in the presence of a plasma [PECVD]

Industry

CPC
H01L21/02274

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02274in the presence of a plasma [PECVD]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,972,945
- Issue date Apr 30, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi Okazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for depositing dielectric material
- Patent number 11,972,943
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Bhargav S. Citla
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a gap-fill layer by plasma-assisted deposition
- Patent number 11,972,944
- Issue date Apr 30, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing thin film and method of manufacturing semicond...
- Patent number 11,967,503
- Issue date Apr 23, 2024
- Wonik IPS Co., Ltd.
- Su In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for depositing low-k dielectric films
- Patent number 11,967,498
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma generating device, substrate processing apparatus, and metho...
- Patent number 11,967,490
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Akihiro Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming material layer, semiconductor devices, and metho...
- Patent number 11,967,502
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Younsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic plasma processing
- Patent number 11,961,735
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Yun Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF devices with nanotube particles for enhanced performance and met...
- Patent number 11,961,781
- Issue date Apr 16, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,961,734
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having high breakdown voltage etch-stop layer
- Patent number 11,961,803
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joung-Wei Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,961,918
- Issue date Apr 16, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yasutaka Nakazawa
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Directional deposition for semiconductor fabrication
- Patent number 11,955,338
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chun Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,955,370
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method
- Patent number 11,952,661
- Issue date Apr 9, 2024
- Tokyo Electron Limited
- Hitoshi Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treatments to enhance material structures
- Patent number 11,955,332
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation apparatus
- Patent number 11,955,367
- Issue date Apr 9, 2024
- SHIBAURA MECHATRONICS CORPORATION
- Shohei Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for processing a substrate
- Patent number 11,955,333
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Jethro Tannos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Combined RF generator and RF solid-state matching network
- Patent number 11,948,775
- Issue date Apr 2, 2024
- ASM AMERICA, INC.
- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,942,320
- Issue date Mar 26, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,942,370
- Issue date Mar 26, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave plasma source, microwave plasma processing apparatus and...
- Patent number 11,942,308
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Yasuaki Taniike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device of dielectric layer
- Patent number 11,935,752
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
- Patent number 11,935,842
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relating to passivation layers
- Patent number 11,929,296
- Issue date Mar 12, 2024
- X-FAB SARAWAK SDN. BHD.
- Raj Sekar Sethu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus having electrostatic chuck and subst...
- Patent number 11,929,251
- Issue date Mar 12, 2024
- ASM IP Holding B.V.
- Toshihisa Nozawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 11,929,419
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing silicon-free carbon-containing film as gap-fi...
- Patent number 11,923,190
- Issue date Mar 5, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Modifying ferroelectric properties of hafnium oxide with hafnium ni...
- Patent number 11,923,404
- Issue date Mar 5, 2024
- Lam Research Corporation
- Hyungsuk Alexander Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 11,915,927
- Issue date Feb 27, 2024
- Kokusai Electric Corporation
- Kazuyuki Okuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
- Publication number 20240145234
- Publication date May 2, 2024
- Novellus Systems, Inc.
- Bhadri N. Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF APPLYING A DIELECTRIC COATING ON A COMPONENT OF AN ELECTR...
- Publication number 20240145237
- Publication date May 2, 2024
- Quantinuum LLC
- Christopher Todd Ertsgaard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20240145236
- Publication date May 2, 2024
- ASM IP HOLDING B.V.
- Hyunchul Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...
- Publication number 20240136175
- Publication date Apr 25, 2024
- SOULBRAIN CO., LTD.
- Jae Sun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier-Free Approach for Forming Contact Plugs
- Publication number 20240136227
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136442
- Publication date Apr 25, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kenichi OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240136191
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsiu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20240136291
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240128351
- Publication date Apr 18, 2024
- Mitsubishi Electric Corporation
- Hiroyuki OKAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND TOOL FOR FILM DEPOSITION
- Publication number 20240128078
- Publication date Apr 18, 2024
- NANYA TECHNOLOGY CORPORATION
- JI-FENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR FILM DEPOSITION
- Publication number 20240128077
- Publication date Apr 18, 2024
- NANYA TECHNOLOGY CORPORATION
- JI-FENG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240120183
- Publication date Apr 11, 2024
- Tokyo Electron Limited
- Makoto WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Regions For Isolating Transistors and the Methods Forming...
- Publication number 20240120236
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Jung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIAL
- Publication number 20240120193
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Shankar Venkataraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D Layered Thin Film Structure
- Publication number 20240117487
- Publication date Apr 11, 2024
- NATIONAL APPLIED RESEARCH LABORATORIES
- Shu-Ju Tsai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ISOTROPIC SILICON NITRIDE REMOVAL
- Publication number 20240120210
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Mikhail Korolik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES
- Publication number 20240112914
- Publication date Apr 4, 2024
- University of Electronic Science and Technology of China
- Bo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240112907
- Publication date Apr 4, 2024
- Kokusai Electric Corporation
- Shoma MIYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240112905
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESS UNIFORMITY BY WAFER BACK SIDE DOPING
- Publication number 20240112904
- Publication date Apr 4, 2024
- SKYWORKS GLOBAL PTE. LTD.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STRESS CONTROL FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION
- Publication number 20240105427
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Chien-Teh KAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLECULAR LAYER DEPOSITION CARBON MASKS FOR DIRECT SELECTIVE DEPOSI...
- Publication number 20240105499
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Zeqing Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE B...
- Publication number 20240105425
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Seungwan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURI...
- Publication number 20240105470
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Dong Il PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240105448
- Publication date Mar 28, 2024
- Kokusai Electric Corporation
- Motomu DEGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Low Resistivity Contacts
- Publication number 20240105444
- Publication date Mar 28, 2024
- Applied Materials, Inc.
- Jiang LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH ASPECT RATIO METAL GATE CUTS
- Publication number 20240105453
- Publication date Mar 28, 2024
- Intel Corporation
- Reza Bayati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20240096595
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition of Thick Layers of Silicon Dioxide
- Publication number 20240096616
- Publication date Mar 21, 2024
- SPTS TECHNOLOGIES LIMITED
- Matt Edmonds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS

in the presence of a plasma [PECVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Methods and apparatus for depositing dielectric material

Method for depositing a gap-fill layer by plasma-assisted deposition

Method of depositing thin film and method of manufacturing semicond...

Systems and methods for depositing low-k dielectric films

Plasma generating device, substrate processing apparatus, and metho...

Methods of forming material layer, semiconductor devices, and metho...

Cyclic plasma processing

RF devices with nanotube particles for enhanced performance and met...

Treatments to enhance material structures

Semiconductor structure having high breakdown voltage etch-stop layer

Semiconductor device and method for manufacturing semiconductor device

Directional deposition for semiconductor fabrication

Semiconductor devices and methods of manufacture

Deposition method

Treatments to enhance material structures

Film formation apparatus

Methods and apparatus for processing a substrate

Combined RF generator and RF solid-state matching network

Method of manufacturing semiconductor structure

Manufacturing method of semiconductor device

Microwave plasma source, microwave plasma processing apparatus and...

Device of dielectric layer

Methods of manufacturing an integrated circuit having stress tuning...

Relating to passivation layers

Substrate processing apparatus having electrostatic chuck and subst...

Semiconductor device

Method for depositing silicon-free carbon-containing film as gap-fi...

Modifying ferroelectric properties of hafnium oxide with hafnium ni...

Substrate processing apparatus, method of manufacturing semiconduct...

Patents Applicationslast 30 patents

CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS

METHOD OF APPLYING A DIELECTRIC COATING ON A COMPONENT OF AN ELECTR...

SUBSTRATE PROCESSING METHOD

AUXILIARY PRECURSOR, THIN-FILM PRECURSOR COMPOSITION, METHOD OF FOR...

Barrier-Free Approach for Forming Contact Plugs

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

FIN FIELD-EFFECT TRANSISTOR DEVICE AND METHOD OF FORMING THE SAME

LOW-STRESS PASSIVATION LAYER

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD AND TOOL FOR FILM DEPOSITION

SEMICONDUCTOR DEVICE AND A METHOD FOR FILM DEPOSITION

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Isolation Regions For Isolating Transistors and the Methods Forming...

CARBON REPLENISHMENT OF SILICON-CONTAINING MATERIAL

2D Layered Thin Film Structure

ISOTROPIC SILICON NITRIDE REMOVAL

VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

Semiconductor Device and Method

PLASMA PROCESS UNIFORMITY BY WAFER BACK SIDE DOPING

FILM STRESS CONTROL FOR PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION

MOLECULAR LAYER DEPOSITION CARBON MASKS FOR DIRECT SELECTIVE DEPOSI...

SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING SUBSTRATE B...

SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURI...

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

Methods for Forming Low Resistivity Contacts

HIGH ASPECT RATIO METAL GATE CUTS

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

Deposition of Thick Layers of Silicon Dioxide

MULTI-LAYER LINE STRUCTURE