in the presence of a plasma [PECVD]

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H01L21/02274

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02274in the presence of a plasma [PECVD]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thin film deposition process
- Patent number 12,322,591
- Issue date Jun 3, 2025
- ASM IP Holding B.V.
- Naoki Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 12,322,590
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isotropic silicon nitride removal
- Patent number 12,315,739
- Issue date May 27, 2025
- Applied Materials, Inc.
- Mikhail Korolik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eliminating yield impact of stochastics in lithography
- Patent number 12,315,727
- Issue date May 27, 2025
- Lam Research Corporation
- Nader Shamma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having high breakdown voltage etch-stop layer
- Patent number 12,315,812
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming films with improved film quality
- Patent number 12,315,718
- Issue date May 27, 2025
- Applied Materials, Inc.
- Bhargav S. Citla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removing etch stop layers
- Patent number 12,315,735
- Issue date May 27, 2025
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 12,308,208
- Issue date May 20, 2025
- Tokyo Electron Limited
- Shinya Morikita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 12,310,043
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 12,308,241
- Issue date May 20, 2025
- Tokyo Electron Limited
- Masahiro Tabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multilayer insulating layer in recess and...
- Patent number 12,300,614
- Issue date May 13, 2025
- Kioxia Corporation
- Kosuke Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped or undoped silicon carbide deposition and remote hydrogen pla...
- Patent number 12,300,488
- Issue date May 13, 2025
- Lam Research Corporation
- Guangbi Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition of semiconductor integration films
- Patent number 12,300,491
- Issue date May 13, 2025
- Applied Materials, Inc.
- Lakmal Charidu Kalutarage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma enhanced film formation method
- Patent number 12,300,466
- Issue date May 13, 2025
- Tokyo Electron Limited
- Toshihiko Iwao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure including SiOCN layer and method of forming same
- Patent number 12,293,911
- Issue date May 6, 2025
- ASM IP Holding B.V.
- YoungChol Byun
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing gap filling fluids and related systems and d...
- Patent number 12,293,942
- Issue date May 6, 2025
- ASM IP Holding B.V.
- Timothee Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,288,683
- Issue date Apr 29, 2025
- Kokusai Electric Corporation
- Yasunobu Koshi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film deposition apparatus for fine pattern forming
- Patent number 12,288,671
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Kazuhide Hasebe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal complexes containing cyclopentadienyl ligands
- Patent number 12,286,449
- Issue date Apr 29, 2025
- Merck Patent GmbH
- Ming Fang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method
- Patent number 12,283,479
- Issue date Apr 22, 2025
- ASM IP Holding B.V.
- JaeOk Ko
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method for compound semiconductor device
- Patent number 12,283,922
- Issue date Apr 22, 2025
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench-gated heterostructure and double-heterostructure active devices
- Patent number 12,284,817
- Issue date Apr 22, 2025
- MaxPower Semiconductor Inc.
- Jun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclical deposition method and apparatus for filling a recess forme...
- Patent number 12,272,593
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Zecheng Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Station-to-station control of backside bow compensation deposition
- Patent number 12,272,608
- Issue date Apr 8, 2025
- Lam Research Corporation
- Yanhui Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate with fluorinated yttrium coatings, and methods of prepari...
- Patent number 12,270,104
- Issue date Apr 8, 2025
- Entegris, Inc.
- Nilesh Gunda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resonant filter for solid state RF impedance matching network
- Patent number 12,272,522
- Issue date Apr 8, 2025
- ASM America, Inc.
- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of SiOC thin films
- Patent number 12,272,546
- Issue date Apr 8, 2025
- ASM IP Holding B.V.
- Toshiya Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal deposition of silicon carbide films
- Patent number 12,272,547
- Issue date Apr 8, 2025
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mask encapsulation to prevent degradation during fabrication of hig...
- Patent number 12,266,535
- Issue date Apr 1, 2025
- Lam Researh Corporation
- Kapu Sirish Reddy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SILICON NITRIDE FILM AND FILM FORMING APPARATUS
- Publication number 20250179625
- Publication date Jun 5, 2025
- TOKYO ELECTRON LIMITED
- Munehito KAGAYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ORGANOAMINOSILANE PRECURSORS AND METHODS FOR DEPOSITING FILMS COMPR...
- Publication number 20250183029
- Publication date Jun 5, 2025
- VERSUM MATERIALS US, LLC
- Mark Leonard O'Neill
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Devices With Backside Air Gap Dielectric
- Publication number 20250185348
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH SILICIDE FORMATION BLOCKING
- Publication number 20250183039
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Brian Ellingwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-EMITTING PLASMA FOR ACTIVATION IN PROCESSING CHAMBERS, AND RE...
- Publication number 20250183066
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Abbas RASTEGAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE INHIBITION ATOMIC LAYER DEPOSITION
- Publication number 20250179632
- Publication date Jun 5, 2025
- LAM RESEARCH CORPORATION
- Tao ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HARDWARE DESIGN WITH INDEPENDENT CONTROL TO IMPROVE WIW UNIFORMITY
- Publication number 20250179639
- Publication date Jun 5, 2025
- Applied Materials, Inc.
- Rupankar CHOUDHURY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TOPOLOGY SELECTIVE AND SACRIFICIAL SILICON NITRIDE LAYER FOR GENERA...
- Publication number 20250185338
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Yang HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250171890
- Publication date May 29, 2025
- TOKYO ELECTRON LIMITED
- Isao GUNJI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FILLING GAPS ON SUBSTRATE SURFACE USING PLASMA
- Publication number 20250171891
- Publication date May 29, 2025
- ASM IP HOLDING B.V.
- Sho Ichinose
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMAL FILM DEPOSITION
- Publication number 20250166989
- Publication date May 22, 2025
- LAM RESEARCH CORPORATION
- Jason Alexander Varnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING INSULATING FILM, AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250166990
- Publication date May 22, 2025
- Tokyo Electron Limited
- Daisuke OBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20250154645
- Publication date May 15, 2025
- Tokyo Electron Limited
- Tadashi MITSUNARI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON NITRIDE FILM FORMATION METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250154649
- Publication date May 15, 2025
- TOKYO ELECTRON LIMITED
- Kenichi KOTE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE
- Publication number 20250157819
- Publication date May 15, 2025
- ASM IP HOLDING B.V.
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL
- Publication number 20250157935
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE INERT OXIDATION AND IN-SITU ANNEALING PROCESS TO IMPR...
- Publication number 20250154644
- Publication date May 15, 2025
- LAM RESEARCH CORPORATION
- Eli Jeon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250157811
- Publication date May 15, 2025
- ASM IP HOLDING B.V.
- Jeonghoon Jang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR WAFER BONDING
- Publication number 20250154000
- Publication date May 15, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Chien-Wei CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTI...
- Publication number 20250149330
- Publication date May 8, 2025
- LAM RESEARCH CORPORATION
- Wenchi LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A TRENCH FIELD ELECTRODE WITH A FIRST S...
- Publication number 20250151321
- Publication date May 8, 2025
- Infineon Technologies Austria AG
- Ashita Mirchandani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250149329
- Publication date May 8, 2025
- TOKYO ELECTRON LIMITED
- Ryota IFUKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...
- Publication number 20250149328
- Publication date May 8, 2025
- LAM RESEARCH CORPORATION
- Bhadri N. VARADARAJAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A METAL PAD AND A PROTECTIVE LAYER FOR...
- Publication number 20250140722
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250142887
- Publication date May 1, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF CARBON GAPFILL MATERIALS
- Publication number 20250137119
- Publication date May 1, 2025
- Applied Materials, Inc.
- Bhargav S. CITLA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250129474
- Publication date Apr 24, 2025
- TOKYO ELECTRON LIMITED
- Ryota IFUKU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PROCESSING SUBSTRATE
- Publication number 20250122611
- Publication date Apr 17, 2025
- TES CO., LTD.
- Sungwoo LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESSING CHAMBER DEPOSITION CONFINEMENT
- Publication number 20250125129
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Sarah Michelle Bobek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS TO IMPROVE OXIDE SIDEWALL QUALITY
- Publication number 20250125145
- Publication date Apr 17, 2025
- Applied Materials, Inc.
- Tianyang Li
- H01 - BASIC ELECTRIC ELEMENTS

in the presence of a plasma [PECVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thin film deposition process

Semiconductor device and method

Isotropic silicon nitride removal

Eliminating yield impact of stochastics in lithography

Semiconductor structure having high breakdown voltage etch-stop layer

Forming films with improved film quality

Methods for removing etch stop layers

Substrate processing method and substrate processing apparatus

Method of fabricating a semiconductor device

Semiconductor die, manufacturing method thereof, and semiconductor...

Plasma processing method and plasma processing apparatus

Semiconductor device with multilayer insulating layer in recess and...

Doped or undoped silicon carbide deposition and remote hydrogen pla...

Deposition of semiconductor integration films

Plasma enhanced film formation method

Structure including SiOCN layer and method of forming same

Methods for depositing gap filling fluids and related systems and d...

Method of manufacturing semiconductor device, substrate processing...

Film deposition apparatus for fine pattern forming

Metal complexes containing cyclopentadienyl ligands

Substrate processing method

Manufacturing method for compound semiconductor device

Trench-gated heterostructure and double-heterostructure active devices

Cyclical deposition method and apparatus for filling a recess forme...

Station-to-station control of backside bow compensation deposition

Substrate with fluorinated yttrium coatings, and methods of prepari...

Resonant filter for solid state RF impedance matching network

Formation of SiOC thin films

Conformal deposition of silicon carbide films

Mask encapsulation to prevent degradation during fabrication of hig...

Patents Applicationslast 30 patents

METHOD OF FORMING SILICON NITRIDE FILM AND FILM FORMING APPARATUS

ORGANOAMINOSILANE PRECURSORS AND METHODS FOR DEPOSITING FILMS COMPR...

Semiconductor Devices With Backside Air Gap Dielectric

INTEGRATED CIRCUIT WITH SILICIDE FORMATION BLOCKING

PHOTO-EMITTING PLASMA FOR ACTIVATION IN PROCESSING CHAMBERS, AND RE...

SURFACE INHIBITION ATOMIC LAYER DEPOSITION

HARDWARE DESIGN WITH INDEPENDENT CONTROL TO IMPROVE WIW UNIFORMITY

TOPOLOGY SELECTIVE AND SACRIFICIAL SILICON NITRIDE LAYER FOR GENERA...

EMBEDDING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF FILLING GAPS ON SUBSTRATE SURFACE USING PLASMA

THERMAL FILM DEPOSITION

METHOD FOR FORMING INSULATING FILM, AND SUBSTRATE PROCESSING SYSTEM

FILM FORMING METHOD AND FILM FORMING APPARATUS

SILICON NITRIDE FILM FORMATION METHOD AND PLASMA PROCESSING APPARATUS

METHOD FOR PROCESSING A SUBSTRATE

ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL

HIGH PRESSURE INERT OXIDATION AND IN-SITU ANNEALING PROCESS TO IMPR...

SUBSTRATE PROCESSING METHOD

METHODS FOR WAFER BONDING

METHOD FOR ETCHING FEATURES USING A TARGETED DEPOSITION FOR SELECTI...

SEMICONDUCTOR DEVICE HAVING A TRENCH FIELD ELECTRODE WITH A FIRST S...

SUBTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

REMOTE PLASMA BASED DEPOSITION OF SILICON CARBIDE FILMS USING SILIC...

SEMICONDUCTOR DEVICE HAVING A METAL PAD AND A PROTECTIVE LAYER FOR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DEPOSITION OF CARBON GAPFILL MATERIALS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD FOR PROCESSING SUBSTRATE

PROCESSING CHAMBER DEPOSITION CONFINEMENT

METHODS TO IMPROVE OXIDE SIDEWALL QUALITY