in the upper part of the bonding apparatus

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H01L2224/75702

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75702in the upper part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die bonding apparatus and manufacturing method for semiconductor de...
- Patent number 12,068,275
- Issue date Aug 20, 2024
- FASFORD TECHNOLOGY CO., LTD.
- Ryo Saegusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 11,823,938
- Issue date Nov 21, 2023
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bond head apparatus with die holder motion table
- Patent number 11,776,930
- Issue date Oct 3, 2023
- ASMPT SINGAPORE PTE. LTD.
- Chung Sheung Yung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,735,689
- Issue date Aug 22, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach systems including a verification substrate
- Patent number 11,574,832
- Issue date Feb 7, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Employing deformable contacts and pre-applied underfill for bonding...
- Patent number 11,575,069
- Issue date Feb 7, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- G02 - OPTICS
Information Patent Grant
Curing pre-applied and plasma-etched underfill via a laser
- Patent number 11,563,142
- Issue date Jan 24, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively bonding light-emitting devices via a pulsed laser
- Patent number 11,557,692
- Issue date Jan 17, 2023
- Meta Platforms Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus
- Patent number 11,482,505
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mechanism, chuck device, and bonder
- Patent number 11,462,428
- Issue date Oct 4, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and its process for curing post-applied underfill ma...
- Patent number 11,404,600
- Issue date Aug 2, 2022
- Meta Platforms Technologies, LLC
- Jeb Wu
- G02 - OPTICS
Information Patent Grant
Dielectric-dielectric and metallization bonding via plasma activati...
- Patent number 11,374,148
- Issue date Jun 28, 2022
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for reworking flip chip components
- Patent number 11,330,746
- Issue date May 10, 2022
- Raytheon Company
- James A. Robbins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bond head assemblies including reflective optical elements, related...
- Patent number 11,031,367
- Issue date Jun 8, 2021
- Kulicke and Soffa Industries, In.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,031,368
- Issue date Jun 8, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hitoshi Mukohjima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System for adjusting relative positions between components of a bon...
- Patent number 10,882,298
- Issue date Jan 5, 2021
- ASM Technology Singapore Pte. Ltd.
- Shui Cheung Woo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting conductive ball
- Patent number 10,804,240
- Issue date Oct 13, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging system and manufacturing apparatus
- Patent number 10,573,621
- Issue date Feb 25, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Akio Endo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component handling unit
- Patent number 10,497,590
- Issue date Dec 3, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacking semiconductor chips in a semiconductor package
- Patent number 10,483,150
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Gun-Ah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed three-dimensional (3D) functional part and method of making
- Patent number 10,462,907
- Issue date Oct 29, 2019
- President and Fellows of Harvard College
- Jennifer A. Lewis
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Press fitting head and semiconductor manufacturing apparatus using...
- Patent number 10,388,625
- Issue date Aug 20, 2019
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...
- Publication number 20240243094
- Publication date Jul 18, 2024
- Canon Kabushiki Kaisha
- MASAHIRO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240021570
- Publication date Jan 18, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jiho JOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230378121
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Yuhei Matsuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20230268313
- Publication date Aug 24, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE
- Publication number 20230238353
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20230148420
- Publication date May 11, 2023
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
- Publication number 20220052017
- Publication date Feb 17, 2022
- Fasford Technology Co., Ltd.
- Ryo SAEGUSA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Actuator for a Bonding Head
- Publication number 20210272925
- Publication date Sep 2, 2021
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE
- Publication number 20210183809
- Publication date Jun 17, 2021
- ASM Technology Singapore Pte Ltd
- Chung Sheung YUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER
- Publication number 20200395519
- Publication date Dec 17, 2020
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER
- Publication number 20200395521
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...
- Publication number 20200395520
- Publication date Dec 17, 2020
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...
- Publication number 20200312811
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOUNTING CONDUCTIVE BALL
- Publication number 20200144220
- Publication date May 7, 2020
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...
- Publication number 20200075381
- Publication date Mar 5, 2020
- Assembleon B.V.
- Alain De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20190348393
- Publication date Nov 14, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- HITOSHI MUKOHJIMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALIGNMENT MECHANISM, CHUCK DEVICE, AND BONDER
- Publication number 20190333798
- Publication date Oct 31, 2019
- TAZMO CO., LTD.
- Masaaki TANABE
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20190027462
- Publication date Jan 24, 2019
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HANDLING UNIT
- Publication number 20190006211
- Publication date Jan 3, 2019
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
- Publication number 20180096962
- Publication date Apr 5, 2018
- EV GROUP E. THALLNER GMBH
- Andreas FEHKUHRER
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20170148759
- Publication date May 25, 2017
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20160079199
- Publication date Mar 17, 2016
- Seung-dae SEOK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pick-and-Place Tool for Packaging Process
- Publication number 20150333033
- Publication date Nov 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES
- Publication number 20150115479
- Publication date Apr 30, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Wei Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE MOUNTING APPARATUS
- Publication number 20140290047
- Publication date Oct 2, 2014
- Toru Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEMS FOR SEMICONDUCTOR CHIP PICK & TRANSFER AND BONDING
- Publication number 20140154037
- Publication date Jun 5, 2014
- ORION SYSTEMS INTEGRATION PTE LTD
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adjustable Pick-up Head and Method for Manufacturing a Device
- Publication number 20140123454
- Publication date May 8, 2014
- INFINEON TECHNOLOGIES AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS

in the upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die bonding apparatus and manufacturing method for semiconductor de...

Mounting device and mounting method

Die bond head apparatus with die holder motion table

Dielectric-dielectric and metallization bonding via plasma activati...

Apparatus, system, and method for handling aligned wafer pairs

Die attach systems including a verification substrate

Employing deformable contacts and pre-applied underfill for bonding...

Curing pre-applied and plasma-etched underfill via a laser

Selectively bonding light-emitting devices via a pulsed laser

Method and apparatus for embedding semiconductor devices

Chip bonding apparatus

Alignment mechanism, chuck device, and bonder

Display device and its process for curing post-applied underfill ma...

Dielectric-dielectric and metallization bonding via plasma activati...

Device and method for reworking flip chip components

System and related techniques for handling aligned substrate pairs

Device and method for positioning first object in relation to secon...

Bond head assemblies including reflective optical elements, related...

Bonding apparatus

System for adjusting relative positions between components of a bon...

Bonding system

Apparatus, system, and method for handling aligned wafer pairs

Method of mounting conductive ball

Method for bonding substrates together, and substrate bonding device

Imaging system and manufacturing apparatus

Electronic-component mounting apparatus

Electronic component handling unit

Apparatus for stacking semiconductor chips in a semiconductor package

Printed three-dimensional (3D) functional part and method of making

Press fitting head and semiconductor manufacturing apparatus using...

Patents Applicationslast 30 patents

BONDING METHOD, BONDING APPARATUS, ARTICLE MANUFACTURING METHOD, DE...

BONDING APPARATUS

BONDING APPARATUS AND BONDING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

A METHOD OF FORMING A BONDED SEMICONDUCTOR STRUCTURE

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

Die Bonding Apparatus and Manufacturing Method for Semiconductor De...

Actuator for a Bonding Head

DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

CURING PRE-APPLIED AND PLASMA-ETCHED UNDERFILL VIA A LASER

SELECTIVELY BONDING LIGHT-EMITTING DEVICES VIA A PULSED LASER

DIELECTRIC-DIELECTRIC AND METALLIZATION BONDING VIA PLASMA ACTIVATI...

CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...

METHOD OF MOUNTING CONDUCTIVE BALL

DIE ATTACH SYSTEMS, AND METHODS FOR INTEGRATED ACCURACY VERIFICATIO...

BONDING APPARATUS

ALIGNMENT MECHANISM, CHUCK DEVICE, AND BONDER

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

ELECTRONIC COMPONENT HANDLING UNIT

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

BONDING APPARATUS AND BONDING METHOD

APPARATUS FOR BONDING SEMICONDUCTOR CHIPS

Pick-and-Place Tool for Packaging Process

SEMICONDUCTOR DIE LAMINATING DEVICE WITH INDEPENDENT DRIVES

WORKPIECE MOUNTING APPARATUS

METHOD AND SYSTEMS FOR SEMICONDUCTOR CHIP PICK & TRANSFER AND BONDING

Adjustable Pick-up Head and Method for Manufacturing a Device