in the upper part of the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75725in the upper part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 11,791,223
- Issue date Oct 17, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Micro-component transfer head, micro-component transfer device, and...
- Patent number 11,600,508
- Issue date Mar 7, 2023
- PlayNitride Display Co., Ltd.
- Yu-Chu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device transfer head assembly
- Patent number 11,552,046
- Issue date Jan 10, 2023
- Apple Inc.
- Andreas Bibi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus
- Patent number 11,482,505
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,101,405
- Issue date Aug 24, 2021
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of mounting conductive ball
- Patent number 10,804,240
- Issue date Oct 13, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer bonding apparatus and wafer bonding system including the same
- Patent number 10,639,875
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Tae-yeong Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Micro device transfer head heater assembly and method of transferri...
- Patent number 10,607,961
- Issue date Mar 31, 2020
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 10,593,832
- Issue date Mar 17, 2020
- Apple Inc.
- Kelly McGroddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,411,210
- Issue date Sep 10, 2019
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device transfer head heater assembly and method of transferri...
- Patent number 10,121,864
- Issue date Nov 6, 2018
- Apple Inc.
- Andreas Bibl
- B32 - LAYERED PRODUCTS
Information Patent Grant
Micro device transfer system with pivot mount
- Patent number 10,043,776
- Issue date Aug 7, 2018
- Apple Inc.
- Dariusz Golda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 10,022,859
- Issue date Jul 17, 2018
- Apple Inc.
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Transfer head array and transferring method
- Patent number 9,969,078
- Issue date May 15, 2018
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 9,865,832
- Issue date Jan 9, 2018
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring and bonding an array of micro devices
- Patent number 9,773,750
- Issue date Sep 26, 2017
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a micro device transfer head
- Patent number 9,620,478
- Issue date Apr 11, 2017
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device transfer head heater assembly and method of transferri...
- Patent number 9,463,613
- Issue date Oct 11, 2016
- Apple Inc.
- Andreas Bibl
- B32 - LAYERED PRODUCTS
Information Patent Grant
Micro device transfer system with pivot mount
- Patent number 9,391,042
- Issue date Jul 12, 2016
- Apple Inc.
- Dariusz Golda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 9,308,649
- Issue date Apr 12, 2016
- LuxVue Techonology Corporation
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of fabricating a light emitting diode display with integrate...
- Patent number 9,252,375
- Issue date Feb 2, 2016
- LuxVue Technology Corporation
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20240014079
- Publication date Jan 11, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MICRO DEVICE TRANSFER HEAD ASSEMBLY
- Publication number 20230120136
- Publication date Apr 20, 2023
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
MICRO-COMPONENT TRANSFER HEAD, MICRO-COMPONENT TRANSFER DEVICE, AND...
- Publication number 20210151341
- Publication date May 20, 2021
- Yu-Chu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...
- Publication number 20200312811
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE TRANSFER HEAD ASSEMBLY
- Publication number 20200219840
- Publication date Jul 9, 2020
- Apple Inc.
- Andreas Bibl
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20200168580
- Publication date May 28, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALL
- Publication number 20200144220
- Publication date May 7, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRI...
- Publication number 20190096846
- Publication date Mar 28, 2019
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20180102492
- Publication date Apr 12, 2018
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT
- Publication number 20160293566
- Publication date Oct 6, 2016
- Apple Inc.
- Dariusz Golda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRI...
- Publication number 20140290867
- Publication date Oct 2, 2014
- Andreas Bibl
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATE...
- Publication number 20140267683
- Publication date Sep 18, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mass Transfer Tool Manipulator Assembly
- Publication number 20140241843
- Publication date Aug 28, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT
- Publication number 20140169924
- Publication date Jun 19, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Dariusz Golda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY
- Publication number 20140159067
- Publication date Jun 12, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES
- Publication number 20130210194
- Publication date Aug 15, 2013
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRI...
- Publication number 20130126098
- Publication date May 23, 2013
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- B32 - LAYERED PRODUCTS
Information Patent Application
MICRO DEVICE TRANSFER HEAD
- Publication number 20130127020
- Publication date May 23, 2013
- Andreas Bibl
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FABRICATING A MICRO DEVICE TRANSFER HEAD
- Publication number 20130130416
- Publication date May 23, 2013
- Andreas Bibl
- B32 - LAYERED PRODUCTS
Information Patent Application
Methods and Apparatus For Alignment In Flip Chip Bonding
- Publication number 20130095607
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Chung Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method, bonding stage and electronic component packaging ap...
- Publication number 20040063251
- Publication date Apr 1, 2004
- Sumitomo Osaka Cement Co., Ltd.
- Takeshi Ootsuka
- H01 - BASIC ELECTRIC ELEMENTS

in the upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED with internally confined current injection area

Substrate bonding apparatus and substrate bonding method

Light emitting diode display with redundancy scheme

Micro-component transfer head, micro-component transfer device, and...

Micro device transfer head assembly

Chip bonding apparatus

Light emitting diode display with redundancy scheme

Method for bonding substrates

LED with internally confined current injection area

Light emitting diode display with redundancy scheme

Method for transferring micro device

Bonding system

Method of mounting conductive ball

Wafer bonding apparatus and wafer bonding system including the same

Micro device transfer head heater assembly and method of transferri...

LED with internally confined current injection area

Method for bonding substrates together, and substrate bonding device

Light emitting diode display with redundancy scheme

Micro device transfer head heater assembly and method of transferri...

Micro device transfer system with pivot mount

Mass transfer tool manipulator assembly

Transfer head array and transferring method

Light emitting diode display with redundancy scheme

Method for bonding substrates

Method of transferring and bonding an array of micro devices

Method of fabricating a micro device transfer head

Micro device transfer head heater assembly and method of transferri...

Micro device transfer system with pivot mount

Mass transfer tool manipulator assembly

Method of fabricating a light emitting diode display with integrate...

Patents Applicationslast 30 patents

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

MICRO DEVICE TRANSFER HEAD ASSEMBLY

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

APPARATUS AND METHOD FOR BONDING SUBSTRATES

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

MICRO-COMPONENT TRANSFER HEAD, MICRO-COMPONENT TRANSFER DEVICE, AND...

CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...

MICRO DEVICE TRANSFER HEAD ASSEMBLY

APPARATUS AND METHOD FOR BONDING SUBSTRATES

METHOD OF MOUNTING CONDUCTIVE BALL

MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRI...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT

MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRI...

METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATE...

Mass Transfer Tool Manipulator Assembly

MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT

ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY

METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES

MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRI...

MICRO DEVICE TRANSFER HEAD

METHOD OF FABRICATING A MICRO DEVICE TRANSFER HEAD

Methods and Apparatus For Alignment In Flip Chip Bonding

Bonding method, bonding stage and electronic component packaging ap...