in the presence of a plasma [PECVD]

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H01L21/02274

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02274in the presence of a plasma [PECVD]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a silicon carbide device
- Patent number 12,176,207
- Issue date Dec 24, 2024
- X-FAB TEXAS, INC.
- Daniel Mauch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,176,419
- Issue date Dec 24, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takashi Hamochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method and plasma processing apparatus
- Patent number 12,170,198
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Hiroyuki Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition method and deposition apparatus
- Patent number 12,163,220
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yu Komai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,159,786
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic multi zone flow control for a processing system
- Patent number 12,159,785
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Daemian Raj Benjamin Raj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
GaN/two-dimensional AlN heterojunction rectifier on silicon substra...
- Patent number 12,154,990
- Issue date Nov 26, 2024
- South China University of Technology
- Wenliang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone gas distribution systems and methods
- Patent number 12,148,597
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Saravjeet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide deposition method
- Patent number 12,148,609
- Issue date Nov 19, 2024
- ASM IP Holding B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active device substrate and fabrication method of active device sub...
- Patent number 12,142,687
- Issue date Nov 12, 2024
- Au Optronics Corporation
- Chen-Shuo Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,142,476
- Issue date Nov 12, 2024
- Kokusai Electric Corporation
- Masayuki Asai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing three-dimensional integrated circuit struc...
- Patent number 12,136,619
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-enhanced chemical vapor deposition of carbon hard-mask
- Patent number 12,136,549
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Byung Seok Kwon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective etching with fluorine, oxygen and noble gas containing pl...
- Patent number 12,131,914
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of deposition
- Patent number 12,131,899
- Issue date Oct 29, 2024
- SPTS Technology Limited
- Tristan Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective processing with etch residue-based inhibitors
- Patent number 12,131,909
- Issue date Oct 29, 2024
- Lam Research Corporation
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed-plasma deposition of thin film layers
- Patent number 12,131,903
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF pulsing assisted low-k film deposition with high mechanical stre...
- Patent number 12,125,675
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Ruitong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high aspect ratio features
- Patent number 12,125,700
- Issue date Oct 22, 2024
- ASM IP Holding B.V.
- Mitsuya Utsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for integrated circuit structure and forming the...
- Patent number 12,125,746
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective carbon deposition on top and bottom surfaces of semicondu...
- Patent number 12,125,699
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve wafer edge uniformity
- Patent number 12,125,683
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Mingle Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PEALD nitride films
- Patent number 12,119,221
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Hanhong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Switching circuit
- Patent number 12,119,206
- Issue date Oct 15, 2024
- ASM AMERICA, INC.
- Anton Mavretic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single precursor low-k film deposition and UV cure for advanced tec...
- Patent number 12,119,223
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mechanism for finFET well doping
- Patent number 12,112,975
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming topology-controlled amorphous carbon polymer film
- Patent number 12,112,940
- Issue date Oct 8, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,112,949
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to create air gaps
- Patent number 12,112,980
- Issue date Oct 8, 2024
- Lam Research Corporation
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective liquid sliding surface and method of fabricating the same
- Patent number 12,112,941
- Issue date Oct 8, 2024
- THE INDUSTRY & ACADEMIC COOPERAPATION IN CHUNGNAM NATIONAL UNIVERSITY (IAC)
- Seong Min Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDU...
- Publication number 20240420948
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SILICON OXIDE FOR BOTTOM-UP DEPOSITION
- Publication number 20240420949
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Woongsik Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20240412969
- Publication date Dec 12, 2024
- Kokusai Electric Corporation
- Yuki TAIRA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PASSIVATION LAYER FOR AN INTEGRATED CIRCUIT DEVICE THAT PROVIDES A...
- Publication number 20240404905
- Publication date Dec 5, 2024
- STMicroelectronics Pte Ltd
- Eng Hui GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240404802
- Publication date Dec 5, 2024
- Kokusai Electric Corporation
- Atsushi Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBERS AND COATINGS FOR REDUCING BACKSIDE DAMAGE
- Publication number 20240404835
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Leonard M. TEDESCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...
- Publication number 20240395541
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Manchao Xiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD
- Publication number 20240392438
- Publication date Nov 28, 2024
- JIANGSU LEADMICRO NANO TECHNOLOGY CO., LTD.
- Xinyuan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK
- Publication number 20240395542
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Jun XUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING
- Publication number 20240387226
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Aaron Blake MILLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240387250
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH INCREASED ETCH...
- Publication number 20240387167
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Shanshan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP P...
- Publication number 20240387299
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chan LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR STRUCTURE
- Publication number 20240387606
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Qinghui ZHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
- Publication number 20240379419
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240371852
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20240371631
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Munehito KAGAYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...
- Publication number 20240371769
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Cheng SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID ELIMINATION FOR GAP-FILLING IN HIGH-ASPECT RATIO TRENCHES
- Publication number 20240371981
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protection Layer Formation during Plasma Etching Conductive Materials
- Publication number 20240371655
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME
- Publication number 20240371875
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Gang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-ENERGY UNDERLAYER FOR ROOM TEMPERATURE PHYSICAL VAPOR DEPOSITIO...
- Publication number 20240363407
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Jie ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...
- Publication number 20240363416
- Publication date Oct 31, 2024
- MICLEDI MICRODISPLAYS BV
- Soeren STEUDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS CARBON FOR GAP FILL
- Publication number 20240363332
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Xiaoquan Min
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS
- Publication number 20240363337
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Muthukumar Kaliappan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PLASMA CLEANING OF FUSED SILICA TUBES
- Publication number 20240363317
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Vicknesh Sahmuganathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Asymmetric Source and Drain Structures in Semiconductor Devices
- Publication number 20240363749
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE
- Publication number 20240363339
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS

