in the upper part of the bonding apparatus

Industry

CPC
H01L2224/75502

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75502in the upper part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing device and manufacturing method
- Patent number 12,176,317
- Issue date Dec 24, 2024
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip bonding apparatus and method of manufacturing semiconductor de...
- Patent number 11,837,573
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head including a thermal compensator, die bonding apparatus...
- Patent number 11,626,381
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,545,462
- Issue date Jan 3, 2023
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit film bonding apparatus and method of bonding flexi...
- Patent number 11,515,283
- Issue date Nov 29, 2022
- Samsung Display Co., Ltd.
- Chung-Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus including a heater and a cooling flow path used f...
- Patent number 11,508,688
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,508,689
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering press and method for sintering electronic components on a...
- Patent number 11,380,647
- Issue date Jul 5, 2022
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Stack tool for reflow and stack apparatus having the same
- Patent number 10,833,046
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Tea Geon Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond head cooling apparatus
- Patent number 10,622,329
- Issue date Apr 14, 2020
- ASM Technology Singapore Pte. Ltd.
- Yi Kei Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heater for bonding apparatus and method of cooling the same
- Patent number 10,350,692
- Issue date Jul 16, 2019
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing apparatus and method
- Patent number 10,347,603
- Issue date Jul 9, 2019
- TOSHIBA MEMORY CORPORATION
- Masayuki Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomization mechanism for cooling a bond head
- Patent number 10,312,214
- Issue date Jun 4, 2019
- ASM Technology Singapore Pte. Ltd.
- Yi Kei Law
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for contactless transfer and soldering of chip...
- Patent number 10,304,709
- Issue date May 28, 2019
- Nederlandse Organisatie voor toegepast-natuurwetenschappelikj onderzoek TNO
- Rob Jacob Hendriks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid cooling system for a bond head heater
- Patent number 10,192,847
- Issue date Jan 29, 2019
- ASM Technology Singapore Pte. Ltd.
- Lu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,943,931
- Issue date Apr 17, 2018
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,780,066
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonding process cooling manifold
- Patent number 9,748,199
- Issue date Aug 29, 2017
- Intel Corporation
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding systems and methods of operating the same
- Patent number 9,659,902
- Issue date May 23, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head and die bonding apparatus having the same
- Patent number 9,620,476
- Issue date Apr 11, 2017
- Semes Co., Ltd.
- Hang Lim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and method
- Patent number 9,603,262
- Issue date Mar 21, 2017
- Shinkawa Ltd.
- Koji Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond head assemblies, thermocompression bonding systems and methods...
- Patent number 9,576,928
- Issue date Feb 21, 2017
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Flip chip bonder and flip chip bonding method
- Patent number 9,536,856
- Issue date Jan 3, 2017
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING HEAD
- Publication number 20240063170
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Shinsuke FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20230238351
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210398935
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Junhyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...
- Publication number 20210098415
- Publication date Apr 1, 2021
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...
- Publication number 20200373276
- Publication date Nov 26, 2020
- SAMSUNG DISPLAY CO., LTD.
- Chung-Seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND MOUNTING SYSTEM
- Publication number 20200235070
- Publication date Jul 23, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...
- Publication number 20190326250
- Publication date Oct 24, 2019
- AMX - AUTOMATRIX S.R.L.
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TOOL FOR REFLOW AND STACK APPARATUS HAVING THE SAME
- Publication number 20190252343
- Publication date Aug 15, 2019
- Samsung Electronics Co., Ltd.
- Tea Geon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20190027462
- Publication date Jan 24, 2019
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIZATION MECHANISM FOR COOLING A BOND HEAD
- Publication number 20180068973
- Publication date Mar 8, 2018
- ASM Technology Singapore Pte Ltd
- Yi Kei LAW
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT
- Publication number 20170069592
- Publication date Mar 9, 2017
- Shindengen Electric Manufacturing Co., Ltd.
- Ryo MATSUBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20170014957
- Publication date Jan 19, 2017
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD
- Publication number 20160336291
- Publication date Nov 17, 2016
- Kabushiki Kaisha Toshiba
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD ASSEMBLIES, THERMOCOMPRESSION BONDING SYSTEMS AND METHODS...
- Publication number 20160254245
- Publication date Sep 1, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAPID COOLING SYSTEM FOR A BOND HEAD HEATER
- Publication number 20150364440
- Publication date Dec 17, 2015
- Lu MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD
- Publication number 20150173209
- Publication date Jun 18, 2015
- Hemanth Dhavaleswarapu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING HEAD AND DIE BONDING APPARATUS HAVING THE SAME
- Publication number 20150129135
- Publication date May 14, 2015
- SEMES CO., LTD.
- Hang Lim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ASSEMBLY FOR INTERPOSER BOW
- Publication number 20140209666
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Head With A Heatable And Coolable Suction Member
- Publication number 20140202636
- Publication date Jul 24, 2014
- Besi Switzerland AG
- Andreas Mayr
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BONDING HEAD
- Publication number 20140001162
- Publication date Jan 2, 2014
- Eiji TANAKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS
- Publication number 20130340943
- Publication date Dec 26, 2013
- Tadashi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20130299133
- Publication date Nov 14, 2013
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD
- Publication number 20130153644
- Publication date Jun 20, 2013
- SHINKAWA LTD.
- Koji Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AN...
- Publication number 20120319253
- Publication date Dec 20, 2012
- Toyota Jidosha Kabushiki Kaisha
- Hiroki Mizuno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Joint Reflow Process for Reducing Packaging Failure Rate
- Publication number 20120175403
- Publication date Jul 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Compressive Bond Head
- Publication number 20120088362
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip bonding method
- Publication number 20020056740
- Publication date May 16, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Eiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS

in the upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device manufacturing device and manufacturing method

Method of manufacturing a semiconductor package

Chip bonding apparatus and method of manufacturing semiconductor de...

Bonding head including a thermal compensator, die bonding apparatus...

Mounting apparatus and mounting system

Flexible circuit film bonding apparatus and method of bonding flexi...

Bonding apparatus including a heater and a cooling flow path used f...

Mounting apparatus and mounting system

Sintering press and method for sintering electronic components on a...

Bonding system

Stack tool for reflow and stack apparatus having the same

Bond head cooling apparatus

Heater for bonding apparatus and method of cooling the same

Semiconductor device manufacturing apparatus and method

Atomization mechanism for cooling a bond head

Apparatus and method for contactless transfer and soldering of chip...

Rapid cooling system for a bond head heater

Solder bump stretching method

Apparatus and method for manufacturing semiconductor device

High performance transient uniform cooling solution for thermal com...

Electronic apparatus and method for fabricating the same

Thermocompression bonding systems and methods of operating the same

Electronic apparatus and method for fabricating the same

Thermal compression bonding process cooling manifold

Thermocompression bonding systems and methods of operating the same

Bonding head and die bonding apparatus having the same

Electronic component mounting apparatus and method

Bond head assemblies, thermocompression bonding systems and methods...

Reduced expansion thermal compression bonding process bond head

Flip chip bonder and flip chip bonding method

Patents Applicationslast 30 patents

MOUNTING HEAD

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

CHIP BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...

FLEXIBLE CIRCUIT FILM BONDING APPARATUS AND METHOD OF BONDING FLEXI...

MOUNTING APPARATUS AND MOUNTING SYSTEM

SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...

STACK TOOL FOR REFLOW AND STACK APPARATUS HAVING THE SAME

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

ATOMIZATION MECHANISM FOR COOLING A BOND HEAD

TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD

BOND HEAD ASSEMBLIES, THERMOCOMPRESSION BONDING SYSTEMS AND METHODS...

RAPID COOLING SYSTEM FOR A BOND HEAD HEATER

THERMAL COMPRESSION BONDING PROCESS COOLING MANIFOLD

BONDING HEAD AND DIE BONDING APPARATUS HAVING THE SAME

3D ASSEMBLY FOR INTERPOSER BOW

Bonding Head With A Heatable And Coolable Suction Member

BONDING HEAD

BONDING APPARATUS

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD

SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AN...

Solder Joint Reflow Process for Reducing Packaging Failure Rate

Thermal Compressive Bond Head

Flip chip bonding method