in the upper part of the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78252in the upper part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,987,753
- Issue date Apr 27, 2021
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 10,449,627
- Issue date Oct 22, 2019
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bonding tools, wedge bonding systems, and related methods
- Patent number 9,931,709
- Issue date Apr 3, 2018
- Orthodyne Electronics Corporation
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding of semiconductor chips
- Patent number 8,967,452
- Issue date Mar 3, 2015
- ASM Technology Singapore Pte. Ltd.
- Yiu Ming Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method
- Patent number 7,576,297
- Issue date Aug 18, 2009
- Kabushiki Kaisha Shinkawa
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical ball grid array integrated circuit package
- Patent number 6,420,782
- Issue date Jul 16, 2002
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical ball grid array integrated circuit package
- Patent number 6,320,126
- Issue date Nov 20, 2001
- Texas Instruments Incorporated
- Kian Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip size integrated circuit package
- Patent number 6,049,129
- Issue date Apr 11, 2000
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density single inline memory module
- Patent number 5,956,233
- Issue date Sep 21, 1999
- Texas Instruments Incorporated
- Chee Kiang Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for thermally enhanced ultrasonic bonding with localized hea...
- Patent number 5,240,166
- Issue date Aug 31, 1993
- International Business Machines Corporation
- Robert E. Fontana
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically heated bonding tool for the manufacture of semiconduct...
- Patent number 4,315,128
- Issue date Feb 9, 1982
- Kulicke and Soffa Industries Inc.
- Thomas J. Matcovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of connecting electronic microcomponents
- Patent number 3,981,076
- Issue date Sep 21, 1976
- Commissariat a l'Energie Atomique
- Gerard Nicolas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
- Publication number 20230318207
- Publication date Oct 5, 2023
- Heraeus Nexensos GmbH
- Matthias MUZIOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
- Publication number 20190375043
- Publication date Dec 12, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
- Publication number 20190372294
- Publication date Dec 5, 2019
- The Charles Stark Draper Laboratory, Inc.
- Mitchell W. Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangements and Method for Providing a Bond Connection
- Publication number 20190312008
- Publication date Oct 10, 2019
- INFINEON TECHNOLOGIES AG
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
- Publication number 20180200828
- Publication date Jul 19, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
- Publication number 20170209956
- Publication date Jul 27, 2017
- ORTHODYNE ELECTRONICS CORPORATION
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS
- Publication number 20130270230
- Publication date Oct 17, 2013
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
- Publication number 20090223937
- Publication date Sep 10, 2009
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding and wire bonding method
- Publication number 20080093416
- Publication date Apr 24, 2008
- KABUSHIKI KAISHA SHINKAWA
- Tetsuya Utano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus and method
- Publication number 20070000878
- Publication date Jan 4, 2007
- KABUSHIKI KAISHA SHINKAWA
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical ball grid array integrated circuit package
- Publication number 20010042910
- Publication date Nov 22, 2001
- Klan Teng Eng
- H01 - BASIC ELECTRIC ELEMENTS

in the upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wedge bonding tools, wedge bonding systems, and related methods

Wire bonding apparatus

Curtain airbag device mounting structure and curtain airbag deploym...

Wedge bonding tools, wedge bonding systems, and related methods

Wedge bonding tools, wedge bonding systems, and related methods

Thermal compression bonding of semiconductor chips

Apparatus and methods for forming wire bonds

Bonding apparatus and method

Vertical ball grid array integrated circuit package

Vertical ball grid array integrated circuit package

Chip size integrated circuit package

High density single inline memory module

Device for thermally enhanced ultrasonic bonding with localized hea...

Electrically heated bonding tool for the manufacture of semiconduct...

Method of connecting electronic microcomponents

Patents Applicationslast 30 patents

TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD

WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS

APPARATUS AND METHOD FOR WIRE PREPARATION

Arrangements and Method for Providing a Bond Connection

WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS

WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS

THERMAL COMPRESSION BONDING OF SEMICONDUCTOR CHIPS

APPARATUS AND METHODS FOR FORMING WIRE BONDS

Wire bonding and wire bonding method

Bonding apparatus and method

Vertical ball grid array integrated circuit package