in the presence of a plasma [PECVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a silicon carbide device

Method for fabricating semiconductor device

Deposition method and plasma processing apparatus

Deposition method and deposition apparatus

Semiconductor device and method of manufacturing the same

Dynamic multi zone flow control for a processing system

GaN/two-dimensional AlN heterojunction rectifier on silicon substra...

Multi-zone gas distribution systems and methods

Silicon oxide deposition method

Active device substrate and fabrication method of active device sub...

Method of processing substrate, method of manufacturing semiconduct...

Methods of manufacturing three-dimensional integrated circuit struc...

Plasma-enhanced chemical vapor deposition of carbon hard-mask

Selective etching with fluorine, oxygen and noble gas containing pl...

Method of deposition

Selective processing with etch residue-based inhibitors

Pulsed-plasma deposition of thin film layers

RF pulsing assisted low-k film deposition with high mechanical stre...

Method of forming high aspect ratio features

Passivation layer for integrated circuit structure and forming the...

Selective carbon deposition on top and bottom surfaces of semicondu...

Method to improve wafer edge uniformity

PEALD nitride films

Switching circuit

Single precursor low-k film deposition and UV cure for advanced tec...

Mechanism for finFET well doping

Method of forming topology-controlled amorphous carbon polymer film

Highly etch selective amorphous carbon film

Method to create air gaps

Selective liquid sliding surface and method of fabricating the same

Patents Applicationslast 30 patents

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDU...

DOPED SILICON OXIDE FOR BOTTOM-UP DEPOSITION

METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

PASSIVATION LAYER FOR AN INTEGRATED CIRCUIT DEVICE THAT PROVIDES A...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

CHAMBERS AND COATINGS FOR REDUCING BACKSIDE DAMAGE

FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...

SUBSTRATE TREATING APPARATUS AND METHOD

HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK

DEVICE AND METHOD OF FORMING THE SAME

REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING

SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH INCREASED ETCH...

METHOD AND SYSTEM FOR ADJUSTING THE GAP BETWEEN A WAFER AND A TOP P...

METHOD FOR MANUFACTURING CAPACITOR STRUCTURE

SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

FILM FORMING METHOD AND FILM FORMING APPARATUS

SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...

VOID ELIMINATION FOR GAP-FILLING IN HIGH-ASPECT RATIO TRENCHES

Protection Layer Formation during Plasma Etching Conductive Materials

GATE STRUCTURES IN TRANSISTOR DEVICES AND METHODS OF FORMING SAME

LOW-ENERGY UNDERLAYER FOR ROOM TEMPERATURE PHYSICAL VAPOR DEPOSITIO...

METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...

AMORPHOUS CARBON FOR GAP FILL

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS

METHOD OF PLASMA CLEANING OF FUSED SILICA TUBES

Asymmetric Source and Drain Structures in Semiconductor Devices

CONDUCTIVE FEATURE FORMATION AND STRUCTURE