in the presence of a plasma [PECVD]

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H01L21/02274

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02274in the presence of a plasma [PECVD]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for forming metal-insulator-metal capacitors
- Patent number 12,369,336
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Liang Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal deposition of silicon carbide films using heterogeneous p...
- Patent number 12,359,311
- Issue date Jul 15, 2025
- Lam Research Corporation
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film stress control for plasma enhanced chemical vapor deposition
- Patent number 12,362,149
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,362,156
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Atsushi Kubo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for low temperature silicon nitride films
- Patent number 12,362,169
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Wenbo Yan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,362,170
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Zhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin atomic layer deposition film accuracy thickness control
- Patent number 12,354,871
- Issue date Jul 8, 2025
- Lam Research Corporation
- Jun Qian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Directional selective deposition
- Patent number 12,347,674
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Bhargav S. Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,347,645
- Issue date Jul 1, 2025
- Tokyo Electron Limited
- Shinya Morikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon precursor compounds and method for forming silicon-containi...
- Patent number 12,347,672
- Issue date Jul 1, 2025
- Entegris, Inc.
- Sungsil Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low stress films for advanced semiconductor applications
- Patent number 12,341,002
- Issue date Jun 24, 2025
- Lam Research Corporation
- Reza Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and semiconductor dev...
- Patent number 12,341,055
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jun-Nan Nian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote plasma ultraviolet enhanced deposition
- Patent number 12,334,317
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hai-Dang Trinh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Remote plasma based deposition of silicon carbide films using silic...
- Patent number 12,334,332
- Issue date Jun 17, 2025
- Lam Research Corporation
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF impedance matching network
- Patent number 12,334,306
- Issue date Jun 17, 2025
- ASM America, Inc.
- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power control for rf impedance matching network
- Patent number 12,334,307
- Issue date Jun 17, 2025
- ASM IP Holding B.V.
- Ronald Anthony Decker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, substrate processing apparatus, rec...
- Patent number 12,327,720
- Issue date Jun 10, 2025
- Kokusai Electric Corporation
- Toshiyuki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to reduce UNCD film roughness
- Patent number 12,327,733
- Issue date Jun 10, 2025
- Applied Materials, Inc.
- Vicknesh Sahmuganathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing substrate
- Patent number 12,325,919
- Issue date Jun 10, 2025
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film deposition process
- Patent number 12,322,591
- Issue date Jun 3, 2025
- ASM IP Holding B.V.
- Naoki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 12,322,590
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isotropic silicon nitride removal
- Patent number 12,315,739
- Issue date May 27, 2025
- Applied Materials, Inc.
- Mikhail Korolik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eliminating yield impact of stochastics in lithography
- Patent number 12,315,727
- Issue date May 27, 2025
- Lam Research Corporation
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having high breakdown voltage etch-stop layer
- Patent number 12,315,812
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming films with improved film quality
- Patent number 12,315,718
- Issue date May 27, 2025
- Applied Materials, Inc.
- Bhargav S. Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing etch stop layers
- Patent number 12,315,735
- Issue date May 27, 2025
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,308,208
- Issue date May 20, 2025
- Tokyo Electron Limited
- Shinya Morikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,310,043
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,308,241
- Issue date May 20, 2025
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME
- Publication number 20250239444
- Publication date Jul 24, 2025
- ASM IP HOLDING B.V.
- YoungChol Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Gapfill Process Using Pulsed High-Frequency Radio-Frequency (HFRF)...
- Publication number 20250230541
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Rui Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FILLING A GAP
- Publication number 20250232974
- Publication date Jul 17, 2025
- ASM IP HOLDING B.V.
- Sungdae Woo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...
- Publication number 20250233017
- Publication date Jul 17, 2025
- WONIK IPS CO., LTD.
- Chang Gyu SONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEAM PERFORMANCE IMPROVEMENT FOR LARGE AREA GAPFILL
- Publication number 20250230540
- Publication date Jul 17, 2025
- Applied Materials, Inc.
- Supriya Ghosh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20250226177
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ENHANCED DEUTERIUM MIGRATION
- Publication number 20250226203
- Publication date Jul 10, 2025
- Applied Materials, Inc.
- Madhu Santosh Kumar Mutyala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20250226207
- Publication date Jul 10, 2025
- Kokusai Electric Corporation
- Yasunobu KOSHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THIN FILM MODIFICATION COMPOSITION, METHOD OF FORMING THIN FILM USI...
- Publication number 20250214919
- Publication date Jul 3, 2025
- Soulbrain Co., LTD
- Seung Hyun LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES
- Publication number 20250207246
- Publication date Jun 26, 2025
- LAM RESEARCH CORPORATION
- Ian John CURTIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20250212495
- Publication date Jun 26, 2025
- IMEC vzw
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20250210524
- Publication date Jun 26, 2025
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING OF SEMICONDUCTOR ELEMENTS
- Publication number 20250210585
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...
- Publication number 20250210344
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Rio SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20250210345
- Publication date Jun 26, 2025
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Treating the Dielectric Films Under the Bottoms of Source/Drain Reg...
- Publication number 20250203969
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Hsiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NIT...
- Publication number 20250197996
- Publication date Jun 19, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20250201551
- Publication date Jun 19, 2025
- Kokusai Electric Corporation
- Kazuyuki OKUDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNABILITY OF DOPANT CONCENTRATION IN THIN HAFNIUM OXIDE FILMS
- Publication number 20250191908
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Golnaz Karbasian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM GAPFILL DEPOSITION ON SEMICONDUCTOR SUBSTRATES WITH VARYING...
- Publication number 20250191909
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Bharati Neelamraju
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Compositions and Methods Using Same for Deposition of Silicon-Conta...
- Publication number 20250188605
- Publication date Jun 12, 2025
- VERSUM MATERIALS US, LLC
- Jianheng Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20250191907
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- Ayuta SUZUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING SILICON NITRIDE FILM AND FILM FORMING APPARATUS
- Publication number 20250179625
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Munehito KAGAYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ORGANOAMINOSILANE PRECURSORS AND METHODS FOR DEPOSITING FILMS COMPR...
- Publication number 20250183029
- Publication date Jun 5, 2025
- VERSUM MATERIALS US, LLC
- Mark Leonard O'Neill
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Devices With Backside Air Gap Dielectric
- Publication number 20250185348
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SILICIDE FORMATION BLOCKING
- Publication number 20250183039
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Brian Ellingwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-EMITTING PLASMA FOR ACTIVATION IN PROCESSING CHAMBERS, AND RE...
- Publication number 20250183066
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Abbas RASTEGAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE INHIBITION ATOMIC LAYER DEPOSITION
- Publication number 20250179632
- Publication date Jun 5, 2025
- LAM RESEARCH CORPORATION
- Tao ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HARDWARE DESIGN WITH INDEPENDENT CONTROL TO IMPROVE WIW UNIFORMITY
- Publication number 20250179639
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Rupankar CHOUDHURY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TOPOLOGY SELECTIVE AND SACRIFICIAL SILICON NITRIDE LAYER FOR GENERA...
- Publication number 20250185338
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yang HO
- H01 - BASIC ELECTRIC ELEMENTS

