in the upper part of the bonding apparatus

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H01L2224/75745

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75745in the upper part of the bonding apparatus

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding for chip conveying apparatus
- Patent number 11,929,344
- Issue date Mar 12, 2024
- Disco Corporation
- Hiromitsu Yoshimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mounting device
- Patent number 11,835,207
- Issue date Dec 5, 2023
- FUJI CORPORATION
- Kohei Sugihara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mounting device and mounting method
- Patent number 11,823,938
- Issue date Nov 21, 2023
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head with large and small spray apertures
- Patent number 11,817,419
- Issue date Nov 14, 2023
- SHIBUYA CORPORATION
- Masato Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 11,791,223
- Issue date Oct 17, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,769,749
- Issue date Sep 26, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,664,344
- Issue date May 30, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding semiconductor substrate
- Patent number 11,631,652
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head including a thermal compensator, die bonding apparatus...
- Patent number 11,626,381
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 11,616,041
- Issue date Mar 28, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,545,462
- Issue date Jan 3, 2023
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 11,521,950
- Issue date Dec 6, 2022
- Kioxia Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,508,689
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball disposition system, method of disposing a ball on a substrate...
- Patent number 11,488,928
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Sukmin Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip bonding apparatus
- Patent number 11,482,505
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding apparatuses
- Patent number 11,443,965
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Kyeongbin Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,387,211
- Issue date Jul 12, 2022
- Shinkawa Ltd.
- Tetsuya Otani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting device
- Patent number 11,373,975
- Issue date Jun 28, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing and filling containers
- Patent number 11,345,073
- Issue date May 31, 2022
- KHS GmbH
- Ludwig Clüsserath
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting head
- Patent number 11,302,666
- Issue date Apr 12, 2022
- Shinkawa Ltd.
- Manato Nishide
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...
- Publication number 20240329125
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Moise AVOCI UGWIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20240014079
- Publication date Jan 11, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230378121
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20230268313
- Publication date Aug 24, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20230238351
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230223376
- Publication date Jul 13, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230163096
- Publication date May 25, 2023
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20230054378
- Publication date Feb 23, 2023
- KIOXIA Corporation
- Tetsuya Kurosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CONVEYING APPARATUS AND DIE BONDER
- Publication number 20230031977
- Publication date Feb 2, 2023
- Disco Corporation
- Hiromitsu YOSHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20220367404
- Publication date Nov 17, 2022
- SHIBUYA CORPORATION
- Masato KITAGAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220293551
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Yuuki KURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20220278071
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20220130796
- Publication date Apr 28, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE
- Publication number 20220120419
- Publication date Apr 21, 2022
- FUJI CORPORATION
- Kohei SUGIHARA
- F21 - LIGHTING
Information Patent Application
BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...
- Publication number 20210249378
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- SUKMIN OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS
- Publication number 20210175201
- Publication date Jun 10, 2021
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...
- Publication number 20210098415
- Publication date Apr 1, 2021
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES
- Publication number 20210005475
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Kyeongbin LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING DEVICE
- Publication number 20200373275
- Publication date Nov 26, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...
- Publication number 20200312811
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200243476
- Publication date Jul 30, 2020
- SHINKAWA LTD.
- Tetsuya OTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS

in the upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mounting device and mounting method

Bonding head for mounting components and die bonder with such a bon...

Semiconductor manufacturing apparatus

Apparatus and method for forming a package structure

Die bonding for chip conveying apparatus

Method of manufacturing a semiconductor package

Mounting device

Mounting device and mounting method

Bonding head with large and small spray apertures

Substrate bonding apparatus and substrate bonding method

Mounting apparatus

Thermocompression bond tips and related apparatus and methods

Mounting apparatus

Method and apparatus for bonding semiconductor substrate

Bonding head including a thermal compensator, die bonding apparatus...

Method of applying conductive adhesive and manufacturing device usi...

Mounting apparatus

Component mounting system

Mounting apparatus and mounting system

Semiconductor manufacturing apparatus and method of manufacturing s...

Mounting apparatus and mounting system

Ball disposition system, method of disposing a ball on a substrate...

Chip bonding apparatus

Chip integration module, chip package structure, and chip integrati...

Wafer to wafer bonding apparatuses

Bonding apparatus and bonding method

Electronic component mounting device

Method and device for producing and filling containers

Method for bonding substrates

Mounting head

Patents Applicationslast 30 patents

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSI...

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

METHOD FOR FORMING A PACKAGE STRUCTURE

DIE BONDING APPARATUS

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

BONDING APPARATUS AND BONDING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

CHIP CONVEYING APPARATUS AND DIE BONDER

BONDING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS

APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

APPARATUS AND METHOD FOR BONDING SUBSTRATES

MOUNTING APPARATUS

MOUNTING DEVICE

BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

MOUNTING APPARATUS

BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...

WAFER TO WAFER BONDING METHODS AND WAFER TO WAFER BONDING APPARATUSES

ELECTRONIC COMPONENT MOUNTING DEVICE

CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...

BONDING APPARATUS AND BONDING METHOD

DIE BONDING APPARATUS AND DIE BONDING METHOD