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H01L2224/32052

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32052in top view

Industries

Patents Grantslast 30 patents

Information Patent Grant
High reliability semiconductor devices and methods of fabricating t...
- Patent number 11,488,923
- Issue date Nov 1, 2022
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having adhesive layer surrounded dam structure
- Patent number 10,867,955
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Qubit die attachment using preforms
- Patent number 10,256,206
- Issue date Apr 9, 2019
- Intel Corporation
- Javier A. Falcon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 9,795,036
- Issue date Oct 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate composite, method and device for bonding of substrates
- Patent number 9,682,539
- Issue date Jun 20, 2017
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip scale package with re-workable underfill
- Patent number 9,240,387
- Issue date Jan 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,224,705
- Issue date Dec 29, 2015
- Seiko Epson Corporation
- Shigehisa Tajimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,922,026
- Issue date Dec 30, 2014
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying liquid material, device therefor, and program t...
- Patent number 8,821,959
- Issue date Sep 2, 2014
- Musashi Engineering, Inc.
- Kazumasa Ikushima
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 8,778,798
- Issue date Jul 15, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with heavily doped region and fabrication method thereof
- Patent number 8,748,949
- Issue date Jun 10, 2014
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 8,710,680
- Issue date Apr 29, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package with heavily doped regions and fabrication method thereof
- Patent number 8,497,534
- Issue date Jul 30, 2013
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced pad design for solder attach devices
- Patent number 8,163,643
- Issue date Apr 24, 2012
- Linear Technology Corporation
- Maurice O. Othieno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 8,012,801
- Issue date Sep 6, 2011
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid image pickup unit and camera module
- Patent number 7,782,388
- Issue date Aug 24, 2010
- Konica Minolta Opto, INC
- Takuo Nishikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 7,759,162
- Issue date Jul 20, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package equipped with semiconductor chip and method for producing same
- Patent number 7,649,267
- Issue date Jan 19, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLICING DISPLAY PANEL
- Publication number 20240170465
- Publication date May 23, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Hejing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20230019230
- Publication date Jan 19, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...
- Publication number 20200373270
- Publication date Nov 26, 2020
- Cree, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200105705
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUBIT DIE ATTACHMENT USING PREFORMS
- Publication number 20190043822
- Publication date Feb 7, 2019
- Intel Corporation
- Javier A. Falcon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140291836
- Publication date Oct 2, 2014
- SEIKO EPSON CORPORATION
- Shigehisa TAJIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140193950
- Publication date Jul 10, 2014
- Xintec Inc.
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF STACKING CHIPS AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130249042
- Publication date Sep 26, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Chip Scale Package with Re-Workable Underfill
- Publication number 20130093084
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20120280389
- Publication date Nov 8, 2012
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110233782
- Publication date Sep 29, 2011
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110042804
- Publication date Feb 24, 2011
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING LIQUID MATERIAL, DEVICE THEREFOR, AND PROGRAM T...
- Publication number 20110042478
- Publication date Feb 24, 2011
- MUSASHI ENGINEERING, INC.
- Kazumasa Ikushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110042807
- Publication date Feb 24, 2011
- Chien-Hung Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY
- Publication number 20100148376
- Publication date Jun 17, 2010
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Equipped with Semiconductor Chip and Method for Producing Same
- Publication number 20080265437
- Publication date Oct 30, 2008
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip Chip Mounting Process and Flip Chip Assembly
- Publication number 20080017995
- Publication date Jan 24, 2008
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solid image pickup unit and camera module
- Publication number 20070047098
- Publication date Mar 1, 2007
- KONICA MINOLTA OPTO, INC.
- Takuo Nishikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

in top view

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High reliability semiconductor devices and methods of fabricating t...

Package structure having adhesive layer surrounded dam structure

Mounting structure and method for manufacturing same

Qubit die attachment using preforms

Mounting structure and method for manufacturing same

Substrate composite, method and device for bonding of substrates

Wafer-level chip scale package with re-workable underfill

Semiconductor device

Chip package and fabrication method thereof

Method for applying liquid material, device therefor, and program t...

Electronic device package and fabrication method thereof

Chip package with heavily doped region and fabrication method thereof

Electronic device package and fabrication method thereof

Electronic element unit and reinforcing adhesive agent

Chip package with heavily doped regions and fabrication method thereof

Enhanced pad design for solder attach devices

Flip chip mounting process and flip chip assembly

Solid image pickup unit and camera module

Flip chip mounting process and flip chip assembly

Package equipped with semiconductor chip and method for producing same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SPLICING DISPLAY PANEL

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

HIGH RELIABILITY SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING T...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

QUBIT DIE ATTACHMENT USING PREFORMS

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

STRUCTURE OF STACKING CHIPS AND METHOD FOR MANUFACTURING THE SAME

Wafer-Level Chip Scale Package with Re-Workable Underfill

CHIP PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF

METHOD FOR APPLYING LIQUID MATERIAL, DEVICE THEREFOR, AND PROGRAM T...

CHIP PACKAGE AND FABRICATION METHOD THEREOF

FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY

Package Equipped with Semiconductor Chip and Method for Producing Same

Flip Chip Mounting Process and Flip Chip Assembly

Solid image pickup unit and camera module