in the presence of a plasma [PECVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for forming metal-insulator-metal capacitors

Conformal deposition of silicon carbide films using heterogeneous p...

Film stress control for plasma enhanced chemical vapor deposition

Substrate processing method and substrate processing apparatus

Methods and apparatus for low temperature silicon nitride films

Semiconductor device and method for forming the same

Ultrathin atomic layer deposition film accuracy thickness control

Directional selective deposition

Substrate processing method and substrate processing apparatus

Silicon precursor compounds and method for forming silicon-containi...

Low stress films for advanced semiconductor applications

Method of manufacturing semiconductor devices and semiconductor dev...

Remote plasma ultraviolet enhanced deposition

Remote plasma based deposition of silicon carbide films using silic...

RF impedance matching network

Power control for rf impedance matching network

Method of processing substrate, substrate processing apparatus, rec...

Methods to reduce UNCD film roughness

Apparatus for processing substrate

Thin film deposition process

Semiconductor device and method

Isotropic silicon nitride removal

Eliminating yield impact of stochastics in lithography

Semiconductor structure having high breakdown voltage etch-stop layer

Forming films with improved film quality

Methods for removing etch stop layers

Substrate processing method and substrate processing apparatus

Method of fabricating a semiconductor device

Semiconductor die, manufacturing method thereof, and semiconductor...

Plasma processing method and plasma processing apparatus

Patents Applicationslast 30 patents

STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME

Gapfill Process Using Pulsed High-Frequency Radio-Frequency (HFRF)...

METHOD OF FILLING A GAP

GAP-FILLING METHOD FOR A SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...

SEAM PERFORMANCE IMPROVEMENT FOR LARGE AREA GAPFILL

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

ENHANCED DEUTERIUM MIGRATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...

THIN FILM MODIFICATION COMPOSITION, METHOD OF FORMING THIN FILM USI...

REDUCING CAPACITANCE IN SEMICONDUCTOR DEVICES

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

MULTI-LAYER LINE STRUCTURE

DIRECT BONDING OF SEMICONDUCTOR ELEMENTS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE...

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

Treating the Dielectric Films Under the Bottoms of Source/Drain Reg...

LOW-K DIELECTRIC PROTECTION DURING PLASMA DEPOSITION OF SILICON NIT...

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

TUNABILITY OF DOPANT CONCENTRATION IN THIN HAFNIUM OXIDE FILMS

UNIFORM GAPFILL DEPOSITION ON SEMICONDUCTOR SUBSTRATES WITH VARYING...

Compositions and Methods Using Same for Deposition of Silicon-Conta...

FILM FORMING METHOD AND FILM FORMING APPARATUS

METHOD OF FORMING SILICON NITRIDE FILM AND FILM FORMING APPARATUS

ORGANOAMINOSILANE PRECURSORS AND METHODS FOR DEPOSITING FILMS COMPR...

Semiconductor Devices With Backside Air Gap Dielectric

INTEGRATED CIRCUIT WITH SILICIDE FORMATION BLOCKING

PHOTO-EMITTING PLASMA FOR ACTIVATION IN PROCESSING CHAMBERS, AND RE...

SURFACE INHIBITION ATOMIC LAYER DEPOSITION

HARDWARE DESIGN WITH INDEPENDENT CONTROL TO IMPROVE WIW UNIFORMITY

TOPOLOGY SELECTIVE AND SACRIFICIAL SILICON NITRIDE LAYER FOR GENERA...