in the upper part of the bonding apparatus

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H01L2224/78745

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78745in the upper part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding device
- Patent number 9,437,571
- Issue date Sep 6, 2016
- Shibuya Kogyo Co., Ltd.
- Hiroyuki Yasuyoshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE
- Publication number 20140170812
- Publication date Jun 19, 2014
- SK HYNIX INC.
- Cheol Ho JOH
- H01 - BASIC ELECTRIC ELEMENTS