Membership
Tour
Register
Log in
in the upper part of the bonding apparatus
Follow
Industry
CPC
H01L2224/79352
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/79352
in the upper part of the bonding apparatus
Industries
Overview
Organizations
People
Information
Impact
No activities in the last 12 months
CPC
H01L2224/79352
