in the presence of a plasma [PECVD]

Industry

CPC
H01L21/02274

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02274in the presence of a plasma [PECVD]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dual RF for controllable film deposition
- Patent number 12,191,115
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Venkata Sharat Chandra Parimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,144
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Yi Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing silicon oxide films
- Patent number 12,188,121
- Issue date Jan 7, 2025
- ASM Genitech Korea Ltd.
- Tae Ho Yoon
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device and method for forming the same
- Patent number 12,191,143
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Zhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi process air gap formation
- Patent number 12,183,627
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- John Hautala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxynitride based encapsulation layer for magnetic tunnel ju...
- Patent number 12,185,641
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Vignesh Sundar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device having a metal pad and a protective layer for...
- Patent number 12,183,697
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a silicon carbide device
- Patent number 12,176,207
- Issue date Dec 24, 2024
- X-FAB TEXAS, INC.
- Daniel Mauch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,176,419
- Issue date Dec 24, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takashi Hamochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method and plasma processing apparatus
- Patent number 12,170,198
- Issue date Dec 17, 2024
- Tokyo Electron Limited
- Hiroyuki Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition method and deposition apparatus
- Patent number 12,163,220
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Yu Komai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,159,786
- Issue date Dec 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic multi zone flow control for a processing system
- Patent number 12,159,785
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Daemian Raj Benjamin Raj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
GaN/two-dimensional AlN heterojunction rectifier on silicon substra...
- Patent number 12,154,990
- Issue date Nov 26, 2024
- South China University of Technology
- Wenliang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-zone gas distribution systems and methods
- Patent number 12,148,597
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Saravjeet Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon oxide deposition method
- Patent number 12,148,609
- Issue date Nov 19, 2024
- ASM IP Holding B.V.
- Varun Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active device substrate and fabrication method of active device sub...
- Patent number 12,142,687
- Issue date Nov 12, 2024
- Au Optronics Corporation
- Chen-Shuo Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing substrate, method of manufacturing semiconduct...
- Patent number 12,142,476
- Issue date Nov 12, 2024
- Kokusai Electric Corporation
- Masayuki Asai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of manufacturing three-dimensional integrated circuit struc...
- Patent number 12,136,619
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-enhanced chemical vapor deposition of carbon hard-mask
- Patent number 12,136,549
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Byung Seok Kwon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective etching with fluorine, oxygen and noble gas containing pl...
- Patent number 12,131,914
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of deposition
- Patent number 12,131,899
- Issue date Oct 29, 2024
- SPTS Technology Limited
- Tristan Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective processing with etch residue-based inhibitors
- Patent number 12,131,909
- Issue date Oct 29, 2024
- Lam Research Corporation
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Pulsed-plasma deposition of thin film layers
- Patent number 12,131,903
- Issue date Oct 29, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF pulsing assisted low-k film deposition with high mechanical stre...
- Patent number 12,125,675
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Ruitong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high aspect ratio features
- Patent number 12,125,700
- Issue date Oct 22, 2024
- ASM IP Holding B.V.
- Mitsuya Utsuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for integrated circuit structure and forming the...
- Patent number 12,125,746
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective carbon deposition on top and bottom surfaces of semicondu...
- Patent number 12,125,699
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to improve wafer edge uniformity
- Patent number 12,125,683
- Issue date Oct 22, 2024
- Applied Materials, Inc.
- Mingle Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PEALD nitride films
- Patent number 12,119,221
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Hanhong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION SEAM REDUCTION
- Publication number 20250014893
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS
- Publication number 20250014904
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Kashish Sharma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES WITH BONDING LAYERS
- Publication number 20250015131
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan Chen HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...
- Publication number 20250014895
- Publication date Jan 9, 2025
- ASM IP HOLDING B.V.
- René Henricus Jozef Vervuurt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20250003068
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
- Kazuyuki OKUDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP
- Publication number 20250006489
- Publication date Jan 2, 2025
- ASM IP HOLDING B.V.
- Ranjit Borude
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20250006500
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Lan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTU...
- Publication number 20250006488
- Publication date Jan 2, 2025
- NANYA TECHNOLOGY CORPORATION
- Chao-Hsiu LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250006471
- Publication date Jan 2, 2025
- Tokyo Electron Limited
- Takamichi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC MULTI ZONE FLOW CONTROL FOR A PROCESSING SYSTEM
- Publication number 20250006487
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Daemian Raj BENJAMIN RAJ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...
- Publication number 20240429045
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Jengyi Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240429317
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Po-Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240429042
- Publication date Dec 26, 2024
- CXMT Corporation
- Yihang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240429044
- Publication date Dec 26, 2024
- ASM IP HOLDING B.V.
- Yan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALOGEN-FREE MOLYBDENUM-CONTAINING PRECURSORS FOR DEPOSITION OF MOL...
- Publication number 20240425536
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429319
- Publication date Dec 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE AIR GAPS
- Publication number 20240429091
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Patrick A. Van Cleemput
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION
- Publication number 20240420952
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Bhaskar Soman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDU...
- Publication number 20240420948
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Abhijeet S. Bagal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SILICON OXIDE FOR BOTTOM-UP DEPOSITION
- Publication number 20240420949
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Woongsik Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...
- Publication number 20240412969
- Publication date Dec 12, 2024
- Kokusai Electric Corporation
- Yuki TAIRA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PASSIVATION LAYER FOR AN INTEGRATED CIRCUIT DEVICE THAT PROVIDES A...
- Publication number 20240404905
- Publication date Dec 5, 2024
- STMicroelectronics Pte Ltd
- Eng Hui GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240404802
- Publication date Dec 5, 2024
- Kokusai Electric Corporation
- Atsushi Moriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMBERS AND COATINGS FOR REDUCING BACKSIDE DAMAGE
- Publication number 20240404835
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Leonard M. TEDESCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...
- Publication number 20240395541
- Publication date Nov 28, 2024
- VERSUM MATERIALS US, LLC
- Manchao Xiao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD
- Publication number 20240392438
- Publication date Nov 28, 2024
- JIANGSU LEADMICRO NANO TECHNOLOGY CO., LTD.
- Xinyuan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK
- Publication number 20240395542
- Publication date Nov 28, 2024
- LAM RESEARCH CORPORATION
- Jun XUE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240387255
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING
- Publication number 20240387226
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Aaron Blake MILLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

in the presence of a plasma [PECVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual RF for controllable film deposition

Semiconductor device and manufacturing method thereof

Method of depositing silicon oxide films

Semiconductor device and method for forming the same

Multi process air gap formation

Silicon oxynitride based encapsulation layer for magnetic tunnel ju...

Semiconductor device having a metal pad and a protective layer for...

Method for manufacturing a silicon carbide device

Method for fabricating semiconductor device

Deposition method and plasma processing apparatus

Deposition method and deposition apparatus

Semiconductor device and method of manufacturing the same

Dynamic multi zone flow control for a processing system

GaN/two-dimensional AlN heterojunction rectifier on silicon substra...

Multi-zone gas distribution systems and methods

Silicon oxide deposition method

Active device substrate and fabrication method of active device sub...

Method of processing substrate, method of manufacturing semiconduct...

Methods of manufacturing three-dimensional integrated circuit struc...

Plasma-enhanced chemical vapor deposition of carbon hard-mask

Selective etching with fluorine, oxygen and noble gas containing pl...

Method of deposition

Selective processing with etch residue-based inhibitors

Pulsed-plasma deposition of thin film layers

RF pulsing assisted low-k film deposition with high mechanical stre...

Method of forming high aspect ratio features

Passivation layer for integrated circuit structure and forming the...

Selective carbon deposition on top and bottom surfaces of semicondu...

Method to improve wafer edge uniformity

PEALD nitride films

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

ATOMIC LAYER DEPOSITION SEAM REDUCTION

SELECTIVE PROCESSING WITH ETCH RESIDUE-BASED INHIBITORS

SEMICONDUCTOR DEVICES WITH BONDING LAYERS

METHOD FOR DEPOSITING A LAYER ONTO A SUBSTRATE AND SEMICONDUCTOR PR...

SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...

METHODS AND ASSEMBLIES FOR DEPOSITING MATERIAL IN A GAP

SEMICONDUCTOR DEVICE AND METHOD

DEPOSITION DEVICE, SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTU...

NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS

DYNAMIC MULTI ZONE FLOW CONTROL FOR A PROCESSING SYSTEM

ATOMIC LAYER ETCH AND SELECTIVE DEPOSITION PROCESS FOR EXTREME ULTR...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

SUBSTRATE PROCESSING METHOD

HALOGEN-FREE MOLYBDENUM-CONTAINING PRECURSORS FOR DEPOSITION OF MOL...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD TO CREATE AIR GAPS

NESTED-LOOP PLASMA ENHANCED ATOMIC LAYER DEPOSITION

SELECTIVE CARBON DEPOSITION ON TOP AND BOTTOM SURFACES OF SEMICONDU...

DOPED SILICON OXIDE FOR BOTTOM-UP DEPOSITION

METHOD OF FORMING FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVIC...

PASSIVATION LAYER FOR AN INTEGRATED CIRCUIT DEVICE THAT PROVIDES A...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

CHAMBERS AND COATINGS FOR REDUCING BACKSIDE DAMAGE

FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...

SUBSTRATE TREATING APPARATUS AND METHOD

HIGH ETCH SELECTIVITY, LOW STRESS ASHABLE CARBON HARD MASK

DEVICE AND METHOD OF FORMING THE SAME

REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING