in the upper part of the bonding apparatus

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H01L2224/78266

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78266in the upper part of the bonding apparatus

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Patents Grantslast 30 patents

Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wire bonding method and wire bonding apparatus
- Patent number 6,564,989
- Issue date May 20, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hideyuki Arakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wire bonding method and wire bonding apparatus
- Publication number 20020027151
- Publication date Mar 7, 2002
- Hideyuki Arakawa
- H01 - BASIC ELECTRIC ELEMENTS