting apparatus

Apparatus and method for manufacturing semiconductor device

Electronic-component mounting apparatus

Method and apparatus for assembling a component with a flexible foi...

Method for bonding substrates

Component mounting method

Apparatus for mounting semiconductor chips

Chip support substrate, chip support method, three-dimensional inte...

Light emitting diodes and a method of packaging the same

Flip chip bonder and method of correcting flatness and deformation...

Light emitting diodes and a method of packaging the same

Chip-on-wafer bonding method and bonding device, and structure comp...

Method for device packaging

Flip-chip BGA assembly process

Methods and systems involving soldering

Connection components with rows of lead bond sections

Patents Applicationslast 30 patents

BONDING APPARATUS AND BONDING METHOD USING THE SAME

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIES

BONDING APPARATUS

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

BONDING APPARATUS AND BONDING METHOD

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

SEMICONDUCTOR SUBSTRATE ALIGNMENT DEVICE AND A SEMICONDUCTOR SUBSTR...

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

BONDING APPARATUS AND METHOD OF FABRICATING DISPLAY DEVICE USING TH...

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

METHOD FOR BONDING WAFERS AND BONDING TOOL

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

FLIP CHIP BONDER AND METHOD OF CORRECTING FLATNESS AND DEFORMATION...

CHIP SUPPORT SUBSTRATE, CHIP SUPPORT METHOD, THREE-DIMENSIONAL INTE...

Apparatus For Mounting Semiconductor Chips

FLIP-CHIP BGA ASSEMBLY PROCESS

Methods and Systems Involving Soldering

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...

Integrated Alignment and Bonding System

Microelectronic element bonding with deformation of leads in rows