TREA

in the upper part of the bonding apparatus

Follow

Industry

  • CPC
  • H01L2224/78502
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78502in the upper part of the bonding apparatus
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    APPARATUS AND METHOD FOR WIRE PREPARATION
    • Publication number 20190372294
    • Publication date Dec 5, 2019
    • The Charles Stark Draper Laboratory, Inc.
    • Mitchell W. Meinhold
    • H01 - BASIC ELECTRIC ELEMENTS