in the upper part of the bonding apparatus

Follow

Industry

CPC
H01L2224/78735

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78735in the upper part of the bonding apparatus

Industries

Patents Grantslast 30 patents

Information Patent Grant
Driving system having reduced vibration transmission
- Patent number 11,205,937
- Issue date Dec 21, 2021
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
DRIVING SYSTEM HAVING REDUCED VIBRATION TRANSMISSION
- Publication number 20200028407
- Publication date Jan 23, 2020
- ASM Technology Singapore Pte Ltd
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS