TREA

in the upper part of the bonding apparatus

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  • CPC
  • H01L2224/78282
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78282in the upper part of the bonding apparatus
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Patents Applicationslast 30 patents

  • Information Patent Application

    APPARATUS AND METHOD FOR WIRE PREPARATION
    • Publication number 20190372294
    • Publication date Dec 5, 2019
    • The Charles Stark Draper Laboratory, Inc.
    • Mitchell W. Meinhold
    • H01 - BASIC ELECTRIC ELEMENTS