in the upper part of the bonding apparatus

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H01L2224/78705

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78705in the upper part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding tool including a wedge tool
- Patent number 11,121,114
- Issue date Sep 14, 2021
- Fuji Electric Co., Ltd.
- Takanori Sugiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Capillary jig for wire bonding and method of installing a capillary
- Patent number 10,679,962
- Issue date Jun 9, 2020
- Texas Instruments Incorporated
- Mohd Azri Hashim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible window clamp
- Patent number 10,147,700
- Issue date Dec 4, 2018
- Carsem (M) Sdn. Bhd.
- Wong Chee Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,754,865
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Takanori Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package without substrate and method of manufacturing...
- Patent number 6,770,959
- Issue date Aug 3, 2004
- Silconware Precision Industries Co., Ltd.
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WEDGE TOOL AND WEDGE BONDING METHOD
- Publication number 20190088616
- Publication date Mar 21, 2019
- Fuji Electric Co., Ltd.
- Takanori SUGIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capillary Jig For Wire Bonding And Method Of Installing A Capillary
- Publication number 20170229419
- Publication date Aug 10, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Mohd Azri Hashim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...
- Publication number 20170062381
- Publication date Mar 2, 2017
- Kazuya IKOMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140374890
- Publication date Dec 25, 2014
- Renesas Electronics Corporation
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package without substrate and method of manufacturing...
- Publication number 20020074672
- Publication date Jun 20, 2002
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

in the upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding tool including a wedge tool

Curtain airbag device mounting structure and curtain airbag deploym...

Capillary jig for wire bonding and method of installing a capillary

Flexible window clamp

Method for manufacturing wire bonding structure, wire bonding struc...

Semiconductor device and method for manufacturing the same

Semiconductor package without substrate and method of manufacturing...

Patents Applicationslast 30 patents

WEDGE TOOL AND WEDGE BONDING METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Capillary Jig For Wire Bonding And Method Of Installing A Capillary

METHOD FOR MANUFACTURING WIRE BONDING STRUCTURE, WIRE BONDING STRUC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor package without substrate and method of manufacturing...