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in the upper part of the bonding apparatus

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  • H01L2224/78349
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78349in the upper part of the bonding apparatus
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
    • Publication number 20200238433
    • Publication date Jul 30, 2020
    • KAIJO CORPORATION
    • Yuji KOMAGINO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
    • Publication number 20190375043
    • Publication date Dec 12, 2019
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Dominick A. DeAngelis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT...
    • Publication number 20190319005
    • Publication date Oct 17, 2019
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Dominick A. DeAngelis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
    • Publication number 20180200828
    • Publication date Jul 19, 2018
    • KULICKE AND SOFFA INDUSTRIES, INC.
    • Dominick A. DeAngelis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING DEVICE
    • Publication number 20180061803
    • Publication date Mar 1, 2018
    • KAIJO CORPORATION
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
    • Publication number 20170209956
    • Publication date Jul 27, 2017
    • ORTHODYNE ELECTRONICS CORPORATION
    • Dominick A. DeAngelis
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING DEVICE
    • Publication number 20170005065
    • Publication date Jan 5, 2017
    • KAIJO CORPORATION
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING DEVICE
    • Publication number 20170005064
    • Publication date Jan 5, 2017
    • KAIJO CORPORATION
    • Akio Sugito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING APPARATUS
    • Publication number 20140305996
    • Publication date Oct 16, 2014
    • KAIJO CORPORATION
    • Shuichi Takanami
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WATERFALL WIRE BONDING
    • Publication number 20140183727
    • Publication date Jul 3, 2014
    • SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    • Zhong Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TRANSDUCER OF AN ULTRASONIC BONDER
    • Publication number 20110259939
    • Publication date Oct 27, 2011
    • F & K Delvotec Bondtechnik GmbH
    • Farhad Farassat
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR