in the upper part of the bonding apparatus

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75735in the upper part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adsorption device, method for making same, and transferring system...
- Patent number 11,498,779
- Issue date Nov 15, 2022
- Century Technology (Shenzhen) Corporation Limited
- Po-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly apparatus for assembling semiconductor light emitting diod...
- Patent number 11,502,055
- Issue date Nov 15, 2022
- LG Electronics Inc.
- Hyunwoo Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring micro device
- Patent number 10,937,674
- Issue date Mar 2, 2021
- MIKRO MESA TECHNOLOGY CO., LTD.
- Li-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,859,246
- Issue date Jan 2, 2018
- EV Group E. Thallner GmbH
- Andreas Fehkuhrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UV-curable anisotropic conductive adhesive
- Patent number 9,777,197
- Issue date Oct 3, 2017
- Sunray Scientific, LLC
- S. Kumar Khanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools for handling magnetic articles
- Patent number 4,437,362
- Issue date Mar 20, 1984
- Western Electric Co., Inc.
- Jerry C. Hurst
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING APPARATUS
- Publication number 20240186282
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Sumin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220293551
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Yuuki KURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADSORPTION DEVICE, METHOD FOR MAKING SAME, AND TRANSFERRING SYSTEM...
- Publication number 20210002087
- Publication date Jan 7, 2021
- Century Technology (Shenzhen) Corporation Limited
- PO-LIANG CHEN
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
ASSEMBLY APPARATUS FOR ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIOD...
- Publication number 20200279826
- Publication date Sep 3, 2020
- LG ELECTRONICS INC.
- Hyunwoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DIE PICK UP APPARATUS AND METHOD THEREOF
- Publication number 20080160725
- Publication date Jul 3, 2008
- Samsung Electronics Co., Ltd.
- Hak-Kyoon BYUN
- H01 - BASIC ELECTRIC ELEMENTS