in the upper part of the bonding apparatus

Industry

CPC
H01L2224/75282

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75282in the upper part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Uniform pressure gang bonding method
- Patent number 11,637,082
- Issue date Apr 25, 2023
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for uniform pressure gang bonding
- Patent number 11,152,328
- Issue date Oct 19, 2021
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 10,022,859
- Issue date Jul 17, 2018
- Apple Inc.
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of transferring and bonding an array of micro devices
- Patent number 9,773,750
- Issue date Sep 26, 2017
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 9,308,649
- Issue date Apr 12, 2016
- LuxVue Techonology Corporation
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Active matrix emissive micro LED display
- Patent number 9,159,700
- Issue date Oct 13, 2015
- LuxVue Technology Corporation
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING HEAD
- Publication number 20240063170
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Shinsuke FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mass Transfer Tool Manipulator Assembly
- Publication number 20140241843
- Publication date Aug 28, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Bonding Head With A Heatable And Coolable Suction Member
- Publication number 20140202636
- Publication date Jul 24, 2014
- Besi Switzerland AG
- Andreas Mayr
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY
- Publication number 20140159067
- Publication date Jun 12, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20130340943
- Publication date Dec 26, 2013
- Tadashi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES
- Publication number 20130210194
- Publication date Aug 15, 2013
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME
- Publication number 20090126877
- Publication date May 21, 2009
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Kazutaka Furuta
- B30 - PRESSES

in the upper part of the bonding apparatus

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Uniform pressure gang bonding method

System and method for uniform pressure gang bonding

Method for producing an integral join and automatic placement machine

Mass transfer tool manipulator assembly

Thermo-compression bonding system, subsystems, and methods of use

Method of transferring and bonding an array of micro devices

Mass transfer tool manipulator assembly

Active matrix emissive micro LED display

Patents Applicationslast 30 patents

MOUNTING HEAD

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

Mass Transfer Tool Manipulator Assembly

Bonding Head With A Heatable And Coolable Suction Member

ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY

BONDING APPARATUS

METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES

THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME